HiSilicon Kirin 810 vs Qualcomm Snapdragon 670

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Which processor is better? We compared HiSilicon Kirin 810 with Qualcomm Snapdragon 670. Compare, analyze the specifications. Find out their scores in popular benchmarks (AnTuTu 10, GeekBench 6 Single-Core, GeekBench 6 Multi-Core) and who is the winner?

CPU cores and architecture

Architecture	2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55	2x 2 GHz – Cortex-A75 (Kryo 360 Gold) 6x 1.7 GHz – Cortex-A55 (Kryo 360 Silver)
Number of cores	8	8
Instruction Set	ARMv8.2-A	ARMv8.2-A
Lithography	7 nm	10 nm
Number of transistors	6900 million
TDP	5 Watt	9 Watt
Neural Processing	Ascend D100 Lite, HUAWEI Da Vinci Architecture	Qualcomm Hexagon 685

Memory (RAM)

Max amount	up to 8 GB	up to 8 GB
Memory type	LPDDR4X	LPDDR4X
Memory frequency	2133 MHz	1866 MHz
Memory-bus	4x16 bit	2x16 bit

Storage

Storage specification

UFS 2.1

Graphics

GPU name	Mali-G52 MP6	Adreno 615
GPU Architecture	Bifrost	Adreno 600
GPU frequency	820 MHz	700 MHz
Execution units	6	2
Shaders	96	128
DirectX	12	12
OpenCL API	2.0	2.0
OpenGL API	ES 3.2	ES 3.2
Vulkan API	1.0	1.0

Camera, Video, Display

Max screen resolution		2560x1600
Max camera resolution	1x 48MP, 2x 20MP	1x 192MP, 2x 16MP
Max Video Capture	FullHD@30fps	4K@30fps
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC) VP8 VP9

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	0.6 Gbps	0.6 Gbps
Peak Upload Speed	0.15 Gbps	0.15 Gbps
Wi-Fi	6 (802.11ax)	5 (802.11ac)
Bluetooth	5.1	5.0
Satellite navigation	BeiDou GPS GLONASS	BeiDou GPS Galileo GLONASS QZSS SBAS