HiSilicon Kirin 810 vs Qualcomm Snapdragon 670
Which processor is better? We compared HiSilicon Kirin 810 with Qualcomm Snapdragon 670. Compare, analyze the specifications. Find out their scores in popular benchmarks (AnTuTu 10, GeekBench 6 Single-Core, GeekBench 6 Multi-Core) and who is the winner?
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2 GHz – Cortex-A75 (Kryo 360 Gold) 6x 1.7 GHz – Cortex-A55 (Kryo 360 Silver) |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 10 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 9 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | Qualcomm Hexagon 685 |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Adreno 615 |
GPU Architecture | Mali Bifrost | Qualcomm Adreno 600 |
GPU frequency | 820 MHz | 700 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 128 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2560x1600 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 192MP, 2x 16MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS SBAS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2018 Quarter 3 |
Partnumber | Hi6280 | SDM670 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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