Qualcomm Snapdragon 670
The Qualcomm Snapdragon 670 is a {total_cores} CPU It has 8 cores and was announced in 2018 Quarter 3. It has "big.LITTLE" cores-set: 2x Cortex-A75 (Kryo 360 Gold) (2 GHz), 6x Cortex-A55 (Kryo 360 Silver) (1.7 GHz). The processor is manufactured using a 10 nm process technology and supports UFS 2.1, 4G, LPDDR4X.

AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2 GHz – Cortex-A75 (Kryo 360 Gold) 6x 1.7 GHz – Cortex-A55 (Kryo 360 Silver) |
Number of cores | 8 |
Instruction Set | ARMv8.2-A |
Lithography | 10 nm |
TDP | 9 Watt |
Neural Processing | Qualcomm Hexagon 685 |
Memory (RAM)
Max amount | up to 8 GB |
Memory type | LPDDR4X |
Memory frequency | 1866 MHz |
Memory-bus | 2x16 bit |
Storage
Storage specification | UFS 2.1 |
Graphics
GPU name | Adreno 615 |
GPU Architecture | Qualcomm Adreno 600 |
GPU frequency | 700 MHz |
Execution units | 2 |
Shaders | 128 |
DirectX | 12 |
OpenCL API | 2.0 |
OpenGL API | ES 3.2 |
Vulkan API | 1.0 |
Camera, Video, Display
Max screen resolution | 2560x1600 |
Max camera resolution | 1x 192MP, 2x 16MP |
Max Video Capture | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes |
5G network | Yes |
Peak Download Speed | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps |
Wi-Fi | 5 (802.11ac) |
Bluetooth | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS SBAS |
Supplemental Information
Launch Date | 2018 Quarter 3 |
Partnumber | SDM670 |
Vertical Segment | Mobiles |
Positioning | Mid-end |
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