HiSilicon Kirin 810 vs MediaTek Dimensity 810

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The HiSilicon Kirin 810 and the MediaTek Dimensity 810 are both powerful processors designed for smartphones and other mobile devices. While they share similarities in terms of core architecture and instruction set, there are key differences between the two that set them apart.

In terms of CPU cores and architecture, the HiSilicon Kirin 810 is equipped with 2x Cortex-A76 cores clocked at 2.27 GHz and 6x Cortex-A55 cores clocked at 1.88 GHz. On the other hand, the MediaTek Dimensity 810 features 2x Cortex-A76 cores clocked at 2.4 GHz and 6x Cortex-A55 cores clocked at 2.0 GHz. This means that the MediaTek Dimensity 810 has slightly higher clock speeds for both core types, potentially leading to better overall performance.

Another difference lies in the lithography process used to manufacture the processors. The HiSilicon Kirin 810 is built using a 7 nm process, while the MediaTek Dimensity 810 utilizes a more advanced 6 nm process. A smaller lithography generally indicates better power efficiency and performance due to improved transistor density.

Speaking of transistors, the MediaTek Dimensity 810 boasts a higher number with 12000 million transistors compared to the HiSilicon Kirin 810's 6900 million transistors. This higher transistor count suggests that the MediaTek Dimensity 810 may be capable of handling more complex tasks and processing data more efficiently.

Power consumption is also a differentiating factor between the two processors. The HiSilicon Kirin 810 has a lower TDP (Thermal Design Power) of 5 Watts, while the MediaTek Dimensity 810 has a slightly higher TDP of 8 Watts. This could potentially mean that the HiSilicon Kirin 810 is more power-efficient, leading to longer battery life for devices powered by this processor.

Finally, the HiSilicon Kirin 810 comes with the Ascend D100 Lite for neural processing, utilizing the Huawei Da Vinci Architecture. On the other hand, the MediaTek Dimensity 810 features its own NPU (Neural Processing Unit).

In conclusion, both the HiSilicon Kirin 810 and the MediaTek Dimensity 810 offer impressive specifications and performance capabilities. However, the MediaTek Dimensity 810 takes a slight edge with higher clock speeds, smaller lithography, a higher transistor count, and its own NPU. Nevertheless, the choice between the two ultimately depends on the specific requirements and preferences of the user.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 6900 million 12000 million
TDP 5 Watt 8 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G52 MP6 Mali-G57 MP2
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 950 MHz
Execution units 6 2
Shaders 96 32
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 2x 16MP
Max Video Capture FullHD@30fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2019 Quarter 2 2021 Quarter 3
Partnumber Hi6280 MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Dimensity 810
356915

GeekBench 6 Single-Core

Score
Kirin 810
604
Dimensity 810
584

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Dimensity 810
1662