HiSilicon Kirin 810 vs MediaTek Dimensity 810
The HiSilicon Kirin 810 and the MediaTek Dimensity 810 are both powerful processors designed for smartphones and other mobile devices. While they share similarities in terms of core architecture and instruction set, there are key differences between the two that set them apart.
In terms of CPU cores and architecture, the HiSilicon Kirin 810 is equipped with 2x Cortex-A76 cores clocked at 2.27 GHz and 6x Cortex-A55 cores clocked at 1.88 GHz. On the other hand, the MediaTek Dimensity 810 features 2x Cortex-A76 cores clocked at 2.4 GHz and 6x Cortex-A55 cores clocked at 2.0 GHz. This means that the MediaTek Dimensity 810 has slightly higher clock speeds for both core types, potentially leading to better overall performance.
Another difference lies in the lithography process used to manufacture the processors. The HiSilicon Kirin 810 is built using a 7 nm process, while the MediaTek Dimensity 810 utilizes a more advanced 6 nm process. A smaller lithography generally indicates better power efficiency and performance due to improved transistor density.
Speaking of transistors, the MediaTek Dimensity 810 boasts a higher number with 12000 million transistors compared to the HiSilicon Kirin 810's 6900 million transistors. This higher transistor count suggests that the MediaTek Dimensity 810 may be capable of handling more complex tasks and processing data more efficiently.
Power consumption is also a differentiating factor between the two processors. The HiSilicon Kirin 810 has a lower TDP (Thermal Design Power) of 5 Watts, while the MediaTek Dimensity 810 has a slightly higher TDP of 8 Watts. This could potentially mean that the HiSilicon Kirin 810 is more power-efficient, leading to longer battery life for devices powered by this processor.
Finally, the HiSilicon Kirin 810 comes with the Ascend D100 Lite for neural processing, utilizing the Huawei Da Vinci Architecture. On the other hand, the MediaTek Dimensity 810 features its own NPU (Neural Processing Unit).
In conclusion, both the HiSilicon Kirin 810 and the MediaTek Dimensity 810 offer impressive specifications and performance capabilities. However, the MediaTek Dimensity 810 takes a slight edge with higher clock speeds, smaller lithography, a higher transistor count, and its own NPU. Nevertheless, the choice between the two ultimately depends on the specific requirements and preferences of the user.
In terms of CPU cores and architecture, the HiSilicon Kirin 810 is equipped with 2x Cortex-A76 cores clocked at 2.27 GHz and 6x Cortex-A55 cores clocked at 1.88 GHz. On the other hand, the MediaTek Dimensity 810 features 2x Cortex-A76 cores clocked at 2.4 GHz and 6x Cortex-A55 cores clocked at 2.0 GHz. This means that the MediaTek Dimensity 810 has slightly higher clock speeds for both core types, potentially leading to better overall performance.
Another difference lies in the lithography process used to manufacture the processors. The HiSilicon Kirin 810 is built using a 7 nm process, while the MediaTek Dimensity 810 utilizes a more advanced 6 nm process. A smaller lithography generally indicates better power efficiency and performance due to improved transistor density.
Speaking of transistors, the MediaTek Dimensity 810 boasts a higher number with 12000 million transistors compared to the HiSilicon Kirin 810's 6900 million transistors. This higher transistor count suggests that the MediaTek Dimensity 810 may be capable of handling more complex tasks and processing data more efficiently.
Power consumption is also a differentiating factor between the two processors. The HiSilicon Kirin 810 has a lower TDP (Thermal Design Power) of 5 Watts, while the MediaTek Dimensity 810 has a slightly higher TDP of 8 Watts. This could potentially mean that the HiSilicon Kirin 810 is more power-efficient, leading to longer battery life for devices powered by this processor.
Finally, the HiSilicon Kirin 810 comes with the Ascend D100 Lite for neural processing, utilizing the Huawei Da Vinci Architecture. On the other hand, the MediaTek Dimensity 810 features its own NPU (Neural Processing Unit).
In conclusion, both the HiSilicon Kirin 810 and the MediaTek Dimensity 810 offer impressive specifications and performance capabilities. However, the MediaTek Dimensity 810 takes a slight edge with higher clock speeds, smaller lithography, a higher transistor count, and its own NPU. Nevertheless, the choice between the two ultimately depends on the specific requirements and preferences of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 6900 million | 12000 million |
TDP | 5 Watt | 8 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP2 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 820 MHz | 950 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 2x 16MP |
Max Video Capture | FullHD@30fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2021 Quarter 3 |
Partnumber | Hi6280 | MT6833V/PNZA, MT6833P |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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