HiSilicon Kirin 810 vs HiSilicon Kirin 985 5G

The HiSilicon Kirin 810 and HiSilicon Kirin 985 5G are two processors that offer impressive specifications. Both processors have a similar architecture and instruction set, which is ARMv8.2-A. They also have the same number of cores, which is 8.

Starting with the HiSilicon Kirin 810, it has a CPU architecture of 2x 2.27 GHz Cortex-A76 and 6x 1.88 GHz Cortex-A55. This processor is built on a 7 nm lithography and has a TDP (Thermal Design Power) of 5 Watts. It houses 6900 million transistors and features Neural Processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture.

On the other hand, the HiSilicon Kirin 985 5G boasts a more powerful CPU architecture. It consists of 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. Like the Kirin 810, it is also built on a 7 nm lithography. However, it has a slightly higher TDP of 6 Watts. This processor incorporates the Ascend D110 Lite and Ascend D100 Tiny Neural Processing units, both utilizing the HUAWEI Da Vinci Architecture.

While both processors exhibit impressive specifications, the HiSilicon Kirin 985 5G appears to be the more advanced option. With a higher clock speed and a more diverse distribution of CPU cores, it offers enhanced performance capabilities. The addition of the Ascend D110 Lite Neural Processing unit further enhances its capabilities in AI-related tasks.

In conclusion, while the HiSilicon Kirin 810 is a powerful processor in its own right, the HiSilicon Kirin 985 5G surpasses it with its more advanced CPU architecture and Neural Processing units. These processors are likely to excel in providing superior performance for various applications and tasks.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
1x 2.58 GHz – Cortex-A76
3x 2.4 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
Number of transistors 6900 million
TDP 5 Watt 6 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 4x16 bit


Storage specification UFS 2.1 UFS 3.0


GPU name Mali-G52 MP6 Mali-G77 MP8
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 700 MHz
Execution units 6 8
Shaders 96 128
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 3120x1440
Max camera resolution 1x 48MP, 2x 20MP 1x 48MP, 2x 20MP
Max Video Capture FullHD@30fps 4K@30fp
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 1.4 Gbps
Peak Upload Speed 0.15 Gbps 0.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2019 Quarter 2 2020 Quarter 2
Partnumber Hi6280 Hi6290
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
Kirin 985 5G

GeekBench 6 Single-Core

Kirin 810
Kirin 985 5G

GeekBench 6 Multi-Core

Kirin 810
Kirin 985 5G