HiSilicon Kirin 810 vs HiSilicon Kirin 985 5G
The HiSilicon Kirin 810 and HiSilicon Kirin 985 5G are two processors that offer impressive specifications. Both processors have a similar architecture and instruction set, which is ARMv8.2-A. They also have the same number of cores, which is 8.
Starting with the HiSilicon Kirin 810, it has a CPU architecture of 2x 2.27 GHz Cortex-A76 and 6x 1.88 GHz Cortex-A55. This processor is built on a 7 nm lithography and has a TDP (Thermal Design Power) of 5 Watts. It houses 6900 million transistors and features Neural Processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture.
On the other hand, the HiSilicon Kirin 985 5G boasts a more powerful CPU architecture. It consists of 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. Like the Kirin 810, it is also built on a 7 nm lithography. However, it has a slightly higher TDP of 6 Watts. This processor incorporates the Ascend D110 Lite and Ascend D100 Tiny Neural Processing units, both utilizing the HUAWEI Da Vinci Architecture.
While both processors exhibit impressive specifications, the HiSilicon Kirin 985 5G appears to be the more advanced option. With a higher clock speed and a more diverse distribution of CPU cores, it offers enhanced performance capabilities. The addition of the Ascend D110 Lite Neural Processing unit further enhances its capabilities in AI-related tasks.
In conclusion, while the HiSilicon Kirin 810 is a powerful processor in its own right, the HiSilicon Kirin 985 5G surpasses it with its more advanced CPU architecture and Neural Processing units. These processors are likely to excel in providing superior performance for various applications and tasks.
Starting with the HiSilicon Kirin 810, it has a CPU architecture of 2x 2.27 GHz Cortex-A76 and 6x 1.88 GHz Cortex-A55. This processor is built on a 7 nm lithography and has a TDP (Thermal Design Power) of 5 Watts. It houses 6900 million transistors and features Neural Processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture.
On the other hand, the HiSilicon Kirin 985 5G boasts a more powerful CPU architecture. It consists of 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. Like the Kirin 810, it is also built on a 7 nm lithography. However, it has a slightly higher TDP of 6 Watts. This processor incorporates the Ascend D110 Lite and Ascend D100 Tiny Neural Processing units, both utilizing the HUAWEI Da Vinci Architecture.
While both processors exhibit impressive specifications, the HiSilicon Kirin 985 5G appears to be the more advanced option. With a higher clock speed and a more diverse distribution of CPU cores, it offers enhanced performance capabilities. The addition of the Ascend D110 Lite Neural Processing unit further enhances its capabilities in AI-related tasks.
In conclusion, while the HiSilicon Kirin 810 is a powerful processor in its own right, the HiSilicon Kirin 985 5G surpasses it with its more advanced CPU architecture and Neural Processing units. These processors are likely to excel in providing superior performance for various applications and tasks.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8.2-A | ARMv8.2-A |
| Lithography | 7 nm | 7 nm |
| Number of transistors | 6900 million | |
| TDP | 5 Watt | 6 Watt |
| Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture |
Memory (RAM)
| Max amount | up to 8 GB | up to 12 GB |
| Memory type | LPDDR4X | LPDDR4X |
| Memory frequency | 2133 MHz | 2133 MHz |
| Memory-bus | 4x16 bit | 4x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 3.0 |
Graphics
| GPU name | Mali-G52 MP6 | Mali-G77 MP8 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 820 MHz | 700 MHz |
| Execution units | 6 | 8 |
| Shaders | 96 | 128 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | ES 3.2 |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 3120x1440 | |
| Max camera resolution | 1x 48MP, 2x 20MP | 1x 48MP, 2x 20MP |
| Max Video Capture | FullHD@30fps | 4K@30fp |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 1.4 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
| Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
| Bluetooth | 5.1 | 5.0 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2019 Quarter 2 | 2020 Quarter 2 |
| Partnumber | Hi6280 | Hi6290 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Mid-end |
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