HiSilicon Kirin 810 vs HiSilicon Kirin 970

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The HiSilicon Kirin 810 and Kirin 970 are both high-performance processors designed by HiSilicon. These processors have different specifications that set them apart in terms of their CPU cores and architecture.

Starting with the HiSilicon Kirin 810, it features an architecture with 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This configuration allows for efficient multitasking and smooth performance. The processor is built using a 7 nm lithography process, which ensures better power efficiency and reduced heat generation. With 8 cores in total, the Kirin 810 is capable of handling a wide range of tasks seamlessly. Additionally, it supports the ARMv8.2-A instruction set and includes the Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing.

On the other hand, the HiSilicon Kirin 970 is equipped with an architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This combination provides the processor with the ability to deliver fast and efficient performance. The Kirin 970 is manufactured using a 10 nm lithography process, which offers decent power efficiency. With 8 cores, it has the capability to handle various demanding tasks effectively. The processor supports the ARMv8-A instruction set and includes the HiSilicon NPU for neural processing.

Comparing the two processors, the Kirin 810 has a more advanced architecture with Cortex-A76 cores, while the Kirin 970 uses Cortex-A73 cores. Furthermore, the Kirin 810 operates at a lower TDP (thermal design power) of 5 watts, indicating better power efficiency compared to the Kirin 970, which has a TDP of 9 watts. The Kirin 810 also boasts a higher number of transistors, with 6900 million, compared to the Kirin 970's 5500 million.

In terms of neural processing, the Kirin 810 utilizes the Ascend D100 Lite and HUAWEI Da Vinci Architecture, while the Kirin 970 incorporates the HiSilicon NPU. Both processors offer excellent neural processing capabilities, supporting AI-driven tasks.

In conclusion, both the HiSilicon Kirin 810 and Kirin 970 have their own strengths and unique specifications. Depending on the intended usage and preference, users can choose the processor that best suits their needs, whether it be the advanced architecture and power efficiency of the Kirin 810 or the fast performance and neural processing capabilities of the Kirin 970.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8-A
Lithography 7 nm 10 nm
Number of transistors 6900 million 5500 million
TDP 5 Watt 9 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture HiSilicon NPU

Memory (RAM)

Max amount up to 8 GB up to 8 GB
Memory type LPDDR4X LPDDR4
Memory frequency 2133 MHz 1866 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G52 MP6 Mali-G72 MP12
GPU Architecture Bifrost Bifrost
GPU frequency 820 MHz 750 MHz
Execution units 6 12
Shaders 96 192
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max screen resolution 2340x1080
Max camera resolution 1x 48MP, 2x 20MP 1x 48MP, 2x 20MP
Max Video Capture FullHD@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 1.2 Gbps
Peak Upload Speed 0.15 Gbps 0.15 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2 2017 September
Partnumber Hi6280 Hi3670
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 810
373134
Kirin 970
318577

GeekBench 6 Single-Core

Score
Kirin 810
604
Kirin 970
389

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Kirin 970
1502