HiSilicon Kirin 810 vs HiSilicon Kirin 970
The HiSilicon Kirin 810 and Kirin 970 are both high-performance processors designed by HiSilicon. These processors have different specifications that set them apart in terms of their CPU cores and architecture.
Starting with the HiSilicon Kirin 810, it features an architecture with 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This configuration allows for efficient multitasking and smooth performance. The processor is built using a 7 nm lithography process, which ensures better power efficiency and reduced heat generation. With 8 cores in total, the Kirin 810 is capable of handling a wide range of tasks seamlessly. Additionally, it supports the ARMv8.2-A instruction set and includes the Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing.
On the other hand, the HiSilicon Kirin 970 is equipped with an architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This combination provides the processor with the ability to deliver fast and efficient performance. The Kirin 970 is manufactured using a 10 nm lithography process, which offers decent power efficiency. With 8 cores, it has the capability to handle various demanding tasks effectively. The processor supports the ARMv8-A instruction set and includes the HiSilicon NPU for neural processing.
Comparing the two processors, the Kirin 810 has a more advanced architecture with Cortex-A76 cores, while the Kirin 970 uses Cortex-A73 cores. Furthermore, the Kirin 810 operates at a lower TDP (thermal design power) of 5 watts, indicating better power efficiency compared to the Kirin 970, which has a TDP of 9 watts. The Kirin 810 also boasts a higher number of transistors, with 6900 million, compared to the Kirin 970's 5500 million.
In terms of neural processing, the Kirin 810 utilizes the Ascend D100 Lite and HUAWEI Da Vinci Architecture, while the Kirin 970 incorporates the HiSilicon NPU. Both processors offer excellent neural processing capabilities, supporting AI-driven tasks.
In conclusion, both the HiSilicon Kirin 810 and Kirin 970 have their own strengths and unique specifications. Depending on the intended usage and preference, users can choose the processor that best suits their needs, whether it be the advanced architecture and power efficiency of the Kirin 810 or the fast performance and neural processing capabilities of the Kirin 970.
Starting with the HiSilicon Kirin 810, it features an architecture with 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This configuration allows for efficient multitasking and smooth performance. The processor is built using a 7 nm lithography process, which ensures better power efficiency and reduced heat generation. With 8 cores in total, the Kirin 810 is capable of handling a wide range of tasks seamlessly. Additionally, it supports the ARMv8.2-A instruction set and includes the Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing.
On the other hand, the HiSilicon Kirin 970 is equipped with an architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This combination provides the processor with the ability to deliver fast and efficient performance. The Kirin 970 is manufactured using a 10 nm lithography process, which offers decent power efficiency. With 8 cores, it has the capability to handle various demanding tasks effectively. The processor supports the ARMv8-A instruction set and includes the HiSilicon NPU for neural processing.
Comparing the two processors, the Kirin 810 has a more advanced architecture with Cortex-A76 cores, while the Kirin 970 uses Cortex-A73 cores. Furthermore, the Kirin 810 operates at a lower TDP (thermal design power) of 5 watts, indicating better power efficiency compared to the Kirin 970, which has a TDP of 9 watts. The Kirin 810 also boasts a higher number of transistors, with 6900 million, compared to the Kirin 970's 5500 million.
In terms of neural processing, the Kirin 810 utilizes the Ascend D100 Lite and HUAWEI Da Vinci Architecture, while the Kirin 970 incorporates the HiSilicon NPU. Both processors offer excellent neural processing capabilities, supporting AI-driven tasks.
In conclusion, both the HiSilicon Kirin 810 and Kirin 970 have their own strengths and unique specifications. Depending on the intended usage and preference, users can choose the processor that best suits their needs, whether it be the advanced architecture and power efficiency of the Kirin 810 or the fast performance and neural processing capabilities of the Kirin 970.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8-A |
Lithography | 7 nm | 10 nm |
Number of transistors | 6900 million | 5500 million |
TDP | 5 Watt | 9 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | HiSilicon NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4 |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G72 MP12 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 820 MHz | 750 MHz |
Execution units | 6 | 12 |
Shaders | 96 | 192 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 48MP, 2x 20MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.2 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2017 September |
Partnumber | Hi6280 | Hi3670 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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