HiSilicon Kirin 810 vs HiSilicon Kirin 960

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The HiSilicon Kirin 810 and Kirin 960 are two processors manufactured by HiSilicon, both designed for use in smartphones and tablets. While they share some similarities, there are several key differences in their specifications.

Starting with the Kirin 810, it is built on a 7 nm lithography process, making it more power-efficient than its counterpart. Its CPU architecture consists of two Cortex-A76 cores clocked at 2.27 GHz and six Cortex-A55 cores clocked at 1.88 GHz. This gives it a total of eight cores. The instruction set used is ARMv8.2-A, which provides improved performance and security. With 6900 million transistors, the Kirin 810 has a higher transistor count, indicating a more powerful processing capability.

In terms of neural processing, the Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci Architecture, which enables advanced AI capabilities such as machine learning and neural networks. This makes it suitable for running AI-based applications and tasks efficiently.

Moving on to the Kirin 960, it is manufactured using a 16 nm lithography process, making it slightly less power-efficient compared to the Kirin 810. It also consists of eight cores, but with a different CPU architecture. It includes four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. The instruction set used is ARMv8-A, which is slightly older compared to the ARMv8.2-A used in the Kirin 810.

In terms of transistor count, the Kirin 960 has 4000 million transistors, indicating a lower processing capability compared to the Kirin 810. However, both processors have the same TDP of 5 Watts, ensuring efficient power usage and heat dissipation.

In conclusion, the HiSilicon Kirin 810 and Kirin 960 processors differ in lithography, CPU architecture, and transistor count. The Kirin 810 boasts a more power-efficient 7 nm lithography process, advanced Cortex-A76 and Cortex-A55 CPU cores, and a higher transistor count. On the other hand, the Kirin 960 uses a slightly older 16 nm process and Cortex-A73 and Cortex-A53 CPU cores. Both processors have a TDP of 5 Watts, making them suitable for mobile devices.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8-A
Lithography 7 nm 16 nm
Number of transistors 6900 million 4000 million
TDP 5 Watt 5 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB up to 6 GB
Memory type LPDDR4X LPDDR4
Memory frequency 2133 MHz 1866 MHz
Memory-bus 4x16 bit 2x32 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G52 MP6 Mali-G71 MP8
GPU Architecture Bifrost Bifrost
GPU frequency 820 MHz 900 MHz
Execution units 6 8
Shaders 96 128
DirectX 12 11.3
OpenCL API 2.0 1.2
OpenGL API ES 3.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max camera resolution 1x 48MP, 2x 20MP 1x 20MP, 2x 12MP
Max Video Capture FullHD@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.6 Gbps
Peak Upload Speed 0.15 Gbps 0.15 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2 2016 October
Partnumber Hi6280 Hi3660
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 810
373134
Kirin 960
253892

GeekBench 6 Single-Core

Score
Kirin 810
604
Kirin 960
382

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Kirin 960
1544