HiSilicon Kirin 810 vs HiSilicon Kirin 930

VS
The HiSilicon Kirin 810 and the HiSilicon Kirin 930 are two processors with distinctive specifications. Let's compare them to further analyze their differences.

Starting with the HiSilicon Kirin 810, it boasts an architecture comprising of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This octa-core processor operates on the ARMv8.2-A instruction set. With a lithography of 7 nm, it showcases remarkable efficiency. It houses a whopping 6900 million transistors, resulting in enhanced performance. The thermal design power (TDP) is measured at 5 Watts. Furthermore, the HiSilicon Kirin 810 features Neural Processing capabilities with Ascend D100 Lite and HUAWEI Da Vinci Architecture.

In contrast, the HiSilicon Kirin 930 has an architecture that combines 4x 2 GHz Cortex-A53 cores with 4x 1.5 GHz Cortex-A53 cores. Like its counterpart, it has eight cores in total. It operates on the ARMv8-A instruction set and has a lithography of 28 nm. With 1000 million transistors, it falls slightly behind the Kirin 810 in terms of transistor count. Additionally, its TDP matches that of the Kirin 810, standing at 5 Watts.

When comparing these two processors, it becomes evident that the Kirin 810 outshines the Kirin 930 in several aspects. The Kirin 810's 7 nm lithography offers improved power efficiency compared to the Kirin 930's 28 nm. Furthermore, with 6900 million transistors, the Kirin 810 surpasses the Kirin 930's 1000 million, resulting in potentially superior performance.

Moreover, the CPU architecture of the Kirin 810 features Cortex-A76 and Cortex-A55 cores, which are known for their robust and efficient performance. On the other hand, the Kirin 930's architecture comprises exclusively of Cortex-A53 cores, which are generally considered to be less powerful and efficient.

In conclusion, the HiSilicon Kirin 810 demonstrates superiority in terms of transistor count, lithography, and CPU architecture compared to the HiSilicon Kirin 930. With its advanced specifications, the Kirin 810 is likely to offer improved performance and efficiency in various applications.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
4x 2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8-A
Lithography 7 nm 28 nm
Number of transistors 6900 million 1000 million
TDP 5 Watt 5 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB up to 6 GB
Memory type LPDDR4X LPDDR3
Memory frequency 2133 MHz 800 MHz
Memory-bus 4x16 bit 2x32 bit

Storage

Storage specification UFS 2.1 UFS 2.0

Graphics

GPU name Mali-G52 MP6 Mali-T628 MP4
GPU Architecture Bifrost Midgard
GPU frequency 820 MHz 600 MHz
Execution units 6 4
Shaders 96 64
DirectX 12 11
OpenCL API 2.0 1.2
OpenGL API ES 3.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max screen resolution 2560x1600
Max camera resolution 1x 48MP, 2x 20MP 1x 20MP
Max Video Capture FullHD@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.3 Gbps
Peak Upload Speed 0.15 Gbps 0.05 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2 2015 Quarter 2
Partnumber Hi6280 Hi3630
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Kirin 930

GeekBench 6 Single-Core

Score
Kirin 810
604
Kirin 930

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Kirin 930