HiSilicon Kirin 810 vs HiSilicon Kirin 820 5G

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The HiSilicon Kirin 810 and the HiSilicon Kirin 820 5G are two processors developed by HiSilicon, a subsidiary of Huawei. While both processors offer powerful performance, they do have some differences in their specifications.

Starting with the HiSilicon Kirin 810, it features an architecture that consists of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. With a total of 8 cores, this processor is capable of handling various tasks efficiently. It utilizes the ARMv8.2-A instruction set and has a lithography of 7 nm, making it energy-efficient and providing better power-saving capabilities. The HiSilicon Kirin 810 has a TDP (Thermal Design Power) of 5 Watts, which indicates its cooling requirements during operation. Additionally, it incorporates the Ascend D100 Lite Neural Processing engine and Huawei's Da Vinci Architecture for enhanced neural processing and AI capabilities.

On the other hand, the HiSilicon Kirin 820 5G offers a slightly different architecture. It consists of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. Similar to the Kirin 810, it has a total of 8 cores, but with a more diverse configuration. The Kirin 820 5G also uses the ARMv8.2-A instruction set and has a lithography of 7 nm for improved energy efficiency. Its TDP is slightly higher, at 6 Watts, indicating a slightly higher power consumption compared to the Kirin 810. Moreover, it features the Ascend D110 Lite Neural Processing engine and Huawei's Da Vinci Architecture, providing similar AI capabilities to the Kirin 810.

While both processors share some common features, such as their 7 nm lithography and AI capabilities, they differ in their CPU core configurations, clock speeds, and TDPs. These variations might result in slight differences in performance and power consumption. Ultimately, the choice between the HiSilicon Kirin 810 and the HiSilicon Kirin 820 5G will depend on the specific requirements and preferences of the user or device manufacturer.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
Number of transistors 6900 million
TDP 5 Watt 6 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G52 MP6 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 850 MHz
Execution units 6 6
Shaders 96 96
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max camera resolution 1x 48MP, 2x 20MP 1x 48MP, 2x 20MP
Max Video Capture FullHD@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 1.6 Gbps
Peak Upload Speed 0.15 Gbps 0.2 Gbps
Wi-Fi 6 (802.11ax) 6 (802.11ax)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2 2020 March
Partnumber Hi6280
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Kirin 820 5G
387656

GeekBench 6 Single-Core

Score
Kirin 810
604
Kirin 820 5G
640

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Kirin 820 5G
2436