HiSilicon Kirin 810 vs HiSilicon Kirin 820 5G
The HiSilicon Kirin 810 and the HiSilicon Kirin 820 5G are two processors developed by HiSilicon, a subsidiary of Huawei. While both processors offer powerful performance, they do have some differences in their specifications.
Starting with the HiSilicon Kirin 810, it features an architecture that consists of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. With a total of 8 cores, this processor is capable of handling various tasks efficiently. It utilizes the ARMv8.2-A instruction set and has a lithography of 7 nm, making it energy-efficient and providing better power-saving capabilities. The HiSilicon Kirin 810 has a TDP (Thermal Design Power) of 5 Watts, which indicates its cooling requirements during operation. Additionally, it incorporates the Ascend D100 Lite Neural Processing engine and Huawei's Da Vinci Architecture for enhanced neural processing and AI capabilities.
On the other hand, the HiSilicon Kirin 820 5G offers a slightly different architecture. It consists of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. Similar to the Kirin 810, it has a total of 8 cores, but with a more diverse configuration. The Kirin 820 5G also uses the ARMv8.2-A instruction set and has a lithography of 7 nm for improved energy efficiency. Its TDP is slightly higher, at 6 Watts, indicating a slightly higher power consumption compared to the Kirin 810. Moreover, it features the Ascend D110 Lite Neural Processing engine and Huawei's Da Vinci Architecture, providing similar AI capabilities to the Kirin 810.
While both processors share some common features, such as their 7 nm lithography and AI capabilities, they differ in their CPU core configurations, clock speeds, and TDPs. These variations might result in slight differences in performance and power consumption. Ultimately, the choice between the HiSilicon Kirin 810 and the HiSilicon Kirin 820 5G will depend on the specific requirements and preferences of the user or device manufacturer.
Starting with the HiSilicon Kirin 810, it features an architecture that consists of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. With a total of 8 cores, this processor is capable of handling various tasks efficiently. It utilizes the ARMv8.2-A instruction set and has a lithography of 7 nm, making it energy-efficient and providing better power-saving capabilities. The HiSilicon Kirin 810 has a TDP (Thermal Design Power) of 5 Watts, which indicates its cooling requirements during operation. Additionally, it incorporates the Ascend D100 Lite Neural Processing engine and Huawei's Da Vinci Architecture for enhanced neural processing and AI capabilities.
On the other hand, the HiSilicon Kirin 820 5G offers a slightly different architecture. It consists of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. Similar to the Kirin 810, it has a total of 8 cores, but with a more diverse configuration. The Kirin 820 5G also uses the ARMv8.2-A instruction set and has a lithography of 7 nm for improved energy efficiency. Its TDP is slightly higher, at 6 Watts, indicating a slightly higher power consumption compared to the Kirin 810. Moreover, it features the Ascend D110 Lite Neural Processing engine and Huawei's Da Vinci Architecture, providing similar AI capabilities to the Kirin 810.
While both processors share some common features, such as their 7 nm lithography and AI capabilities, they differ in their CPU core configurations, clock speeds, and TDPs. These variations might result in slight differences in performance and power consumption. Ultimately, the choice between the HiSilicon Kirin 810 and the HiSilicon Kirin 820 5G will depend on the specific requirements and preferences of the user or device manufacturer.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP6 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 850 MHz |
Execution units | 6 | 6 |
Shaders | 96 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max camera resolution | 1x 48MP, 2x 20MP | 1x 48MP, 2x 20MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2020 March |
Partnumber | Hi6280 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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