HiSilicon Kirin 710F vs MediaTek Dimensity 900
The HiSilicon Kirin 710F and MediaTek Dimensity 900 are both processors used in smartphones and other mobile devices. While they share some similarities, they also have distinct differences in their specifications.
Starting with the HiSilicon Kirin 710F, it features an architecture of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This octa-core processor operates on a 12 nm lithography with a total of 5500 million transistors. With a TDP of 5 watts, it is designed to deliver efficient performance while conserving power. The instruction set utilized by the Kirin 710F is ARMv8-A.
On the other hand, the MediaTek Dimensity 900 offers a slightly different architecture. It comprises 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Like the Kirin 710F, this processor also has 8 cores and operates on an ARMv8.2-A instruction set. However, it has a more advanced 6 nm lithography and a higher transistor count of 10000 million. With a TDP of 10 watts, the Dimensity 900 may consume more power compared to the Kirin 710F. Additionally, it also features a Neural Processing Unit (NPU) for enhanced AI and machine learning capabilities.
In terms of raw processing power, the MediaTek Dimensity 900 has a slight advantage with its higher clock speeds and advanced architecture. The Dimensity 900's Cortex-A78 cores offer better performance and efficiency compared to the Cortex-A73 cores of the Kirin 710F.
However, the Kirin 710F still has its merits. Its 12 nm lithography and lower transistor count may result in better energy efficiency, allowing for longer battery life. Additionally, the Kirin 710F could be a more cost-effective option for devices where raw processing power is not the primary concern.
Overall, while the MediaTek Dimensity 900 may provide better performance with its advanced architecture, the HiSilicon Kirin 710F offers a balance of power and efficiency. The choice between the two processors ultimately depends on the specific needs and priorities of the device and its intended usage.
Starting with the HiSilicon Kirin 710F, it features an architecture of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This octa-core processor operates on a 12 nm lithography with a total of 5500 million transistors. With a TDP of 5 watts, it is designed to deliver efficient performance while conserving power. The instruction set utilized by the Kirin 710F is ARMv8-A.
On the other hand, the MediaTek Dimensity 900 offers a slightly different architecture. It comprises 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Like the Kirin 710F, this processor also has 8 cores and operates on an ARMv8.2-A instruction set. However, it has a more advanced 6 nm lithography and a higher transistor count of 10000 million. With a TDP of 10 watts, the Dimensity 900 may consume more power compared to the Kirin 710F. Additionally, it also features a Neural Processing Unit (NPU) for enhanced AI and machine learning capabilities.
In terms of raw processing power, the MediaTek Dimensity 900 has a slight advantage with its higher clock speeds and advanced architecture. The Dimensity 900's Cortex-A78 cores offer better performance and efficiency compared to the Cortex-A73 cores of the Kirin 710F.
However, the Kirin 710F still has its merits. Its 12 nm lithography and lower transistor count may result in better energy efficiency, allowing for longer battery life. Additionally, the Kirin 710F could be a more cost-effective option for devices where raw processing power is not the primary concern.
Overall, while the MediaTek Dimensity 900 may provide better performance with its advanced architecture, the HiSilicon Kirin 710F offers a balance of power and efficiency. The choice between the two processors ultimately depends on the specific needs and priorities of the device and its intended usage.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 6 nm |
Number of transistors | 5500 million | 10000 million |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G68 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 900 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2021 Quarter 1 |
Partnumber | Hi6260 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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