HiSilicon Kirin 710F vs MediaTek Dimensity 900

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The HiSilicon Kirin 710F and MediaTek Dimensity 900 are both processors used in smartphones and other mobile devices. While they share some similarities, they also have distinct differences in their specifications.

Starting with the HiSilicon Kirin 710F, it features an architecture of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This octa-core processor operates on a 12 nm lithography with a total of 5500 million transistors. With a TDP of 5 watts, it is designed to deliver efficient performance while conserving power. The instruction set utilized by the Kirin 710F is ARMv8-A.

On the other hand, the MediaTek Dimensity 900 offers a slightly different architecture. It comprises 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Like the Kirin 710F, this processor also has 8 cores and operates on an ARMv8.2-A instruction set. However, it has a more advanced 6 nm lithography and a higher transistor count of 10000 million. With a TDP of 10 watts, the Dimensity 900 may consume more power compared to the Kirin 710F. Additionally, it also features a Neural Processing Unit (NPU) for enhanced AI and machine learning capabilities.

In terms of raw processing power, the MediaTek Dimensity 900 has a slight advantage with its higher clock speeds and advanced architecture. The Dimensity 900's Cortex-A78 cores offer better performance and efficiency compared to the Cortex-A73 cores of the Kirin 710F.

However, the Kirin 710F still has its merits. Its 12 nm lithography and lower transistor count may result in better energy efficiency, allowing for longer battery life. Additionally, the Kirin 710F could be a more cost-effective option for devices where raw processing power is not the primary concern.

Overall, while the MediaTek Dimensity 900 may provide better performance with its advanced architecture, the HiSilicon Kirin 710F offers a balance of power and efficiency. The choice between the two processors ultimately depends on the specific needs and priorities of the device and its intended usage.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 6 nm
Number of transistors 5500 million 10000 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 3200 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G51 MP4 Mali-G68 MP4
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 900 MHz
GPU boost frequency 1000 MHz
Execution units 4 4
Shaders 64 64
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2019 Quarter 1 2021 Quarter 1
Partnumber Hi6260 MT6877
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
195573
Dimensity 900
435318

GeekBench 6 Single-Core

Score
Kirin 710F
329
Dimensity 900
704

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Dimensity 900
2139