HiSilicon Kirin 710F vs HiSilicon Kirin 810

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The HiSilicon Kirin 710F and HiSilicon Kirin 810 are two processors with impressive specifications, but each offers different features that cater to varying user needs.

Starting with the HiSilicon Kirin 710F, it boasts a CPU architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, this processor delivers efficient multitasking capabilities. It utilizes the ARMv8-A instruction set and has a lithography of 12 nm. Additionally, it contains 5500 million transistors and operates at a TDP of 5 Watts.

In contrast, the HiSilicon Kirin 810 utilizes a more advanced CPU architecture, featuring 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. Like the Kirin 710F, it also has 8 cores, but its combination of Cortex-A76 and Cortex-A55 cores delivers enhanced performance in both power-intensive and power-efficient tasks. Furthermore, the Kirin 810 adopts the ARMv8.2-A instruction set and operates on a 7 nm lithography, making it more power-efficient than its counterpart. It contains 6900 million transistors and consumes the same TDP of 5 Watts.

The Kirin 810 has an additional advantage with its Neural Processing capabilities, thanks to the inclusion of Ascend D100 Lite and HUAWEI Da Vinci Architecture. This enables the processor to handle complex artificial intelligence tasks, delivering improved neural processing performance, and enhancing features such as facial recognition, object detection, and more.

Both processors offer excellent performance for their respective generations. However, if you prioritize power efficiency and AI capabilities, the HiSilicon Kirin 810 seems to be the better choice. On the other hand, if you desire a reliable processor with strong multitasking capabilities, the HiSilicon Kirin 710F could satisfy your needs.

Ultimately, the decision of which processor to choose depends on individual requirements and preferences, such as whether power efficiency or multitasking capability is of higher importance. With their specifications, both processors are capable of delivering a satisfactory user experience.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 7 nm
Number of transistors 5500 million 6900 million
TDP 5 Watt 5 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 6 GB up to 8 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G51 MP4 Mali-G52 MP6
GPU Architecture Bifrost Bifrost
GPU frequency 650 MHz 820 MHz
GPU boost frequency 1000 MHz
Execution units 4 6
Shaders 64 96
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max screen resolution 2340x1080
Max camera resolution 1x 48MP, 2x 24MP 1x 48MP, 2x 20MP
Max Video Capture FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.6 Gbps
Peak Upload Speed 0.15 Gbps 0.15 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2019 Quarter 1 2019 Quarter 2
Partnumber Hi6260 Hi6280
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
195573
Kirin 810
373134

GeekBench 6 Single-Core

Score
Kirin 710F
329
Kirin 810
604

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Kirin 810
1959