HiSilicon Kirin 710F vs HiSilicon Kirin 810
The HiSilicon Kirin 710F and HiSilicon Kirin 810 are two processors with impressive specifications, but each offers different features that cater to varying user needs.
Starting with the HiSilicon Kirin 710F, it boasts a CPU architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, this processor delivers efficient multitasking capabilities. It utilizes the ARMv8-A instruction set and has a lithography of 12 nm. Additionally, it contains 5500 million transistors and operates at a TDP of 5 Watts.
In contrast, the HiSilicon Kirin 810 utilizes a more advanced CPU architecture, featuring 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. Like the Kirin 710F, it also has 8 cores, but its combination of Cortex-A76 and Cortex-A55 cores delivers enhanced performance in both power-intensive and power-efficient tasks. Furthermore, the Kirin 810 adopts the ARMv8.2-A instruction set and operates on a 7 nm lithography, making it more power-efficient than its counterpart. It contains 6900 million transistors and consumes the same TDP of 5 Watts.
The Kirin 810 has an additional advantage with its Neural Processing capabilities, thanks to the inclusion of Ascend D100 Lite and HUAWEI Da Vinci Architecture. This enables the processor to handle complex artificial intelligence tasks, delivering improved neural processing performance, and enhancing features such as facial recognition, object detection, and more.
Both processors offer excellent performance for their respective generations. However, if you prioritize power efficiency and AI capabilities, the HiSilicon Kirin 810 seems to be the better choice. On the other hand, if you desire a reliable processor with strong multitasking capabilities, the HiSilicon Kirin 710F could satisfy your needs.
Ultimately, the decision of which processor to choose depends on individual requirements and preferences, such as whether power efficiency or multitasking capability is of higher importance. With their specifications, both processors are capable of delivering a satisfactory user experience.
Starting with the HiSilicon Kirin 710F, it boasts a CPU architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, this processor delivers efficient multitasking capabilities. It utilizes the ARMv8-A instruction set and has a lithography of 12 nm. Additionally, it contains 5500 million transistors and operates at a TDP of 5 Watts.
In contrast, the HiSilicon Kirin 810 utilizes a more advanced CPU architecture, featuring 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. Like the Kirin 710F, it also has 8 cores, but its combination of Cortex-A76 and Cortex-A55 cores delivers enhanced performance in both power-intensive and power-efficient tasks. Furthermore, the Kirin 810 adopts the ARMv8.2-A instruction set and operates on a 7 nm lithography, making it more power-efficient than its counterpart. It contains 6900 million transistors and consumes the same TDP of 5 Watts.
The Kirin 810 has an additional advantage with its Neural Processing capabilities, thanks to the inclusion of Ascend D100 Lite and HUAWEI Da Vinci Architecture. This enables the processor to handle complex artificial intelligence tasks, delivering improved neural processing performance, and enhancing features such as facial recognition, object detection, and more.
Both processors offer excellent performance for their respective generations. However, if you prioritize power efficiency and AI capabilities, the HiSilicon Kirin 810 seems to be the better choice. On the other hand, if you desire a reliable processor with strong multitasking capabilities, the HiSilicon Kirin 710F could satisfy your needs.
Ultimately, the decision of which processor to choose depends on individual requirements and preferences, such as whether power efficiency or multitasking capability is of higher importance. With their specifications, both processors are capable of delivering a satisfactory user experience.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | 6900 million |
TDP | 5 Watt | 5 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G52 MP6 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 820 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 20MP |
Max Video Capture | FullHD@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2019 Quarter 2 |
Partnumber | Hi6260 | Hi6280 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Unisoc Tanggula T760 5G vs MediaTek Helio G96
2
Unisoc Tiger T616 vs Qualcomm Snapdragon 662
3
MediaTek Dimensity 1050 vs MediaTek Helio P65
4
Qualcomm Snapdragon 865 Plus vs Apple A14 Bionic
5
Qualcomm Snapdragon 7 Plus Gen 2 vs MediaTek Dimensity 1000
6
Unisoc SC9863A vs HiSilicon Kirin 930
7
MediaTek Dimensity 720 vs MediaTek Dimensity 800U
8
Samsung Exynos 2200 vs MediaTek Dimensity 1080
9
Qualcomm Snapdragon 865 vs MediaTek Dimensity 820
10
MediaTek Dimensity 8020 vs MediaTek Helio G35