HiSilicon Kirin 710A vs MediaTek Dimensity 900
The HiSilicon Kirin 710A and the MediaTek Dimensity 900 are two processors with different specifications. Let's compare them.
In terms of CPU cores and architecture, the Kirin 710A has 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Dimensity 900 has 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 900 has higher clock speeds and a more powerful architecture.
Both processors have 8 cores and use the ARMv8 instruction set. However, the Dimensity 900 has a higher number of transistors with 10000 million compared to the Kirin 710A's 5500 million. This suggests that the Dimensity 900 may offer superior performance and efficiency.
Another point of differentiation is the lithography. The Kirin 710A is built on a 14 nm process, while the Dimensity 900 is built on a more advanced 6 nm process. This implies that the Dimensity 900 may have better power efficiency and heat management.
In terms of thermal design power (TDP), the Kirin 710A has a lower TDP of 5 Watts compared to the Dimensity 900's 10 Watts. This suggests that the Kirin 710A may consume less power and generate less heat, making it suitable for devices that prioritize battery life.
Additionally, the Dimensity 900 includes a Neural Processing Unit (NPU) for AI-related tasks, providing added capabilities for tasks such as image recognition and natural language processing. The Kirin 710A does not have this feature.
In summary, the MediaTek Dimensity 900 outperforms the HiSilicon Kirin 710A in several aspects. With higher clock speeds, more advanced lithography, a higher number of transistors, and the inclusion of an NPU, the Dimensity 900 offers superior performance, efficiency, and AI capabilities. However, the Kirin 710A has a lower power consumption and may be suitable for battery-conscious devices.
In terms of CPU cores and architecture, the Kirin 710A has 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Dimensity 900 has 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 900 has higher clock speeds and a more powerful architecture.
Both processors have 8 cores and use the ARMv8 instruction set. However, the Dimensity 900 has a higher number of transistors with 10000 million compared to the Kirin 710A's 5500 million. This suggests that the Dimensity 900 may offer superior performance and efficiency.
Another point of differentiation is the lithography. The Kirin 710A is built on a 14 nm process, while the Dimensity 900 is built on a more advanced 6 nm process. This implies that the Dimensity 900 may have better power efficiency and heat management.
In terms of thermal design power (TDP), the Kirin 710A has a lower TDP of 5 Watts compared to the Dimensity 900's 10 Watts. This suggests that the Kirin 710A may consume less power and generate less heat, making it suitable for devices that prioritize battery life.
Additionally, the Dimensity 900 includes a Neural Processing Unit (NPU) for AI-related tasks, providing added capabilities for tasks such as image recognition and natural language processing. The Kirin 710A does not have this feature.
In summary, the MediaTek Dimensity 900 outperforms the HiSilicon Kirin 710A in several aspects. With higher clock speeds, more advanced lithography, a higher number of transistors, and the inclusion of an NPU, the Dimensity 900 offers superior performance, efficiency, and AI capabilities. However, the Kirin 710A has a lower power consumption and may be suitable for battery-conscious devices.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 14 nm | 6 nm |
| Number of transistors | 5500 million | 10000 million |
| TDP | 5 Watt | 10 Watt |
| Neural Processing | NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 16 GB |
| Memory type | LPDDR4 | LPDDR5 |
| Memory frequency | 1866 MHz | 3200 MHz |
| Memory-bus | 2x32 bit | 4x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G68 MP4 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 1000 MHz | 900 MHz |
| Execution units | 4 | 4 |
| Shaders | 64 | 64 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.0 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2520x1080@120Hz |
| Max camera resolution | 1x 48MP, 2x 24MP | 1x 108MP, 2x 20MP |
| Max Video Capture | 4K@30fps | 4K@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
| Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
| Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
| Bluetooth | 5.1 | 5.2 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2020 Quarter 4 | 2021 Quarter 1 |
| Partnumber | Hi6260 | MT6877 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Mid-end |
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