HiSilicon Kirin 710 vs Unisoc Tiger T710
When comparing the HiSilicon Kirin 710 and Unisoc Tiger T710 processors, it is clear that they both possess similar features. However, there are some notable differences in their specifications that set them apart.
Starting with the HiSilicon Kirin 710, it is equipped with a total of eight cores, divided into two clusters. The first cluster consists of four Cortex-A73 cores clocked at 2.2 GHz, while the second cluster contains four Cortex-A53 cores running at 1.7 GHz. This architecture allows for efficient multitasking and power management. The Kirin 710 uses the ARMv8-A instruction set, offering advanced features and capabilities. With a 12 nm lithography process and 5500 million transistors, this processor delivers excellent performance. Additionally, it operates at a TDP of 5 Watts, ensuring optimal power consumption for mobile devices.
On the other hand, the Unisoc Tiger T710 also features eight cores, divided into two clusters. The first cluster contains four Cortex-A75 cores clocked at 1.8 GHz, while the second cluster consists of four Cortex-A55 cores also running at 1.8 GHz. This architecture provides a balance between performance and power efficiency. The Tiger T710 utilizes the ARMv8.2-A instruction set, offering additional features compared to the Kirin 710. With a 12 nm lithography process, it offers comparable efficiency to the Kirin 710. Furthermore, the Tiger T710 includes dual neural processing units (NPU), which enhances its AI capabilities.
In summary, both processors offer similar core configurations and lithography capabilities. However, the HiSilicon Kirin 710 has a higher clock speed for its primary cores, while the Unisoc Tiger T710 features a newer ARMv8.2-A instruction set and dual NPUs for enhanced AI processing. The choice between the two processors ultimately depends on the specific requirements of the device and its intended usage.
Starting with the HiSilicon Kirin 710, it is equipped with a total of eight cores, divided into two clusters. The first cluster consists of four Cortex-A73 cores clocked at 2.2 GHz, while the second cluster contains four Cortex-A53 cores running at 1.7 GHz. This architecture allows for efficient multitasking and power management. The Kirin 710 uses the ARMv8-A instruction set, offering advanced features and capabilities. With a 12 nm lithography process and 5500 million transistors, this processor delivers excellent performance. Additionally, it operates at a TDP of 5 Watts, ensuring optimal power consumption for mobile devices.
On the other hand, the Unisoc Tiger T710 also features eight cores, divided into two clusters. The first cluster contains four Cortex-A75 cores clocked at 1.8 GHz, while the second cluster consists of four Cortex-A55 cores also running at 1.8 GHz. This architecture provides a balance between performance and power efficiency. The Tiger T710 utilizes the ARMv8.2-A instruction set, offering additional features compared to the Kirin 710. With a 12 nm lithography process, it offers comparable efficiency to the Kirin 710. Furthermore, the Tiger T710 includes dual neural processing units (NPU), which enhances its AI capabilities.
In summary, both processors offer similar core configurations and lithography capabilities. However, the HiSilicon Kirin 710 has a higher clock speed for its primary cores, while the Unisoc Tiger T710 features a newer ARMv8.2-A instruction set and dual NPUs for enhanced AI processing. The choice between the two processors ultimately depends on the specific requirements of the device and its intended usage.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 12 nm | 12 nm |
| Number of transistors | 5500 million | |
| TDP | 5 Watt | |
| Neural Processing | Dual NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 8 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 1866 MHz |
| Memory-bus | 2x32 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
| GPU name | Mali-G51 MP4 | Imagination PowerVR GM9446 |
| GPU Architecture | Mali Bifrost | PowerVR Rogue |
| GPU frequency | 1000 MHz | 800 MHz |
| Execution units | 4 | |
| Shaders | 64 | |
| DirectX | 12 | |
| OpenCL API | 2.0 | 4.0 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.1 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | |
| Max camera resolution | 1x 40MP, 2x 24MP | 1x 24MP |
| Max Video Capture | 4K@30fps | |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
| Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
| Bluetooth | 4.2 | 5.0 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2018 Quarter 3 | 2019 |
| Partnumber | Hi6260 | T710 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Mid-end |
Popular comparisons:
1
Samsung Exynos 2200 vs Qualcomm Snapdragon 8 Gen 2
2
MediaTek Helio G81 vs MediaTek Helio P35
3
MediaTek Dimensity 820 vs MediaTek Dimensity 900
4
Qualcomm Snapdragon 732G vs HiSilicon Kirin 9000 5G
5
Qualcomm Snapdragon 435 vs Qualcomm Snapdragon 7s Gen 3
6
Unisoc Tiger T310 vs MediaTek Dimensity 7060
7
Samsung Exynos 7870 vs MediaTek Dimensity 7200
8
Samsung Exynos 2500 vs Google Tensor G5
9
MediaTek Dimensity 700 vs HiSilicon Kirin 810
10
Google Tensor G1 vs Qualcomm Snapdragon 768G