HiSilicon Kirin 710F vs HiSilicon Kirin 970
The HiSilicon Kirin 710F and Kirin 970 are both powerful processors designed by HiSilicon. While they share some similarities, they also have notable differences in their specifications.
Starting with the Kirin 710F, this processor features an architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it offers a balanced performance for various tasks. The processor is based on the ARMv8-A instruction set and has a lithography of 12 nm. It contains approximately 5500 million transistors and operates within a TDP of 5 Watts.
On the other hand, the Kirin 970 boasts a slightly higher clock speed with 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. Similar to the Kirin 710F, it also possesses 8 cores and follows the ARMv8-A instruction set. It has a smaller lithography of 10 nm, indicating a more advanced manufacturing process. The Kirin 970 incorporates approximately 5500 million transistors and has a higher TDP of 9 Watts. Additionally, it features Neural Processing with the HiSilicon NPU, enabling AI-related functionality.
In summary, the Kirin 710F and Kirin 970 both offer powerful performance with 8 cores and ARMv8-A instruction set compatibility. The Kirin 970 stands out with a slightly higher clock speed, a more advanced lithography process, and the inclusion of the HiSilicon NPU for neural processing tasks. However, the Kirin 710F operates at a lower TDP, which may be advantageous in mobile devices that require more efficient power consumption.
Ultimately, the choice between these two processors depends on the specific requirements and priorities of the device or application they will be used in.
Starting with the Kirin 710F, this processor features an architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it offers a balanced performance for various tasks. The processor is based on the ARMv8-A instruction set and has a lithography of 12 nm. It contains approximately 5500 million transistors and operates within a TDP of 5 Watts.
On the other hand, the Kirin 970 boasts a slightly higher clock speed with 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. Similar to the Kirin 710F, it also possesses 8 cores and follows the ARMv8-A instruction set. It has a smaller lithography of 10 nm, indicating a more advanced manufacturing process. The Kirin 970 incorporates approximately 5500 million transistors and has a higher TDP of 9 Watts. Additionally, it features Neural Processing with the HiSilicon NPU, enabling AI-related functionality.
In summary, the Kirin 710F and Kirin 970 both offer powerful performance with 8 cores and ARMv8-A instruction set compatibility. The Kirin 970 stands out with a slightly higher clock speed, a more advanced lithography process, and the inclusion of the HiSilicon NPU for neural processing tasks. However, the Kirin 710F operates at a lower TDP, which may be advantageous in mobile devices that require more efficient power consumption.
Ultimately, the choice between these two processors depends on the specific requirements and priorities of the device or application they will be used in.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8-A |
| Lithography | 12 nm | 10 nm |
| Number of transistors | 5500 million | 5500 million |
| TDP | 5 Watt | 9 Watt |
| Neural Processing | HiSilicon NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 8 GB |
| Memory type | LPDDR4 | LPDDR4 |
| Memory frequency | 1866 MHz | 1866 MHz |
| Memory-bus | 2x32 bit | 4x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G72 MP12 |
| GPU Architecture | Mali Bifrost | Mali Bifrost |
| GPU frequency | 1000 MHz | 750 MHz |
| Execution units | 4 | 12 |
| Shaders | 64 | 192 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.0 |
| Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2340x1080 |
| Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 20MP |
| Max Video Capture | 4K@30fps | |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 1.2 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
| Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
| Bluetooth | 4.2 | 4.2 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2019 Quarter 1 | 2017 September |
| Partnumber | Hi6260 | Hi3670 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Flagship |
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