HiSilicon Kirin 710 vs Unisoc Tiger T616
The HiSilicon Kirin 710 and Unisoc Tiger T616 are both processors used in mobile devices, but they have some notable differences in their specifications.
In terms of CPU cores and architecture, the Kirin 710 features 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This combination of high-performing and power-efficient cores allows for a balanced performance across different tasks. On the other hand, the Tiger T616 has 2x 2.0 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. This architecture places more emphasis on performance with its high-performing cores.
Both processors have 8 cores in total, but the Kirin 710 uses a combination of different cores for better power management and overall efficiency, while the Tiger T616 focuses more on raw performance with its higher clock speeds.
In terms of instruction set, the Kirin 710 utilizes the ARMv8-A instruction set, which is a commonly used and well-established set of instructions. The Tiger T616, on the other hand, uses the ARMv8.2-A instruction set, which is a newer version of the ARM architecture.
Both processors have a similar lithography at 12 nm, which refers to the size of their transistors. A smaller lithography generally means more transistors can be packed into a smaller area, allowing for better performance and power efficiency.
In terms of power consumption, the Kirin 710 has a TDP (Thermal Design Power) of 5 Watts, indicating that it is designed to be power-efficient. The Tiger T616 has a TDP of 10 Watts, suggesting that it may consume more power under load.
In summary, the HiSilicon Kirin 710 and Unisoc Tiger T616 processors have their own strengths and weaknesses. The Kirin 710 offers a balance between performance and power efficiency with its combination of Cortex-A73 and Cortex-A53 cores, while the Tiger T616 focuses more on high performance with its Cortex-A75 and Cortex-A55 cores. Both processors are built on a 12 nm lithography, but the Kirin 710 has a lower TDP, indicating better power efficiency.
In terms of CPU cores and architecture, the Kirin 710 features 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This combination of high-performing and power-efficient cores allows for a balanced performance across different tasks. On the other hand, the Tiger T616 has 2x 2.0 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. This architecture places more emphasis on performance with its high-performing cores.
Both processors have 8 cores in total, but the Kirin 710 uses a combination of different cores for better power management and overall efficiency, while the Tiger T616 focuses more on raw performance with its higher clock speeds.
In terms of instruction set, the Kirin 710 utilizes the ARMv8-A instruction set, which is a commonly used and well-established set of instructions. The Tiger T616, on the other hand, uses the ARMv8.2-A instruction set, which is a newer version of the ARM architecture.
Both processors have a similar lithography at 12 nm, which refers to the size of their transistors. A smaller lithography generally means more transistors can be packed into a smaller area, allowing for better performance and power efficiency.
In terms of power consumption, the Kirin 710 has a TDP (Thermal Design Power) of 5 Watts, indicating that it is designed to be power-efficient. The Tiger T616 has a TDP of 10 Watts, suggesting that it may consume more power under load.
In summary, the HiSilicon Kirin 710 and Unisoc Tiger T616 processors have their own strengths and weaknesses. The Kirin 710 offers a balance between performance and power efficiency with its combination of Cortex-A73 and Cortex-A53 cores, while the Tiger T616 focuses more on high performance with its Cortex-A75 and Cortex-A55 cores. Both processors are built on a 12 nm lithography, but the Kirin 710 has a lower TDP, indicating better power efficiency.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.0 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 6 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP1 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 750 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 1 |
Shaders | 64 | 16 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2400x1080 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 64MP, 2x 32MP |
Max Video Capture | FullHD@60fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2021 |
Partnumber | Hi6260 | T616 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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