HiSilicon Kirin 960 vs Unisoc Tanggula T760 5G

VS
The HiSilicon Kirin 960 and the Unisoc Tanggula T760 5G are two processors with notable specifications that set them apart in terms of performance and capabilities.

Starting with the HiSilicon Kirin 960, it features a CPU architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With a total of eight cores, it offers sufficient processing power for multitasking and resource-intensive tasks. The processor utilizes the ARMv8-A instruction set, allowing for efficient processing of complex instructions. Additionally, it has a lithography of 16 nm, resulting in reduced power consumption and enhanced energy efficiency. The Kirin 960 has 4000 million transistors, enabling faster data processing and improved performance overall. It has a TDP (thermal design power) of 5 Watts, indicating a moderate power usage level.

On the other hand, the Unisoc Tanggula T760 5G features a CPU architecture with 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. Like the Kirin 960, it also incorporates eight cores, ensuring smooth operation and effective multitasking. The T760 5G utilizes the ARMv8.2-A instruction set, which offers improved performance and supports advanced features. Notably, it has a smaller lithography of 6 nm, indicating a more advanced manufacturing process, resulting in better power efficiency and reduced heat generation. Additionally, the T760 5G incorporates a Neural Processing Unit (NPU) for enhanced artificial intelligence capabilities, allowing for tasks such as facial recognition and adaptive learning. It also has a TDP of 5 Watts.

In summary, the HiSilicon Kirin 960 and the Unisoc Tanggula T760 5G have distinct specifications that contribute to their individual strengths. While the Kirin 960 boasts a larger number of transistors and a proven architecture, the T760 5G offers a more advanced lithography and includes an NPU for AI tasks. Ultimately, the choice between the two processors would depend on the priorities and requirements of the intended use case.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 16 nm 6 nm
Number of transistors 4000 million
TDP 5 Watt 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G71 MP8 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 900 MHz 850 MHz
Execution units 8 6
Shaders 128 96
DirectX 11.3 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2160x1080
Max camera resolution 1x 20MP, 2x 12MP 1x 64MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.7 Gbps
Peak Upload Speed 0.15 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2016 October 2021 February
Partnumber Hi3660 T760
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 960
253892
Tanggula T760 5G
243570

GeekBench 6 Single-Core

Score
Kirin 960
382
Tanggula T760 5G
559

GeekBench 6 Multi-Core

Score
Kirin 960
1544
Tanggula T760 5G
2249