HiSilicon Kirin 960 vs Unisoc Tanggula T760 5G
The HiSilicon Kirin 960 and the Unisoc Tanggula T760 5G are two processors with notable specifications that set them apart in terms of performance and capabilities.
Starting with the HiSilicon Kirin 960, it features a CPU architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With a total of eight cores, it offers sufficient processing power for multitasking and resource-intensive tasks. The processor utilizes the ARMv8-A instruction set, allowing for efficient processing of complex instructions. Additionally, it has a lithography of 16 nm, resulting in reduced power consumption and enhanced energy efficiency. The Kirin 960 has 4000 million transistors, enabling faster data processing and improved performance overall. It has a TDP (thermal design power) of 5 Watts, indicating a moderate power usage level.
On the other hand, the Unisoc Tanggula T760 5G features a CPU architecture with 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. Like the Kirin 960, it also incorporates eight cores, ensuring smooth operation and effective multitasking. The T760 5G utilizes the ARMv8.2-A instruction set, which offers improved performance and supports advanced features. Notably, it has a smaller lithography of 6 nm, indicating a more advanced manufacturing process, resulting in better power efficiency and reduced heat generation. Additionally, the T760 5G incorporates a Neural Processing Unit (NPU) for enhanced artificial intelligence capabilities, allowing for tasks such as facial recognition and adaptive learning. It also has a TDP of 5 Watts.
In summary, the HiSilicon Kirin 960 and the Unisoc Tanggula T760 5G have distinct specifications that contribute to their individual strengths. While the Kirin 960 boasts a larger number of transistors and a proven architecture, the T760 5G offers a more advanced lithography and includes an NPU for AI tasks. Ultimately, the choice between the two processors would depend on the priorities and requirements of the intended use case.
Starting with the HiSilicon Kirin 960, it features a CPU architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With a total of eight cores, it offers sufficient processing power for multitasking and resource-intensive tasks. The processor utilizes the ARMv8-A instruction set, allowing for efficient processing of complex instructions. Additionally, it has a lithography of 16 nm, resulting in reduced power consumption and enhanced energy efficiency. The Kirin 960 has 4000 million transistors, enabling faster data processing and improved performance overall. It has a TDP (thermal design power) of 5 Watts, indicating a moderate power usage level.
On the other hand, the Unisoc Tanggula T760 5G features a CPU architecture with 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. Like the Kirin 960, it also incorporates eight cores, ensuring smooth operation and effective multitasking. The T760 5G utilizes the ARMv8.2-A instruction set, which offers improved performance and supports advanced features. Notably, it has a smaller lithography of 6 nm, indicating a more advanced manufacturing process, resulting in better power efficiency and reduced heat generation. Additionally, the T760 5G incorporates a Neural Processing Unit (NPU) for enhanced artificial intelligence capabilities, allowing for tasks such as facial recognition and adaptive learning. It also has a TDP of 5 Watts.
In summary, the HiSilicon Kirin 960 and the Unisoc Tanggula T760 5G have distinct specifications that contribute to their individual strengths. While the Kirin 960 boasts a larger number of transistors and a proven architecture, the T760 5G offers a more advanced lithography and includes an NPU for AI tasks. Ultimately, the choice between the two processors would depend on the priorities and requirements of the intended use case.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | 5 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G57 MP6 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 900 MHz | 850 MHz |
Execution units | 8 | 6 |
Shaders | 128 | 96 |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080 | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 64MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2016 October | 2021 February |
Partnumber | Hi3660 | T760 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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