HiSilicon Kirin 710 vs Unisoc Tiger T310
The HiSilicon Kirin 710 and Unisoc Tiger T310 are two processors with distinct specifications.
In terms of CPU cores and architecture, the Kirin 710 features 8 cores with an architecture of 4x 2.2 GHz - Cortex-A73 and 4x 1.7 GHz - Cortex-A53. On the other hand, the Tiger T310 has 4 cores with an architecture of 1x 2 GHz - Cortex-A75 and 3x 1.8 GHz - Cortex-A55. This indicates that the Kirin 710 offers a higher number of cores, which may contribute to better multitasking capabilities.
Regarding the instruction set, the Kirin 710 is equipped with ARMv8-A, while the Tiger T310 features ARMv8.2-A. Although the Tiger T310 incorporates a more advanced instruction set, it is worth noting that the Kirin 710 is not far behind and continues to provide efficient performance.
Both processors have a lithography of 12 nm, indicating a relatively advanced manufacturing process. This ensures efficiency and power savings, leading to enhanced battery life for devices utilizing these processors.
When considering the number of transistors, the Kirin 710 boasts 5,500 million transistors. In contrast, information regarding the number of transistors for the Tiger T310 is not provided. However, it is expected that the Tiger T310 contains a lower number of transistors due to its smaller number of cores.
Lastly, the TDP (Thermal Design Power) of the Kirin 710 is 5 Watts. Information regarding the TDP for the Tiger T310 is not available.
Overall, the HiSilicon Kirin 710 and Unisoc Tiger T310 have different specifications that cater to varying user needs. The Kirin 710 offers a higher number of cores and a considerable number of transistors, potentially resulting in superior multitasking capabilities. However, the Tiger T310 features an advanced instruction set. Both processors share a 12 nm lithography, indicating efficient power consumption. It is important to consider these specifications when choosing the appropriate processor for specific device requirements.
In terms of CPU cores and architecture, the Kirin 710 features 8 cores with an architecture of 4x 2.2 GHz - Cortex-A73 and 4x 1.7 GHz - Cortex-A53. On the other hand, the Tiger T310 has 4 cores with an architecture of 1x 2 GHz - Cortex-A75 and 3x 1.8 GHz - Cortex-A55. This indicates that the Kirin 710 offers a higher number of cores, which may contribute to better multitasking capabilities.
Regarding the instruction set, the Kirin 710 is equipped with ARMv8-A, while the Tiger T310 features ARMv8.2-A. Although the Tiger T310 incorporates a more advanced instruction set, it is worth noting that the Kirin 710 is not far behind and continues to provide efficient performance.
Both processors have a lithography of 12 nm, indicating a relatively advanced manufacturing process. This ensures efficiency and power savings, leading to enhanced battery life for devices utilizing these processors.
When considering the number of transistors, the Kirin 710 boasts 5,500 million transistors. In contrast, information regarding the number of transistors for the Tiger T310 is not provided. However, it is expected that the Tiger T310 contains a lower number of transistors due to its smaller number of cores.
Lastly, the TDP (Thermal Design Power) of the Kirin 710 is 5 Watts. Information regarding the TDP for the Tiger T310 is not available.
Overall, the HiSilicon Kirin 710 and Unisoc Tiger T310 have different specifications that cater to varying user needs. The Kirin 710 offers a higher number of cores and a considerable number of transistors, potentially resulting in superior multitasking capabilities. However, the Tiger T310 features an advanced instruction set. Both processors share a 12 nm lithography, indicating efficient power consumption. It is important to consider these specifications when choosing the appropriate processor for specific device requirements.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 2 GHz – Cortex-A75 3x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1333 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G51 MP4 | Imagination PowerVR GE8300 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 650 MHz | 660 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 12 | 10 |
OpenCL API | 2.0 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 1600x720 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 16MP + 1x 8MP |
Max Video Capture | FullHD@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2019 April |
Partnumber | Hi6260 | T310 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
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