HiSilicon Kirin 930 vs Unisoc Tiger T616
The HiSilicon Kirin 930 and Unisoc Tiger T616 are two processors with distinct specifications and capabilities.
Starting with the HiSilicon Kirin 930, it features a total of eight cores. The architecture consists of four Cortex-A53 cores running at 2 GHz and four Cortex-A53 cores running at 1.5 GHz. This provides a balance between high-performance tasks and power efficiency. The processor is based on the ARMv8-A instruction set and has a lithography size of 28 nm. Additionally, it boasts a substantial number of transistors, totaling 1000 million. The TDP (Thermal Design Power) of the Kirin 930 is rated at 5 Watts, ensuring efficient power consumption.
On the other hand, the Unisoc Tiger T616 also offers eight cores. However, its architecture is slightly different. It consists of two Cortex-A75 cores running at 2.0 GHz and six Cortex-A55 cores running at 1.8 GHz. This configuration allows for enhanced high-performance capabilities while still maintaining power efficiency. The instruction set used by the T616 is ARMv8.2-A, which ensures compatibility with the latest software and applications. The lithography size is smaller, at 12 nm, indicating a more advanced manufacturing process. The TDP of the Tiger T616 is rated at 10 Watts, slightly higher than the Kirin 930.
In summary, while both processors have eight cores, they differ in their core arrangement and clock speeds. The HiSilicon Kirin 930 utilizes the Cortex-A53 cores for a balanced performance, featuring a 28 nm lithography and a TDP of 5 Watts. Conversely, the Unisoc Tiger T616 combines the powerful Cortex-A75 cores with more energy-efficient Cortex-A55 cores, boasting a 12 nm lithography and a TDP of 10 Watts. The specific requirements of a user will determine which processor is more suitable for their needs.
Starting with the HiSilicon Kirin 930, it features a total of eight cores. The architecture consists of four Cortex-A53 cores running at 2 GHz and four Cortex-A53 cores running at 1.5 GHz. This provides a balance between high-performance tasks and power efficiency. The processor is based on the ARMv8-A instruction set and has a lithography size of 28 nm. Additionally, it boasts a substantial number of transistors, totaling 1000 million. The TDP (Thermal Design Power) of the Kirin 930 is rated at 5 Watts, ensuring efficient power consumption.
On the other hand, the Unisoc Tiger T616 also offers eight cores. However, its architecture is slightly different. It consists of two Cortex-A75 cores running at 2.0 GHz and six Cortex-A55 cores running at 1.8 GHz. This configuration allows for enhanced high-performance capabilities while still maintaining power efficiency. The instruction set used by the T616 is ARMv8.2-A, which ensures compatibility with the latest software and applications. The lithography size is smaller, at 12 nm, indicating a more advanced manufacturing process. The TDP of the Tiger T616 is rated at 10 Watts, slightly higher than the Kirin 930.
In summary, while both processors have eight cores, they differ in their core arrangement and clock speeds. The HiSilicon Kirin 930 utilizes the Cortex-A53 cores for a balanced performance, featuring a 28 nm lithography and a TDP of 5 Watts. Conversely, the Unisoc Tiger T616 combines the powerful Cortex-A75 cores with more energy-efficient Cortex-A55 cores, boasting a 12 nm lithography and a TDP of 10 Watts. The specific requirements of a user will determine which processor is more suitable for their needs.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.0 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 12 nm |
Number of transistors | 1000 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 6 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP1 |
GPU Architecture | Midgard | Bifrost |
GPU frequency | 600 MHz | 750 MHz |
Execution units | 4 | 1 |
Shaders | 64 | 16 |
DirectX | 11 | 11 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2400x1080 |
Max camera resolution | 1x 20MP | 1x 64MP, 2x 32MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.05 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 |
Partnumber | Hi3630 | T616 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
Popular comparisons:
1
MediaTek Helio G90 vs Qualcomm Snapdragon 732G
2
MediaTek Dimensity 1100 vs Google Tensor G2
3
Unisoc Tiger T616 vs HiSilicon Kirin 710A
4
MediaTek Helio P35 vs MediaTek Helio G35
5
Qualcomm Snapdragon 778G Plus vs Apple A14 Bionic
6
Qualcomm Snapdragon 750G vs HiSilicon Kirin 810
7
Qualcomm Snapdragon 6 Gen 1 vs Qualcomm Snapdragon 888
8
MediaTek Dimensity 800U vs Qualcomm Snapdragon 8 Plus Gen 1
9
MediaTek Helio G70 vs Apple A10X Fusion
10
Apple A15 Bionic vs Qualcomm Snapdragon 662