HiSilicon Kirin 710 vs Unisoc Tanggula T760 5G

The HiSilicon Kirin 710 and Unisoc Tanggula T760 5G are two processors with different specifications.

Starting with the HiSilicon Kirin 710, it features an architecture composed of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, this processor utilizes the ARMv8-A instruction set. It has a lithography of 12 nm, which refers to the size of the transistors on the chip. The Kirin 710 is equipped with 5500 million transistors and operates at a TDP of 5 Watts.

On the other hand, the Unisoc Tanggula T760 5G features an architecture that consists of 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. Like the Kirin 710, it also has 8 cores and follows the ARMv8.2-A instruction set. However, the Tanggula T760 operates at a smaller lithography of 6 nm, indicating a more advanced manufacturing process. It also has a TDP of 5 Watts but boasts an additional feature of a Neural Processing Unit (NPU).

When comparing the two processors, it is evident that the Tanggula T760 has a newer and more advanced architecture with Cortex-A76 and Cortex-A55 cores compared to the Kirin 710's Cortex-A73 and Cortex-A53 cores. Additionally, the Tanggula T760's 6 nm lithography suggests improved power efficiency and potentially better performance. The inclusion of an NPU in the Tanggula T760 also indicates its ability to handle AI tasks more efficiently.

While both processors have similar TDP values, the specifications of the Tanggula T760 suggest a more powerful and efficient processor overall. However, it is important to note that the real-world performance of these processors can vary depending on other factors such as software optimization and device implementation.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 6 nm
Number of transistors 5500 million
TDP 5 Watt 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit


Storage specification UFS 2.1 UFS 3.1


GPU name Mali-G51 MP4 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 850 MHz
GPU boost frequency 1000 MHz
Execution units 4 6
Shaders 64 96
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2160x1080
Max camera resolution 1x 40MP, 2x 24MP 1x 64MP, 2x 24MP
Max Video Capture FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.7 Gbps
Peak Upload Speed 0.15 Gbps 1.5 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2018 Quarter 3 2021 February
Partnumber Hi6260 T760
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710
Tanggula T760 5G

GeekBench 6 Single-Core

Kirin 710
Tanggula T760 5G

GeekBench 6 Multi-Core

Kirin 710
Tanggula T760 5G