HiSilicon Kirin 710 vs HiSilicon Kirin 985 5G
The HiSilicon Kirin 710 and HiSilicon Kirin 985 5G are both processors designed by HiSilicon Technologies Co., Ltd. for mobile devices. While they have some similarities, there are also distinct differences in their specifications.
Starting with the HiSilicon Kirin 710, it features an architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, this processor offers a balanced combination of performance and power efficiency. The instruction set is ARMv8-A, providing compatibility with the latest software. It is built on a 12 nm lithography process, meaning it utilizes smaller transistors and offers improved power efficiency. With a TDP of 5 Watts, it is designed to consume less power while still delivering decent performance.
On the other hand, the HiSilicon Kirin 985 5G offers a more advanced set of specifications. It has an architecture that consists of 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores, providing a diverse blend of high-performance and power-efficient cores. Like the Kirin 710, it also has 8 cores and an ARMv8.2-A instruction set. However, the Kirin 985 5G offers a further advantage with its 7 nm lithography process, allowing for even greater power efficiency and performance compared to the Kirin 710. With a slightly higher TDP of 6 Watts, it still maintains a relatively low power consumption.
Additionally, the Kirin 985 5G includes Neural Processing units such as Ascend D110 Lite and Ascend D100 Tiny, which utilize the HUAWEI Da Vinci Architecture. This provides enhanced capabilities for artificial intelligence and machine learning tasks, making the processor an ideal choice for AI-enabled applications.
In summary, while the HiSilicon Kirin 710 is a capable processor with a balanced mix of performance and power efficiency, the HiSilicon Kirin 985 5G offers a more advanced set of specifications. With a more diverse and powerful combination of CPU cores, a more advanced lithography process, and additional neural processing capabilities, the Kirin 985 5G is better suited for demanding tasks and AI applications.
Starting with the HiSilicon Kirin 710, it features an architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, this processor offers a balanced combination of performance and power efficiency. The instruction set is ARMv8-A, providing compatibility with the latest software. It is built on a 12 nm lithography process, meaning it utilizes smaller transistors and offers improved power efficiency. With a TDP of 5 Watts, it is designed to consume less power while still delivering decent performance.
On the other hand, the HiSilicon Kirin 985 5G offers a more advanced set of specifications. It has an architecture that consists of 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores, providing a diverse blend of high-performance and power-efficient cores. Like the Kirin 710, it also has 8 cores and an ARMv8.2-A instruction set. However, the Kirin 985 5G offers a further advantage with its 7 nm lithography process, allowing for even greater power efficiency and performance compared to the Kirin 710. With a slightly higher TDP of 6 Watts, it still maintains a relatively low power consumption.
Additionally, the Kirin 985 5G includes Neural Processing units such as Ascend D110 Lite and Ascend D100 Tiny, which utilize the HUAWEI Da Vinci Architecture. This provides enhanced capabilities for artificial intelligence and machine learning tasks, making the processor an ideal choice for AI-enabled applications.
In summary, while the HiSilicon Kirin 710 is a capable processor with a balanced mix of performance and power efficiency, the HiSilicon Kirin 985 5G offers a more advanced set of specifications. With a more diverse and powerful combination of CPU cores, a more advanced lithography process, and additional neural processing capabilities, the Kirin 985 5G is better suited for demanding tasks and AI applications.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.0 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G77 MP8 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 700 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 8 |
Shaders | 64 | 128 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 3120x1440 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fp | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.4 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2020 Quarter 2 |
Partnumber | Hi6260 | Hi6290 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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