HiSilicon Kirin 710 vs HiSilicon Kirin 9000E 5G

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The HiSilicon Kirin 710 and the HiSilicon Kirin 9000E 5G are two processors with distinct specifications, each designed for different purposes and capabilities.

Starting with the HiSilicon Kirin 710, it features an architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This processor utilizes the ARMv8-A instruction set and is built on a 12-nanometer lithography. With a total of 8 cores, it offers a balance between power and efficiency. The Kirin 710 has a total of 5,500 million transistors and has a TDP of 5 Watts.

On the other hand, the HiSilicon Kirin 9000E 5G has a more advanced architecture. It is equipped with 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. These cores, based on the ARMv8.2-A instruction set, support high-performance processing. With its 5-nanometer lithography, the Kirin 9000E 5G offers better power efficiency and performance. It boasts a significant increase in the number of transistors at 15,300 million compared to the Kirin 710. Additionally, it has a TDP of 6 Watts and incorporates advanced neural processing capabilities with Ascend Lite, Ascend Tiny, and HUAWEI Da Vinci Architecture 2.0.

In terms of performance, the Kirin 9000E 5G outperforms the Kirin 710 due to its advanced architecture, higher clock speeds, and increased number of transistors. Its 5G capabilities also make it more future-proof and suitable for the latest connectivity standards. The Kirin 9000E 5G is designed for flagship devices and demanding tasks, while the Kirin 710 is more suited for mid-range smartphones and everyday usage.

In conclusion, the HiSilicon Kirin 710 and the HiSilicon Kirin 9000E 5G offer different levels of performance and capabilities. While the Kirin 710 provides a sufficient balance of power and efficiency for mid-range devices, the Kirin 9000E 5G excels in terms of processing power, energy efficiency, and advanced features, making it suitable for high-end smartphones and demanding tasks.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 5 nm
Number of transistors 5500 million 15300 million
TDP 5 Watt 6 Watt
Neural Processing Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 2750 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G51 MP4 Mali-G78 MP22
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 760 MHz
GPU boost frequency 1000 MHz
Execution units 4 22
Shaders 64 352
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 3840x2160
Max camera resolution 1x 40MP, 2x 24MP
Max Video Capture 4K@60fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 4.6 Gbps
Peak Upload Speed 0.15 Gbps 2.5 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC

Supplemental Information

Launch Date 2018 Quarter 3 2020 October
Partnumber Hi6260
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 710
195573
Kirin 9000E 5G
737022

GeekBench 6 Single-Core

Score
Kirin 710
329
Kirin 9000E 5G
1059

GeekBench 6 Multi-Core

Score
Kirin 710
1341
Kirin 9000E 5G
3702