HiSilicon Kirin 710 vs HiSilicon Kirin 9000E 5G

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The HiSilicon Kirin 710 and the HiSilicon Kirin 9000E 5G are two processors with distinct specifications, each designed for different purposes and capabilities.

Starting with the HiSilicon Kirin 710, it features an architecture consisting of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This processor utilizes the ARMv8-A instruction set and is built on a 12-nanometer lithography. With a total of 8 cores, it offers a balance between power and efficiency. The Kirin 710 has a total of 5,500 million transistors and has a TDP of 5 Watts.

On the other hand, the HiSilicon Kirin 9000E 5G has a more advanced architecture. It is equipped with 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. These cores, based on the ARMv8.2-A instruction set, support high-performance processing. With its 5-nanometer lithography, the Kirin 9000E 5G offers better power efficiency and performance. It boasts a significant increase in the number of transistors at 15,300 million compared to the Kirin 710. Additionally, it has a TDP of 6 Watts and incorporates advanced neural processing capabilities with Ascend Lite, Ascend Tiny, and HUAWEI Da Vinci Architecture 2.0.

In terms of performance, the Kirin 9000E 5G outperforms the Kirin 710 due to its advanced architecture, higher clock speeds, and increased number of transistors. Its 5G capabilities also make it more future-proof and suitable for the latest connectivity standards. The Kirin 9000E 5G is designed for flagship devices and demanding tasks, while the Kirin 710 is more suited for mid-range smartphones and everyday usage.

In conclusion, the HiSilicon Kirin 710 and the HiSilicon Kirin 9000E 5G offer different levels of performance and capabilities. While the Kirin 710 provides a sufficient balance of power and efficiency for mid-range devices, the Kirin 9000E 5G excels in terms of processing power, energy efficiency, and advanced features, making it suitable for high-end smartphones and demanding tasks.

CPU cores and architecture

Architecture	4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53	1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8-A	ARMv8.2-A
Lithography	12 nm	5 nm
Number of transistors	5500 million	15300 million
TDP	5 Watt	6 Watt
Neural Processing		Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount	up to 6 GB	up to 16 GB
Memory type	LPDDR4	LPDDR5
Memory frequency	1866 MHz	2750 MHz
Memory-bus	2x32 bit	4x16 bit

Storage

Storage specification

UFS 2.1

UFS 3.1

Graphics

GPU name	Mali-G51 MP4	Mali-G78 MP22
GPU Architecture	Bifrost	Valhall
GPU frequency	650 MHz	760 MHz
GPU boost frequency	1000 MHz
Execution units	4	22
Shaders	64	352
DirectX	12	12
OpenCL API	2.0	2.1
OpenGL API		ES 3.2
Vulkan API	1.0	1.2

Camera, Video, Display

Max screen resolution	2340x1080	3840x2160
Max camera resolution	1x 40MP, 2x 24MP
Max Video Capture		4K@60fps
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC) VP8 VP9

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	0.6 Gbps	4.6 Gbps
Peak Upload Speed	0.15 Gbps	2.5 Gbps
Wi-Fi	4 (802.11n)	6 (802.11ax)
Bluetooth	4.2	5.2
Satellite navigation	BeiDou GPS GLONASS	BeiDou GPS Galileo GLONASS NavIC