HiSilicon Kirin 9000 5G vs Unisoc SC9832E

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The HiSilicon Kirin 9000 5G and Unisoc SC9832E are two processors with different specifications and capabilities.

Starting with the HiSilicon Kirin 9000 5G, it features a powerful architecture with a combination of cores. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This combination provides a balance between high-performance and power efficiency. The HiSilicon Kirin 9000 5G has a total of 8 cores and supports the ARMv8.2-A instruction set. It is built on the 5nm lithography process, making it a highly advanced and efficient processor. It is equipped with 15300 million transistors and has a TDP of 6 Watts. Additionally, it features Ascend Lite (2x) and Ascend Tiny (1x) neural processing capabilities, along with HUAWEI Da Vinci Architecture 2.0.

On the other hand, the Unisoc SC9832E has a simpler architecture compared to the HiSilicon Kirin 9000 5G. It consists of 4x 1.4 GHz Cortex-A53 cores. Although it has a lower number of cores, it still provides decent performance for everyday tasks. The Unisoc SC9832E supports the ARMv8-A instruction set and is built on the 28nm lithography process, which is not as advanced as the HiSilicon Kirin 9000 5G. It has a TDP of 7 Watts.

In summary, the HiSilicon Kirin 9000 5G and Unisoc SC9832E processors have distinct differences in their specifications. The HiSilicon Kirin 9000 5G offers a more advanced architecture with a higher number of cores and a smaller lithography process, resulting in better performance and power efficiency. On the other hand, the Unisoc SC9832E is a simpler processor with fewer cores and a larger lithography process, suitable for less demanding tasks. Ultimately, the choice between these processors depends on the specific needs and requirements of the user.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
4x 1.4 GHz – Cortex-A53
Number of cores 8 4
Instruction Set ARMv8.2-A ARMv8-A
Lithography 5 nm 28 nm
Number of transistors 15300 million
TDP 6 Watt 7 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 16 GB up to 2 GB
Memory type LPDDR5 LPDDR3
Memory frequency 2750 MHz 667 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 3.1 eMMC 5.1

Graphics

GPU name Mali-G78 MP24 Mali-T820 MP1
GPU Architecture Valhall Midgard
GPU frequency 760 MHz 680 MHz
Execution units 24 1
Shaders 384 4
DirectX 12 11
OpenCL API 2.1 1.2
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.0

Camera, Video, Display

Max screen resolution 3840x2160 1440x720
Max camera resolution 1x 13MP
Max Video Capture 4K@60fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 0.15 Gbps
Peak Upload Speed 2.5 Gbps 0.05 Gbps
Wi-Fi 6 (802.11ax) 4 (802.11n)
Bluetooth 5.2 4.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2020 October 2018
Vertical Segment Mobiles Mobiles
Positioning Flagship Low-end

AnTuTu 10

Total Score
Kirin 9000 5G
762886
SC9832E
55434

GeekBench 6 Single-Core

Score
Kirin 9000 5G
1062
SC9832E
98

GeekBench 6 Multi-Core

Score
Kirin 9000 5G
3724
SC9832E
455