HiSilicon Kirin 9000 5G vs Unisoc SC9832E
The HiSilicon Kirin 9000 5G and Unisoc SC9832E are two processors with different specifications and capabilities.
Starting with the HiSilicon Kirin 9000 5G, it features a powerful architecture with a combination of cores. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This combination provides a balance between high-performance and power efficiency. The HiSilicon Kirin 9000 5G has a total of 8 cores and supports the ARMv8.2-A instruction set. It is built on the 5nm lithography process, making it a highly advanced and efficient processor. It is equipped with 15300 million transistors and has a TDP of 6 Watts. Additionally, it features Ascend Lite (2x) and Ascend Tiny (1x) neural processing capabilities, along with HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc SC9832E has a simpler architecture compared to the HiSilicon Kirin 9000 5G. It consists of 4x 1.4 GHz Cortex-A53 cores. Although it has a lower number of cores, it still provides decent performance for everyday tasks. The Unisoc SC9832E supports the ARMv8-A instruction set and is built on the 28nm lithography process, which is not as advanced as the HiSilicon Kirin 9000 5G. It has a TDP of 7 Watts.
In summary, the HiSilicon Kirin 9000 5G and Unisoc SC9832E processors have distinct differences in their specifications. The HiSilicon Kirin 9000 5G offers a more advanced architecture with a higher number of cores and a smaller lithography process, resulting in better performance and power efficiency. On the other hand, the Unisoc SC9832E is a simpler processor with fewer cores and a larger lithography process, suitable for less demanding tasks. Ultimately, the choice between these processors depends on the specific needs and requirements of the user.
Starting with the HiSilicon Kirin 9000 5G, it features a powerful architecture with a combination of cores. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This combination provides a balance between high-performance and power efficiency. The HiSilicon Kirin 9000 5G has a total of 8 cores and supports the ARMv8.2-A instruction set. It is built on the 5nm lithography process, making it a highly advanced and efficient processor. It is equipped with 15300 million transistors and has a TDP of 6 Watts. Additionally, it features Ascend Lite (2x) and Ascend Tiny (1x) neural processing capabilities, along with HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc SC9832E has a simpler architecture compared to the HiSilicon Kirin 9000 5G. It consists of 4x 1.4 GHz Cortex-A53 cores. Although it has a lower number of cores, it still provides decent performance for everyday tasks. The Unisoc SC9832E supports the ARMv8-A instruction set and is built on the 28nm lithography process, which is not as advanced as the HiSilicon Kirin 9000 5G. It has a TDP of 7 Watts.
In summary, the HiSilicon Kirin 9000 5G and Unisoc SC9832E processors have distinct differences in their specifications. The HiSilicon Kirin 9000 5G offers a more advanced architecture with a higher number of cores and a smaller lithography process, resulting in better performance and power efficiency. On the other hand, the Unisoc SC9832E is a simpler processor with fewer cores and a larger lithography process, suitable for less demanding tasks. Ultimately, the choice between these processors depends on the specific needs and requirements of the user.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
4x 1.4 GHz – Cortex-A53 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv8-A |
Lithography | 5 nm | 28 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 7 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 2 GB |
Memory type | LPDDR5 | LPDDR3 |
Memory frequency | 2750 MHz | 667 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G78 MP24 | Mali-T820 MP1 |
GPU Architecture | Valhall | Midgard |
GPU frequency | 760 MHz | 680 MHz |
Execution units | 24 | 1 |
Shaders | 384 | 4 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 1.2 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.0 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 1440x720 |
Max camera resolution | 1x 13MP | |
Max Video Capture | 4K@60fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 0.15 Gbps |
Peak Upload Speed | 2.5 Gbps | 0.05 Gbps |
Wi-Fi | 6 (802.11ax) | 4 (802.11n) |
Bluetooth | 5.2 | 4.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2020 October | 2018 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 778G Plus vs Qualcomm Snapdragon 670
2
MediaTek Helio G88 vs MediaTek Helio G80
3
Qualcomm Snapdragon 8 Gen 2 vs Samsung Exynos 9820
4
MediaTek Dimensity 820 vs MediaTek Dimensity 8200
5
Apple A10 Fusion vs Google Tensor G3
6
Qualcomm Snapdragon 888 Plus vs MediaTek Helio G90T
7
MediaTek Dimensity 920 vs MediaTek Dimensity 720
8
Qualcomm Snapdragon 685 vs MediaTek Dimensity 800U
9
MediaTek Dimensity 9200 Plus vs HiSilicon Kirin 810
10
MediaTek Dimensity 1100 vs Qualcomm Snapdragon 712