HiSilicon Kirin 710 vs HiSilicon Kirin 820 5G

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The HiSilicon Kirin 710 and HiSilicon Kirin 820 5G are two processors that cater to different markets. Let's compare their specifications to understand their differences.

Starting with the HiSilicon Kirin 710, it boasts an architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. With a total of 8 cores, this processor offers a decent level of performance. It operates on the ARMv8-A instruction set and has a lithography of 12 nm. The number of transistors in this processor is 5500 million, indicating a significant amount of processing power. The TDP (thermal design power) is 5 Watts, indicating that it consumes relatively low power.

On the other hand, the HiSilicon Kirin 820 5G features a more advanced architecture. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores like the Kirin 710, this processor provides improved performance. It operates on the ARMv8.2-A instruction set and has a lithography of 7 nm. The TDP is slightly higher at 6 Watts. Additionally, it includes neural processing capabilities with the Ascend D110 Lite and HUAWEI Da Vinci Architecture.

In terms of sheer performance, the Kirin 820 5G seems to have the upper hand. Its more advanced architecture and smaller lithography indicate improved efficiency and performance. The inclusion of neural processing capabilities also suggests it is better suited for AI-related tasks. However, it is important to note that the Kirin 820 5G is designed to support 5G connectivity, making it more suitable for high-speed data transfer and future-proofing.

In conclusion, while the HiSilicon Kirin 710 offers decent performance, the HiSilicon Kirin 820 5G takes it a step further with its advanced architecture, smaller lithography, and neural processing capabilities. If you prioritize future-proofing and high-speed connectivity, the Kirin 820 5G might be the better choice. However, if your usage is more focused on everyday tasks, the Kirin 710 could still be a viable option.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 7 nm
Number of transistors 5500 million
TDP 5 Watt 6 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G51 MP4 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 850 MHz
GPU boost frequency 1000 MHz
Execution units 4 6
Shaders 64 96
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080
Max camera resolution 1x 40MP, 2x 24MP 1x 48MP, 2x 20MP
Max Video Capture 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 1.6 Gbps
Peak Upload Speed 0.15 Gbps 0.2 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2018 Quarter 3 2020 March
Partnumber Hi6260
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710
195573
Kirin 820 5G
387656

GeekBench 6 Single-Core

Score
Kirin 710
329
Kirin 820 5G
640

GeekBench 6 Multi-Core

Score
Kirin 710
1341
Kirin 820 5G
2436