HiSilicon Kirin 710 vs HiSilicon Kirin 820 5G
The HiSilicon Kirin 710 and HiSilicon Kirin 820 5G are two processors that cater to different markets. Let's compare their specifications to understand their differences.
Starting with the HiSilicon Kirin 710, it boasts an architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. With a total of 8 cores, this processor offers a decent level of performance. It operates on the ARMv8-A instruction set and has a lithography of 12 nm. The number of transistors in this processor is 5500 million, indicating a significant amount of processing power. The TDP (thermal design power) is 5 Watts, indicating that it consumes relatively low power.
On the other hand, the HiSilicon Kirin 820 5G features a more advanced architecture. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores like the Kirin 710, this processor provides improved performance. It operates on the ARMv8.2-A instruction set and has a lithography of 7 nm. The TDP is slightly higher at 6 Watts. Additionally, it includes neural processing capabilities with the Ascend D110 Lite and HUAWEI Da Vinci Architecture.
In terms of sheer performance, the Kirin 820 5G seems to have the upper hand. Its more advanced architecture and smaller lithography indicate improved efficiency and performance. The inclusion of neural processing capabilities also suggests it is better suited for AI-related tasks. However, it is important to note that the Kirin 820 5G is designed to support 5G connectivity, making it more suitable for high-speed data transfer and future-proofing.
In conclusion, while the HiSilicon Kirin 710 offers decent performance, the HiSilicon Kirin 820 5G takes it a step further with its advanced architecture, smaller lithography, and neural processing capabilities. If you prioritize future-proofing and high-speed connectivity, the Kirin 820 5G might be the better choice. However, if your usage is more focused on everyday tasks, the Kirin 710 could still be a viable option.
Starting with the HiSilicon Kirin 710, it boasts an architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. With a total of 8 cores, this processor offers a decent level of performance. It operates on the ARMv8-A instruction set and has a lithography of 12 nm. The number of transistors in this processor is 5500 million, indicating a significant amount of processing power. The TDP (thermal design power) is 5 Watts, indicating that it consumes relatively low power.
On the other hand, the HiSilicon Kirin 820 5G features a more advanced architecture. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores like the Kirin 710, this processor provides improved performance. It operates on the ARMv8.2-A instruction set and has a lithography of 7 nm. The TDP is slightly higher at 6 Watts. Additionally, it includes neural processing capabilities with the Ascend D110 Lite and HUAWEI Da Vinci Architecture.
In terms of sheer performance, the Kirin 820 5G seems to have the upper hand. Its more advanced architecture and smaller lithography indicate improved efficiency and performance. The inclusion of neural processing capabilities also suggests it is better suited for AI-related tasks. However, it is important to note that the Kirin 820 5G is designed to support 5G connectivity, making it more suitable for high-speed data transfer and future-proofing.
In conclusion, while the HiSilicon Kirin 710 offers decent performance, the HiSilicon Kirin 820 5G takes it a step further with its advanced architecture, smaller lithography, and neural processing capabilities. If you prioritize future-proofing and high-speed connectivity, the Kirin 820 5G might be the better choice. However, if your usage is more focused on everyday tasks, the Kirin 710 could still be a viable option.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP6 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 1000 MHz | 850 MHz |
Execution units | 4 | 6 |
Shaders | 64 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2020 March |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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