MediaTek Helio G50
The Helio G50 is one of MediaTek low-end CPU. It has 4 cores and was announced in 2025 Quarter 1. It has "big.LITTLE" cores-set: 4x Cortex-A53 (1.7 GHz). The processor is manufactured using a 12 nm process technology and supports 4G, LPDDR4X.
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 1.7 GHz – Cortex-A53 |
| Number of cores | 4 |
| Instruction Set | ARMv8.2-A |
| Lithography | 12 nm |
| Neural Processing | - |
Memory (RAM)
| Max amount | up to 8 GB |
| Memory type | LPDDR4X |
| Memory frequency | 1600 MHz |
| Memory-bus | 2x16 bit |
Graphics
| GPU name | Imagination PowerVR GE8320 |
| GPU Architecture | PowerVR Rogue |
| GPU frequency | 680 MHz |
| Execution units | 4 |
| Shaders | 32 |
| OpenCL API | 1.2 |
| Vulkan API | 1.1 |
Camera, Video, Display
| Max screen resolution | 2400x1080 |
| Max camera resolution | 1x 50MP, 2x 13MP |
| Max Video Capture | FullHD+@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) |
Wireless
| 4G network | Yes |
| 5G network | Yes |
| Peak Download Speed | 0.3 Gbps |
| Peak Upload Speed | 0.15 Gbps |
| Wi-Fi | 5 (802.11ac) |
| Bluetooth | 5.0 |
| Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
| Launch Date | 2025 Quarter 1 |
| Partnumber | MT6765V |
| Vertical Segment | Mobiles |
| Positioning | Low-end |
Popular comparisons:
1
HiSilicon Kirin 810 vs MediaTek Dimensity 9300
2
Google Tensor G3 vs Samsung Exynos 2200
3
MediaTek Dimensity 8500 vs MediaTek Dimensity 9500
4
Unisoc Tiger T618 vs MediaTek Dimensity 8400
5
Qualcomm Snapdragon 855 Plus vs MediaTek Dimensity 9000
6
HiSilicon Kirin 980 vs MediaTek Dimensity 1300
7
Apple A16 Bionic vs Samsung Exynos 7884B
8
MediaTek Dimensity 6020 vs Samsung Exynos 9820
9
Qualcomm Snapdragon 7s Gen 4 vs MediaTek Helio G80
10
HiSilicon Kirin 9030 Pro vs Qualcomm Snapdragon 636