MediaTek Dimensity 9200 Plus

The MediaTek Dimensity 9200 Plus is a {total_cores} CPU It has 8 cores and was announced in 2023 Quarter 2. It has "top.big.LITTLE" cores-set: 1x Cortex-X3, 3x Cortex-A715 (3 GHz), 4x Cortex-A510 (2 GHz). The processor is manufactured using a 4 nm process technology and supports UFS 4.0, 4G, 5G, LPDDR5X.
MediaTek Dimensity 9200 Plus

AnTuTu 10

Total Score
Dimensity 9200 Plus
1375985

GeekBench 6 Single-Core

Score
Dimensity 9200 Plus
1509

GeekBench 6 Multi-Core

Score
Dimensity 9200 Plus
5392

CPU cores and architecture

Architecture 1x 3.35 GHz – Cortex-X3
3x 3 GHz – Cortex-A715
4x 2GHz - Cortex-A510
Number of cores 8
Instruction Set ARMv9-A
Lithography 4 nm
Number of transistors 17000 million
TDP 8 Watt
Neural Processing MediaTek APU 690

Memory (RAM)

Max amount up to 24 GB
Memory type LPDDR5X
Memory frequency 4266 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 4.0

Graphics

GPU name Mali-G715 MP11
GPU Architecture Mali Valhall
Execution units 11
OpenCL API 2.0
OpenGL API ES 3.2
Vulkan API 1.3

Camera, Video, Display

Max screen resolution 2960x1440
Max camera resolution 1x 320MP
Max Video Capture 8K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes
5G network Yes
Peak Download Speed 7 Gbps
Wi-Fi 7 (802.11be)
Bluetooth 5.3
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2023 Quarter 2
Partnumber MT6985
Vertical Segment Mobiles
Positioning Flagship

Popular comparisons:

1
Apple A9 vs Qualcomm Snapdragon 710
2
Qualcomm Snapdragon 450 vs MediaTek Helio G88
3
Unisoc Tiger T618 vs MediaTek Dimensity 6080
4
Qualcomm Snapdragon 7 Plus Gen 2 vs HiSilicon Kirin 930
5
Qualcomm Snapdragon 6s Gen 3 vs HiSilicon Kirin 9020
6
HiSilicon Kirin 960 vs Qualcomm Snapdragon 712
7
Unisoc Tiger T710 vs Qualcomm Snapdragon 6 Gen 4
8
Qualcomm Snapdragon 865 vs MediaTek Helio G80
9
Qualcomm Snapdragon 425 vs Google Tensor G3
10
Qualcomm Snapdragon 636 vs HiSilicon Kirin 8020