HiSilicon Kirin 9000 5G vs MediaTek Dimensity 810
The HiSilicon Kirin 9000 5G and the MediaTek Dimensity 810 are both powerful processors designed for mobile devices.
In terms of CPU cores and architecture, the Kirin 9000 5G has a more diverse setup. It features 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Dimensity 810 has 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. While the Kirin 9000 5G offers a higher maximum clock speed, the Dimensity 810 has a higher number of Cortex-A76 cores, which are known for their performance.
When it comes to the number of cores, both processors have 8 cores in total. This allows for efficient multitasking and smooth performance.
In terms of instruction set, both processors support ARMv8.2-A, ensuring compatibility with a wide range of software and applications.
When it comes to lithography, the Kirin 9000 5G stands out with its 5nm process, while the Dimensity 810 utilizes a 6nm process. A smaller process node generally offers improved energy efficiency and better performance.
In terms of the number of transistors, the Kirin 9000 5G boasts 15300 million transistors, while the Dimensity 810 has 12000 million transistors. This indicates that the Kirin 9000 5G is potentially more advanced and capable of handling complex tasks.
The TDP (Thermal Design Power) of the Kirin 9000 5G is 6 watts, while the Dimensity 810 has a slightly higher TDP of 8 watts. Lower TDP values generally imply more power efficiency.
In terms of neural processing, the Kirin 9000 5G offers Ascend Lite (2x) and Ascend Tiny (1x) for enhanced AI capabilities. The Dimensity 810, on the other hand, features an NPU (Neural Processing Unit) to handle AI tasks.
Overall, while both processors offer impressive specifications, the Kirin 9000 5G seems to have an edge with its greater diversity of CPU cores, smaller lithography, higher number of transistors, and advanced neural processing capabilities. However, the Dimensity 810 maintains strong performance and efficiency. Ultimately, the choice between the two would depend on specific requirements and priorities.
In terms of CPU cores and architecture, the Kirin 9000 5G has a more diverse setup. It features 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Dimensity 810 has 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. While the Kirin 9000 5G offers a higher maximum clock speed, the Dimensity 810 has a higher number of Cortex-A76 cores, which are known for their performance.
When it comes to the number of cores, both processors have 8 cores in total. This allows for efficient multitasking and smooth performance.
In terms of instruction set, both processors support ARMv8.2-A, ensuring compatibility with a wide range of software and applications.
When it comes to lithography, the Kirin 9000 5G stands out with its 5nm process, while the Dimensity 810 utilizes a 6nm process. A smaller process node generally offers improved energy efficiency and better performance.
In terms of the number of transistors, the Kirin 9000 5G boasts 15300 million transistors, while the Dimensity 810 has 12000 million transistors. This indicates that the Kirin 9000 5G is potentially more advanced and capable of handling complex tasks.
The TDP (Thermal Design Power) of the Kirin 9000 5G is 6 watts, while the Dimensity 810 has a slightly higher TDP of 8 watts. Lower TDP values generally imply more power efficiency.
In terms of neural processing, the Kirin 9000 5G offers Ascend Lite (2x) and Ascend Tiny (1x) for enhanced AI capabilities. The Dimensity 810, on the other hand, features an NPU (Neural Processing Unit) to handle AI tasks.
Overall, while both processors offer impressive specifications, the Kirin 9000 5G seems to have an edge with its greater diversity of CPU cores, smaller lithography, higher number of transistors, and advanced neural processing capabilities. However, the Dimensity 810 maintains strong performance and efficiency. Ultimately, the choice between the two would depend on specific requirements and priorities.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 6 nm |
Number of transistors | 15300 million | 12000 million |
TDP | 6 Watt | 8 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 12 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP24 | Mali-G57 MP2 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 950 MHz |
Execution units | 24 | 2 |
Shaders | 384 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 64MP, 2x 16MP | |
Max Video Capture | 4K@60fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 October | 2021 Quarter 3 |
Partnumber | MT6833V/PNZA, MT6833P | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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