HiSilicon Kirin 9000 5G vs MediaTek Dimensity 810

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The HiSilicon Kirin 9000 5G and the MediaTek Dimensity 810 are both powerful processors designed for mobile devices.

In terms of CPU cores and architecture, the Kirin 9000 5G has a more diverse setup. It features 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the Dimensity 810 has 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. While the Kirin 9000 5G offers a higher maximum clock speed, the Dimensity 810 has a higher number of Cortex-A76 cores, which are known for their performance.

When it comes to the number of cores, both processors have 8 cores in total. This allows for efficient multitasking and smooth performance.

In terms of instruction set, both processors support ARMv8.2-A, ensuring compatibility with a wide range of software and applications.

When it comes to lithography, the Kirin 9000 5G stands out with its 5nm process, while the Dimensity 810 utilizes a 6nm process. A smaller process node generally offers improved energy efficiency and better performance.

In terms of the number of transistors, the Kirin 9000 5G boasts 15300 million transistors, while the Dimensity 810 has 12000 million transistors. This indicates that the Kirin 9000 5G is potentially more advanced and capable of handling complex tasks.

The TDP (Thermal Design Power) of the Kirin 9000 5G is 6 watts, while the Dimensity 810 has a slightly higher TDP of 8 watts. Lower TDP values generally imply more power efficiency.

In terms of neural processing, the Kirin 9000 5G offers Ascend Lite (2x) and Ascend Tiny (1x) for enhanced AI capabilities. The Dimensity 810, on the other hand, features an NPU (Neural Processing Unit) to handle AI tasks.

Overall, while both processors offer impressive specifications, the Kirin 9000 5G seems to have an edge with its greater diversity of CPU cores, smaller lithography, higher number of transistors, and advanced neural processing capabilities. However, the Dimensity 810 maintains strong performance and efficiency. Ultimately, the choice between the two would depend on specific requirements and priorities.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 6 nm
Number of transistors 15300 million 12000 million
TDP 6 Watt 8 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 12 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 3.1 UFS 2.2

Graphics

GPU name Mali-G78 MP24 Mali-G57 MP2
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 950 MHz
Execution units 24 2
Shaders 384 32
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 64MP, 2x 16MP
Max Video Capture 4K@60fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2020 October 2021 Quarter 3
Partnumber MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000 5G
762886
Dimensity 810
356915

GeekBench 6 Single-Core

Score
Kirin 9000 5G
1062
Dimensity 810
584

GeekBench 6 Multi-Core

Score
Kirin 9000 5G
3724
Dimensity 810
1662