MediaTek Dimensity 7100
The Dimensity 7100 is one of MediaTek mid-end CPU. It has 4 cores and was announced in 2026 Quarter 1. It has "big.LITTLE" cores-set: 4x Cortex-A55 (2 GHz). The processor is manufactured using a 6 nm process technology and supports 4G, 5G, LPDDR5.
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2 GHz – Cortex-A55 |
| Number of cores | 4 |
| Instruction Set | ARMv8.2-A |
| Lithography | 6 nm |
Memory (RAM)
| Max amount | up to 16 GB |
| Memory type | LPDDR5 |
| Memory frequency | 2750 MHz |
| Memory-bus | 2x16 bit |
Graphics
| GPU name | Mali-G610 MP2 |
| GPU Architecture | Mali Valhall |
| GPU frequency | 1000 MHz |
| Execution units | 2 |
| Shaders | 128 |
| OpenCL API | 2.0 |
| Vulkan API | 1.3 |
Camera, Video, Display
| Max screen resolution | 2520x1080 |
| Max camera resolution | 1x 200MP |
| Max Video Capture | 2K@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes |
| 5G network | Yes |
| Wi-Fi | 6 (802.11ax) |
| Bluetooth | 5.3 |
| Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2026 Quarter 1 |
| Partnumber | MT6858 |
| Vertical Segment | Mobiles |
| Positioning | Mid-end |
Popular comparisons:
1
Qualcomm Snapdragon 720G vs Apple A10 Fusion
2
Qualcomm Snapdragon 750G vs MediaTek Dimensity 7350
3
Qualcomm Snapdragon 435 vs MediaTek Dimensity 920
4
HiSilicon Kirin 9000S vs Qualcomm Snapdragon 865
5
MediaTek Helio G36 vs HiSilicon Kirin 8000
6
Qualcomm Snapdragon 665 vs Unisoc T9100
7
Qualcomm Snapdragon 4 Gen 4 vs Apple A15 Bionic
8
Unisoc Tiger T606 vs MediaTek Dimensity 7200 Ultra
9
Samsung Exynos 7870 vs Unisoc T8300
10
Qualcomm Snapdragon 685 vs Qualcomm Snapdragon 888