HiSilicon Kirin 710 vs HiSilicon Kirin 930
The HiSilicon Kirin 710 and HiSilicon Kirin 930 are two processors that have distinct specifications and differences in performance. Let's compare them based on their specifications.
Starting with the CPU cores and architecture, the Kirin 710 has an architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. On the other hand, the Kirin 930 features a slightly lower architecture of 4x 2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53. This indicates that the Kirin 710 has a higher clock speed for its leading cores, which suggests better performance for demanding tasks.
Both processors offer 8 cores and support the ARMv8-A instruction set. However, there is a notable difference in terms of lithography. The Kirin 710 is designed with a more advanced 12nm lithography, while the Kirin 930 uses a 28nm lithography. A smaller lithography generally implies higher power efficiency and potentially better performance.
When it comes to the number of transistors, the Kirin 710 stands out with 5500 million transistors, whereas the Kirin 930 has only 1000 million transistors. This indicates that the Kirin 710 has a more complex and densely packed architecture, potentially leading to better performance and efficiency.
Both processors have a thermal design power (TDP) of 5 Watts. This means they consume the same amount of power, resulting in similar energy efficiency.
Taking all these specifications into account, it is apparent that the HiSilicon Kirin 710 outperforms the Kirin 930 in terms of clock speed, lithography, and transistor count. The Kirin 710's more advanced technology and higher clock speed should result in improved performance and power efficiency.
However, it is important to note that specifications alone do not represent the complete picture of a processor's performance. Real-world performance can also be influenced by various factors, such as software optimization and overall system design.
Starting with the CPU cores and architecture, the Kirin 710 has an architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. On the other hand, the Kirin 930 features a slightly lower architecture of 4x 2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53. This indicates that the Kirin 710 has a higher clock speed for its leading cores, which suggests better performance for demanding tasks.
Both processors offer 8 cores and support the ARMv8-A instruction set. However, there is a notable difference in terms of lithography. The Kirin 710 is designed with a more advanced 12nm lithography, while the Kirin 930 uses a 28nm lithography. A smaller lithography generally implies higher power efficiency and potentially better performance.
When it comes to the number of transistors, the Kirin 710 stands out with 5500 million transistors, whereas the Kirin 930 has only 1000 million transistors. This indicates that the Kirin 710 has a more complex and densely packed architecture, potentially leading to better performance and efficiency.
Both processors have a thermal design power (TDP) of 5 Watts. This means they consume the same amount of power, resulting in similar energy efficiency.
Taking all these specifications into account, it is apparent that the HiSilicon Kirin 710 outperforms the Kirin 930 in terms of clock speed, lithography, and transistor count. The Kirin 710's more advanced technology and higher clock speed should result in improved performance and power efficiency.
However, it is important to note that specifications alone do not represent the complete picture of a processor's performance. Real-world performance can also be influenced by various factors, such as software optimization and overall system design.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 12 nm | 28 nm |
Number of transistors | 5500 million | 1000 million |
TDP | 5 Watt | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 6 GB |
Memory type | LPDDR4 | LPDDR3 |
Memory frequency | 1866 MHz | 800 MHz |
Memory-bus | 2x32 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.0 |
Graphics
GPU name | Mali-G51 MP4 | Mali-T628 MP4 |
GPU Architecture | Bifrost | Midgard |
GPU frequency | 650 MHz | 600 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 1.2 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2560x1600 |
Max camera resolution | 1x 40MP, 2x 24MP | 1x 20MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.05 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 3 | 2015 Quarter 2 |
Partnumber | Hi6260 | Hi3630 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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