MediaTek Dimensity 7025
The Dimensity 7025 is one of MediaTek mid-end CPU. It has 6 cores and was announced in 2024 Quarter 2. It has "big.LITTLE" cores-set: 6x Cortex-A55 (2 GHz). The processor is manufactured using a 6 nm process technology and supports 4G, 5G, LPDDR5.
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 6x 2 GHz – Cortex-A55 |
| Number of cores | 6 |
| Instruction Set | ARMv8.2-A |
| Lithography | 6 nm |
| Number of transistors | 10000 million |
| Neural Processing | NPU |
Memory (RAM)
| Max amount | up to 16 GB |
| Memory type | LPDDR5 |
| Memory frequency | 3200 MHz |
| Memory-bus | 4x16 bit |
Graphics
| GPU name | IMG BXM-8-256 |
| GPU Architecture | PowerVR IMG |
| GPU frequency | 950 MHz |
| Execution units | 8 |
| Shaders | 128 |
| OpenCL API | 3.0 |
| Vulkan API | 1.3 |
Camera, Video, Display
| Max screen resolution | 2520x1080 |
| Max camera resolution | 1x 200MP |
| Max Video Capture | 2K@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes |
| 5G network | Yes |
| Peak Download Speed | 2.77 Gbps |
| Peak Upload Speed | 1.25 Gbps |
| Wi-Fi | 5 (802.11ac) |
| Bluetooth | 5.3 |
| Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2024 Quarter 2 |
| Vertical Segment | Mobiles |
| Positioning | Mid-end |
Popular comparisons:
1
MediaTek Helio G85 vs Xiaomi Xring O1
2
Samsung Exynos 9609 vs Qualcomm Snapdragon 6s Gen 3
3
Unisoc Tanggula T770 5G vs MediaTek Dimensity 9000
4
Qualcomm Snapdragon 7 Gen 1 vs Qualcomm Snapdragon 662
5
Qualcomm Snapdragon 480 vs Samsung Exynos 2200
6
Unisoc Tiger T700 vs MediaTek Dimensity 7350
7
Qualcomm Snapdragon 8s Gen 4 vs Qualcomm Snapdragon 425
8
HiSilicon Kirin 970 vs Qualcomm Snapdragon 7 Plus Gen 3
9
Qualcomm Snapdragon 636 vs HiSilicon Kirin 990 5G
10
Qualcomm Snapdragon 778G vs MediaTek Dimensity 8400