MediaTek Dimensity 1050
The Dimensity 1050 is one of MediaTek mid-end CPU. It has 8 cores and was announced in 2022 Quarter 2. It has "big.LITTLE" cores-set: 2x Cortex-A78 (2.5 GHz), 6x Cortex-A55 (2 GHz). The processor is manufactured using a 6 nm process technology and supports UFS 3.1, 4G, 5G, LPDDR5.

AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.5 GHz – Cortex-A78 6x 2 GHz – Cortex-A55 |
Number of cores | 8 |
Instruction Set | ARMv8.2-A |
Lithography | 6 nm |
Neural Processing | MediaTek APU 550 |
Memory (RAM)
Max amount | up to 16 GB |
Memory type | LPDDR5 |
Memory frequency | 3200 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.1 |
Graphics
GPU name | Mali-G610 MP3 |
GPU Architecture | Mali Valhall |
Execution units | 3 |
OpenCL API | 2.0 |
OpenGL API | ES 3.2 |
Vulkan API | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080 |
Max camera resolution | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes |
5G network | Yes |
Peak Download Speed | 4.6 Gbps |
Wi-Fi | 6 (802.11ax) |
Bluetooth | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2022 Quarter 2 |
Partnumber | MT6879 |
Vertical Segment | Mobiles |
Positioning | Mid-end |
Popular comparisons:
1
Qualcomm Snapdragon 4 Gen 1 vs Samsung Exynos 9611
2
HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 7200 Ultra
3
Unisoc Tiger T616 vs MediaTek Dimensity 820
4
Apple M4 (iPad) vs Qualcomm Snapdragon 660
5
MediaTek Helio G37 vs Google Tensor G5
6
Samsung Exynos 2400 vs Unisoc Tiger T700
7
Unisoc T8300 vs Samsung Exynos 850
8
MediaTek Dimensity 6080 vs Qualcomm Snapdragon 8s Gen 4
9
Qualcomm Snapdragon 732G vs MediaTek Dimensity 1080
10
Samsung Exynos 7420 vs HiSilicon Kirin 990 5G