MediaTek Dimensity 930 vs Unisoc Tanggula T740 5G
The Unisoc Tanggula T740 5G and the MediaTek Dimensity 930 are two processors with different specifications.
Starting with the Unisoc Tanggula T740 5G, it features an architecture of 4x 1.8 GHz Cortex-A75 and 4x 1.8 GHz Cortex-A55. With a total of 8 cores, this processor is designed with ARMv8.2-A instruction set and has a lithography of 12 nm. Additionally, it boasts dual neural processing units (NPU).
On the other hand, the MediaTek Dimensity 930 offers a different architecture with 2x 2.2 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55. With the same 8 cores as the Tanggula T740 5G, it also utilizes the ARMv8.2-A instruction set. However, it has a smaller lithography of 6 nm and mentions a thermal design power (TDP) of 10 Watts. The Dimensity 930 also features an NPU.
In terms of their specifications, it is evident that both processors have similar numbers of cores and instruction set architecture. However, they differ in the cores' clock speeds and lithography process. The Unisoc Tanggula T740 5G has a lower lithography of 12 nm and slightly lower clock speeds compared to the MediaTek Dimensity 930's 6 nm lithography and higher clock speeds.
It is worth noting that the Dimensity 930 mentions a TDP of 10 Watts, which could indicate potential power efficiency advantages over the Tanggula T740 5G. However, it may require additional analysis to accurately assess the impact of this specification.
Both processors also offer dedicated neural processing units, indicating their capability for artificial intelligence and machine learning tasks. However, the Tanggula T740 5G specifies dual NPUs, which could imply enhanced capabilities in this regard.
In conclusion, while both the Unisoc Tanggula T740 5G and MediaTek Dimensity 930 feature similar core counts and instruction set architectures, they differ in lithography, clock speeds, and mention different types of NPUs. Further detailed analysis is necessary to understand the performance differences between these processors in specific use cases.
Starting with the Unisoc Tanggula T740 5G, it features an architecture of 4x 1.8 GHz Cortex-A75 and 4x 1.8 GHz Cortex-A55. With a total of 8 cores, this processor is designed with ARMv8.2-A instruction set and has a lithography of 12 nm. Additionally, it boasts dual neural processing units (NPU).
On the other hand, the MediaTek Dimensity 930 offers a different architecture with 2x 2.2 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55. With the same 8 cores as the Tanggula T740 5G, it also utilizes the ARMv8.2-A instruction set. However, it has a smaller lithography of 6 nm and mentions a thermal design power (TDP) of 10 Watts. The Dimensity 930 also features an NPU.
In terms of their specifications, it is evident that both processors have similar numbers of cores and instruction set architecture. However, they differ in the cores' clock speeds and lithography process. The Unisoc Tanggula T740 5G has a lower lithography of 12 nm and slightly lower clock speeds compared to the MediaTek Dimensity 930's 6 nm lithography and higher clock speeds.
It is worth noting that the Dimensity 930 mentions a TDP of 10 Watts, which could indicate potential power efficiency advantages over the Tanggula T740 5G. However, it may require additional analysis to accurately assess the impact of this specification.
Both processors also offer dedicated neural processing units, indicating their capability for artificial intelligence and machine learning tasks. However, the Tanggula T740 5G specifies dual NPUs, which could imply enhanced capabilities in this regard.
In conclusion, while both the Unisoc Tanggula T740 5G and MediaTek Dimensity 930 feature similar core counts and instruction set architectures, they differ in lithography, clock speeds, and mention different types of NPUs. Further detailed analysis is necessary to understand the performance differences between these processors in specific use cases.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 6 nm | 12 nm |
TDP | 10 Watt | |
Neural Processing | NPU | Dual NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 3200 MHz | 1866 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.1 |
Graphics
GPU name | Imagination PowerVR BXM-8-256 | Imagination PowerVR GM9446 |
GPU Architecture | Rogue | Rogue |
GPU frequency | 800 MHz | 800 MHz |
DirectX | 12 | |
OpenCL API | 3.0 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.1 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2960x1440@60Hz |
Max camera resolution | 1x 108MP, 1x 64MP | 1x 64MP |
Max Video Capture | 2K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 1.5 Gbps |
Peak Upload Speed | 1.2 Gbps | 0.75 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2022 Quarter 3 | 2020 Quarter 1 |
Partnumber | T740, Tiger T7510 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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