HiSilicon Kirin 820 5G vs Unisoc SC9832E
The HiSilicon Kirin 820 5G and Unisoc SC9832E are two processors with distinct specifications.
Starting with the HiSilicon Kirin 820 5G, this processor has a diverse set of CPU cores and architecture. It consists of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. This combination allows for efficient multitasking and powerful performance. It operates on the ARMv8.2-A instruction set and is built on a 7 nm lithography process. With a TDP (Thermal Design Power) of 6 Watts, it balances energy efficiency with power. Additionally, it features Neural Processing capabilities through its Ascend D110 Lite and HUAWEI Da Vinci Architecture, enabling advanced AI functionality.
On the other hand, the Unisoc SC9832E processor has a simpler configuration. It consists of 4x 1.4 GHz Cortex-A53 cores. While it may not offer the same level of processing power as the Kirin 820, it is still capable of handling everyday tasks efficiently. Similar to the Kirin processor, it operates on the ARMv8-A instruction set. However, the Unisoc SC9832E is designed on a larger, 28 nm lithography process. It has a TDP of 7 Watts.
In summary, the HiSilicon Kirin 820 5G processor stands out with its advanced specifications. It features a combination of high-performance cores and energy-efficient cores, allowing for optimal multitasking. Additionally, it utilizes a more advanced 7 nm lithography process and offers neural processing capabilities. On the other hand, the Unisoc SC9832E processor has a simpler architecture with modest specifications, suitable for everyday tasks. While it may not be as powerful, it provides a cost-effective option for users. Ultimately, choosing between the two processors will depend on the specific requirements and budget of the user.
Starting with the HiSilicon Kirin 820 5G, this processor has a diverse set of CPU cores and architecture. It consists of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. This combination allows for efficient multitasking and powerful performance. It operates on the ARMv8.2-A instruction set and is built on a 7 nm lithography process. With a TDP (Thermal Design Power) of 6 Watts, it balances energy efficiency with power. Additionally, it features Neural Processing capabilities through its Ascend D110 Lite and HUAWEI Da Vinci Architecture, enabling advanced AI functionality.
On the other hand, the Unisoc SC9832E processor has a simpler configuration. It consists of 4x 1.4 GHz Cortex-A53 cores. While it may not offer the same level of processing power as the Kirin 820, it is still capable of handling everyday tasks efficiently. Similar to the Kirin processor, it operates on the ARMv8-A instruction set. However, the Unisoc SC9832E is designed on a larger, 28 nm lithography process. It has a TDP of 7 Watts.
In summary, the HiSilicon Kirin 820 5G processor stands out with its advanced specifications. It features a combination of high-performance cores and energy-efficient cores, allowing for optimal multitasking. Additionally, it utilizes a more advanced 7 nm lithography process and offers neural processing capabilities. On the other hand, the Unisoc SC9832E processor has a simpler architecture with modest specifications, suitable for everyday tasks. While it may not be as powerful, it provides a cost-effective option for users. Ultimately, choosing between the two processors will depend on the specific requirements and budget of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 1.4 GHz – Cortex-A53 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv8-A |
Lithography | 7 nm | 28 nm |
TDP | 6 Watt | 7 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 2 GB |
Memory type | LPDDR4X | LPDDR3 |
Memory frequency | 2133 MHz | 667 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-T820 MP1 |
GPU Architecture | Mali Valhall | Mali Midgard |
GPU frequency | 850 MHz | 680 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 4 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 1.2 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.0 |
Camera, Video, Display
Max screen resolution | 1440x720 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 13MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.15 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.05 Gbps |
Wi-Fi | 6 (802.11ax) | 4 (802.11n) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2020 March | 2018 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
Popular comparisons:
1
MediaTek Helio G80 vs Samsung Exynos 8895
2
Samsung Exynos 1330 vs Qualcomm Snapdragon 801
3
MediaTek Helio G96 vs Unisoc T820
4
MediaTek Dimensity 1200 vs Qualcomm Snapdragon 8s Gen 3
5
MediaTek Dimensity 810 vs MediaTek Helio G50
6
Apple M4 (iPad) vs Unisoc T9100
7
Samsung Exynos 7884B vs Qualcomm Snapdragon 778G Plus
8
Qualcomm Snapdragon 712 vs Samsung Exynos 7880
9
Samsung Exynos 2500 vs Apple A10X Fusion
10
Samsung Exynos 8890 vs Qualcomm Snapdragon 820