MediaTek Dimensity 920 vs Unisoc Tanggula T740 5G
The Unisoc Tanggula T740 5G and MediaTek Dimensity 920 are both processors that offer high-performance capabilities. However, they have some notable differences in their specifications.
In terms of CPU cores and architecture, the Unisoc Tanggula T740 5G features four Cortex-A75 cores clocked at 1.8 GHz and four Cortex-A55 cores also clocked at 1.8 GHz. On the other hand, the MediaTek Dimensity 920 has two Cortex-A78 cores clocked at 2.5 GHz and six Cortex-A55 cores clocked at 2.0 GHz. This indicates that the Dimensity 920 has a higher clock speed for its more powerful cores.
Both processors have eight cores and are based on the ARMv8.2-A instruction set. This means that they are capable of running the latest software and taking advantage of newer technologies and optimizations.
When it comes to lithography, the Unisoc Tanggula T740 5G utilizes a 12 nm process, while the MediaTek Dimensity 920 has a more advanced 6 nm process. A smaller lithography generally leads to better power efficiency and performance.
In terms of neural processing capabilities, the Unisoc Tanggula T740 5G boasts a Dual NPU, which indicates its ability to handle artificial intelligence tasks efficiently. The MediaTek Dimensity 920, on the other hand, features an NPU, suggesting that it also possesses AI capabilities, albeit with potentially different performance levels.
It is also worth noting that the MediaTek Dimensity 920 has a TDP (Thermal Design Power) of 10 Watts. TDP is a measure of how much heat a processor generates under normal operation. A lower TDP generally implies better power efficiency.
In summary, both the Unisoc Tanggula T740 5G and the MediaTek Dimensity 920 processors offer powerful performance and are suitable for demanding tasks. However, the Dimensity 920 has a higher clock speed for its more powerful cores, utilizes a more advanced 6 nm lithography, and features a lower TDP. Meanwhile, the Tanggula T740 5G stands out with its Dual NPU, indicating enhanced neural processing capabilities.
In terms of CPU cores and architecture, the Unisoc Tanggula T740 5G features four Cortex-A75 cores clocked at 1.8 GHz and four Cortex-A55 cores also clocked at 1.8 GHz. On the other hand, the MediaTek Dimensity 920 has two Cortex-A78 cores clocked at 2.5 GHz and six Cortex-A55 cores clocked at 2.0 GHz. This indicates that the Dimensity 920 has a higher clock speed for its more powerful cores.
Both processors have eight cores and are based on the ARMv8.2-A instruction set. This means that they are capable of running the latest software and taking advantage of newer technologies and optimizations.
When it comes to lithography, the Unisoc Tanggula T740 5G utilizes a 12 nm process, while the MediaTek Dimensity 920 has a more advanced 6 nm process. A smaller lithography generally leads to better power efficiency and performance.
In terms of neural processing capabilities, the Unisoc Tanggula T740 5G boasts a Dual NPU, which indicates its ability to handle artificial intelligence tasks efficiently. The MediaTek Dimensity 920, on the other hand, features an NPU, suggesting that it also possesses AI capabilities, albeit with potentially different performance levels.
It is also worth noting that the MediaTek Dimensity 920 has a TDP (Thermal Design Power) of 10 Watts. TDP is a measure of how much heat a processor generates under normal operation. A lower TDP generally implies better power efficiency.
In summary, both the Unisoc Tanggula T740 5G and the MediaTek Dimensity 920 processors offer powerful performance and are suitable for demanding tasks. However, the Dimensity 920 has a higher clock speed for its more powerful cores, utilizes a more advanced 6 nm lithography, and features a lower TDP. Meanwhile, the Tanggula T740 5G stands out with its Dual NPU, indicating enhanced neural processing capabilities.
CPU cores and architecture
Architecture | 2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 6 nm | 12 nm |
TDP | 10 Watt | |
Neural Processing | NPU | Dual NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 8 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 3200 MHz | 1866 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.1 |
Graphics
GPU name | Mali-G68 MP4 | Imagination PowerVR GM9446 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 950 MHz | 800 MHz |
Execution units | 4 | |
Shaders | 96 | |
DirectX | 12 | |
OpenCL API | 2.0 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.1 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2960x1440@60Hz |
Max camera resolution | 1x 108MP, 2x 20MP | 1x 64MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 1.5 Gbps |
Peak Upload Speed | 1.2 Gbps | 0.75 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 Quarter 3 | 2020 Quarter 1 |
Partnumber | MT6877T | T740, Tiger T7510 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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