HiSilicon Kirin 710A vs Unisoc Tiger T700
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The HiSilicon Kirin 710A and the Unisoc Tiger T700 are two processors known for their performance in the mobile industry. While both processors have similar core counts and instruction sets, their specifications show some notable differences.
Starting with the HiSilicon Kirin 710A, it is built on a 14nm lithography, which offers better power efficiency compared to larger node sizes. It features a combination of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This mix of high-performance and power-efficient cores is designed to provide a balance between power and battery life. With 5500 million transistors, this processor offers sufficient processing power for a variety of tasks.
On the other hand, the Unisoc Tiger T700 boasts a more advanced lithography of 12nm, further improving power efficiency. It consists of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. This architecture places a greater emphasis on power efficiency, which is important for smartphones and other portable devices. Although the core clock speeds are lower compared to the Kirin 710A, the Tiger T700 still offers a decent multi-core performance.
In terms of thermal design power (TDP), the Kirin 710A has a lower rating of 5 Watts compared to the Tiger T700's 10 Watts. A lower TDP translates to better power management and reduced heat output, which can contribute to a longer battery life.
Both processors utilize ARMv8 instruction set architecture, which supports 64-bit computing and improved software compatibility.
In summary, the HiSilicon Kirin 710A and the Unisoc Tiger T700 are both capable processors with their own strengths. The Kirin 710A offers a higher transistor count and a more balanced combination of high-performance and power-efficient cores. Meanwhile, the Tiger T700 stands out with its advanced lithography and emphasis on power efficiency. Ultimately, the choice between the two will depend on the specific requirements of the device and the desired balance between performance and battery life.
Starting with the HiSilicon Kirin 710A, it is built on a 14nm lithography, which offers better power efficiency compared to larger node sizes. It features a combination of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This mix of high-performance and power-efficient cores is designed to provide a balance between power and battery life. With 5500 million transistors, this processor offers sufficient processing power for a variety of tasks.
On the other hand, the Unisoc Tiger T700 boasts a more advanced lithography of 12nm, further improving power efficiency. It consists of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. This architecture places a greater emphasis on power efficiency, which is important for smartphones and other portable devices. Although the core clock speeds are lower compared to the Kirin 710A, the Tiger T700 still offers a decent multi-core performance.
In terms of thermal design power (TDP), the Kirin 710A has a lower rating of 5 Watts compared to the Tiger T700's 10 Watts. A lower TDP translates to better power management and reduced heat output, which can contribute to a longer battery life.
Both processors utilize ARMv8 instruction set architecture, which supports 64-bit computing and improved software compatibility.
In summary, the HiSilicon Kirin 710A and the Unisoc Tiger T700 are both capable processors with their own strengths. The Kirin 710A offers a higher transistor count and a more balanced combination of high-performance and power-efficient cores. Meanwhile, the Tiger T700 stands out with its advanced lithography and emphasis on power efficiency. Ultimately, the choice between the two will depend on the specific requirements of the device and the desired balance between performance and battery life.
CPU cores and architecture
| Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 14 nm | 12 nm |
| Number of transistors | 5500 million | |
| TDP | 5 Watt | 10 Watt |
Memory (RAM)
| Max amount | up to 6 GB | up to 4 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 1866 MHz |
| Memory-bus | 2x32 bit | 2x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G52 MP2 |
| GPU Architecture | Bifrost | Bifrost |
| GPU frequency | 650 MHz | 850 MHz |
| GPU boost frequency | 1000 MHz | |
| Execution units | 4 | 2 |
| Shaders | 64 | 32 |
| DirectX | 12 | 11 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2400x1080 |
| Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP |
| Max Video Capture | 4K@30fps | FullHD@60fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
| Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
| Bluetooth | 5.1 | 5.0 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2020 Quarter 4 | 2021 March |
| Partnumber | Hi6260 | T700 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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