MediaTek Dimensity 820 vs Unisoc Tanggula T760 5G
The Unisoc Tanggula T760 5G and MediaTek Dimensity 820 are two processors that offer impressive specifications. While they share some similarities, there are also significant differences between them.
In terms of CPU cores and architecture, both processors feature eight cores and follow the ARMv8.2-A instruction set. However, their clock speeds and core configurations differ. The Tanggula T760 5G has four Cortex-A76 cores clocked at 2.2 GHz and four Cortex-A55 cores clocked at 1.8 GHz. On the other hand, the Dimensity 820 has four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz. This indicates that the Dimensity 820 has slightly higher clock speeds than the Tanggula T760 5G, potentially resulting in better performance.
Another factor to consider is the lithography, which refers to the manufacturing process used to create the processor. The Tanggula T760 5G utilizes a 6 nm lithography, while the Dimensity 820 uses a 7 nm lithography. Generally, a lower nm value indicates a more advanced manufacturing process, leading to better power efficiency and performance. This suggests that the Tanggula T760 5G may have a slight advantage in terms of power efficiency.
When it comes to thermal design power (TDP), the Tanggula T760 5G has a TDP of 5 Watts, while the Dimensity 820 has a TDP of 10 Watts. A lower TDP generally indicates reduced power consumption and heat generation. Thus, the Tanggula T760 5G is expected to offer better power efficiency in this aspect.
Both processors also feature a Neural Processing Unit (NPU), which enhances AI and machine learning capabilities.
In summary, while the Tanggula T760 5G and Dimensity 820 have similar CPU architectures and NPUs, there are notable differences in clock speeds, lithography, and TDP. The Dimensity 820 offers slightly higher clock speeds, while the Tanggula T760 5G has a more advanced manufacturing process and lower TDP. Ultimately, the choice between these processors will depend on specific use case requirements and priorities, such as performance, power efficiency, or cost.
In terms of CPU cores and architecture, both processors feature eight cores and follow the ARMv8.2-A instruction set. However, their clock speeds and core configurations differ. The Tanggula T760 5G has four Cortex-A76 cores clocked at 2.2 GHz and four Cortex-A55 cores clocked at 1.8 GHz. On the other hand, the Dimensity 820 has four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz. This indicates that the Dimensity 820 has slightly higher clock speeds than the Tanggula T760 5G, potentially resulting in better performance.
Another factor to consider is the lithography, which refers to the manufacturing process used to create the processor. The Tanggula T760 5G utilizes a 6 nm lithography, while the Dimensity 820 uses a 7 nm lithography. Generally, a lower nm value indicates a more advanced manufacturing process, leading to better power efficiency and performance. This suggests that the Tanggula T760 5G may have a slight advantage in terms of power efficiency.
When it comes to thermal design power (TDP), the Tanggula T760 5G has a TDP of 5 Watts, while the Dimensity 820 has a TDP of 10 Watts. A lower TDP generally indicates reduced power consumption and heat generation. Thus, the Tanggula T760 5G is expected to offer better power efficiency in this aspect.
Both processors also feature a Neural Processing Unit (NPU), which enhances AI and machine learning capabilities.
In summary, while the Tanggula T760 5G and Dimensity 820 have similar CPU architectures and NPUs, there are notable differences in clock speeds, lithography, and TDP. The Dimensity 820 offers slightly higher clock speeds, while the Tanggula T760 5G has a more advanced manufacturing process and lower TDP. Ultimately, the choice between these processors will depend on specific use case requirements and priorities, such as performance, power efficiency, or cost.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.6 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 10 Watt | 5 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP5 | Mali-G57 MP6 |
GPU Architecture | Mali Valhall | Mali Valhall |
GPU frequency | 650 MHz | 850 MHz |
Execution units | 5 | 6 |
Shaders | 80 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2160x1080 |
Max camera resolution | 1x 80MP, 1x 32MP + 1x 16MP | 1x 64MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.7 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 May | 2021 February |
Partnumber | MT6875 | T760 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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