MediaTek Dimensity 820 vs Unisoc Tanggula T760 5G

The Unisoc Tanggula T760 5G and MediaTek Dimensity 820 are two processors that offer impressive specifications. While they share some similarities, there are also significant differences between them.

In terms of CPU cores and architecture, both processors feature eight cores and follow the ARMv8.2-A instruction set. However, their clock speeds and core configurations differ. The Tanggula T760 5G has four Cortex-A76 cores clocked at 2.2 GHz and four Cortex-A55 cores clocked at 1.8 GHz. On the other hand, the Dimensity 820 has four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz. This indicates that the Dimensity 820 has slightly higher clock speeds than the Tanggula T760 5G, potentially resulting in better performance.

Another factor to consider is the lithography, which refers to the manufacturing process used to create the processor. The Tanggula T760 5G utilizes a 6 nm lithography, while the Dimensity 820 uses a 7 nm lithography. Generally, a lower nm value indicates a more advanced manufacturing process, leading to better power efficiency and performance. This suggests that the Tanggula T760 5G may have a slight advantage in terms of power efficiency.

When it comes to thermal design power (TDP), the Tanggula T760 5G has a TDP of 5 Watts, while the Dimensity 820 has a TDP of 10 Watts. A lower TDP generally indicates reduced power consumption and heat generation. Thus, the Tanggula T760 5G is expected to offer better power efficiency in this aspect.

Both processors also feature a Neural Processing Unit (NPU), which enhances AI and machine learning capabilities.

In summary, while the Tanggula T760 5G and Dimensity 820 have similar CPU architectures and NPUs, there are notable differences in clock speeds, lithography, and TDP. The Dimensity 820 offers slightly higher clock speeds, while the Tanggula T760 5G has a more advanced manufacturing process and lower TDP. Ultimately, the choice between these processors will depend on specific use case requirements and priorities, such as performance, power efficiency, or cost.

CPU cores and architecture

Architecture 4x 2.6 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
TDP 10 Watt 5 Watt
Neural Processing NPU NPU

Memory (RAM)

Max amount up to 16 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 2x16 bit 4x16 bit


Storage specification UFS 2.2 UFS 3.1


GPU name Mali-G57 MP5 Mali-G57 MP6
GPU Architecture Valhall Valhall
GPU frequency 650 MHz 850 MHz
Execution units 5 6
Shaders 80 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz 2160x1080
Max camera resolution 1x 80MP, 1x 32MP + 1x 16MP 1x 64MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 2.77 Gbps 2.7 Gbps
Peak Upload Speed 1.2 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 May 2021 February
Partnumber MT6875 T760
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Dimensity 820
Tanggula T760 5G

GeekBench 6 Single-Core

Dimensity 820
Tanggula T760 5G

GeekBench 6 Multi-Core

Dimensity 820
Tanggula T760 5G