MediaTek Dimensity 810 vs Unisoc Tiger T610
The Unisoc Tiger T610 and MediaTek Dimensity 810 are two processors with distinct specifications. Starting with the Unisoc Tiger T610, it features a dual-cluster CPU architecture with 2 Cortex-A75 cores clocked at 1.8 GHz and 6 Cortex-A55 cores also clocked at 1.8 GHz. This processor utilizes the ARMv8.2-A instruction set and is built on a 12 nm lithography process. Additionally, it has a thermal design power (TDP) of 10 Watts.
On the other hand, the MediaTek Dimensity 810 boasts a similar dual-cluster CPU architecture but with higher clock speeds. It includes 2 Cortex-A76 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. Like the T610, it also employs the ARMv8.2-A instruction set. However, what sets it apart is its smaller 6 nm lithography process and the inclusion of a Neural Processing Unit (NPU). Furthermore, it has a TDP of 8 Watts and contains approximately 12 billion transistors.
In terms of CPU cores and architecture, both processors have eight cores. However, the Dimensity 810 offers higher clock speeds on both its high-performance and efficiency cores. This suggests that it may offer a better overall performance compared to the Tiger T610. Additionally, the Dimensity 810's smaller 6 nm lithography process may result in improved power efficiency and potentially better heat dissipation.
Moreover, the Dimensity 810's inclusion of an NPU indicates that it may have better artificial intelligence (AI) capabilities when compared to the Tiger T610. The NPU enables more efficient and specialized processing of AI-related tasks, such as image recognition and voice assistants.
In conclusion, while both the Unisoc Tiger T610 and MediaTek Dimensity 810 have eight CPU cores and employ the ARMv8.2-A instruction set, the Dimensity 810 offers higher clock speeds, a smaller lithography process, and includes an NPU. These specifications indicate that the Dimensity 810 may possess superior overall performance, power efficiency, and AI capabilities.
On the other hand, the MediaTek Dimensity 810 boasts a similar dual-cluster CPU architecture but with higher clock speeds. It includes 2 Cortex-A76 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. Like the T610, it also employs the ARMv8.2-A instruction set. However, what sets it apart is its smaller 6 nm lithography process and the inclusion of a Neural Processing Unit (NPU). Furthermore, it has a TDP of 8 Watts and contains approximately 12 billion transistors.
In terms of CPU cores and architecture, both processors have eight cores. However, the Dimensity 810 offers higher clock speeds on both its high-performance and efficiency cores. This suggests that it may offer a better overall performance compared to the Tiger T610. Additionally, the Dimensity 810's smaller 6 nm lithography process may result in improved power efficiency and potentially better heat dissipation.
Moreover, the Dimensity 810's inclusion of an NPU indicates that it may have better artificial intelligence (AI) capabilities when compared to the Tiger T610. The NPU enables more efficient and specialized processing of AI-related tasks, such as image recognition and voice assistants.
In conclusion, while both the Unisoc Tiger T610 and MediaTek Dimensity 810 have eight CPU cores and employ the ARMv8.2-A instruction set, the Dimensity 810 offers higher clock speeds, a smaller lithography process, and includes an NPU. These specifications indicate that the Dimensity 810 may possess superior overall performance, power efficiency, and AI capabilities.
CPU cores and architecture
Architecture | 2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 6 nm | 12 nm |
Number of transistors | 12000 million | |
TDP | 8 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1600 MHz |
Memory-bus | 2x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.2 | eMMC 5.1 |
Graphics
GPU name | Mali-G57 MP2 | Mali-G52 MP2 |
GPU Architecture | Valhall | Bifrost |
GPU frequency | 950 MHz | 614.4 MHz |
Execution units | 2 | 2 |
Shaders | 32 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2400x1080 |
Max camera resolution | 1x 64MP, 2x 16MP | 1x 32MP |
Max Video Capture | 2K@30FPS | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 0.3 Gbps |
Peak Upload Speed | 1.2 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 Quarter 3 | 2019 June |
Partnumber | MT6833V/PNZA, MT6833P | T610 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 460 vs MediaTek Dimensity 9200
2
MediaTek Dimensity 1000L vs Samsung Exynos 1280
3
HiSilicon Kirin 950 vs MediaTek Helio G95
4
MediaTek Helio P95 vs MediaTek Dimensity 9200 Plus
5
MediaTek Dimensity 6080 vs Qualcomm Snapdragon 712
6
Samsung Exynos 2100 vs Qualcomm Snapdragon 865 Plus
7
Qualcomm Snapdragon 778G vs HiSilicon Kirin 9000 5G
8
Apple A15 Bionic vs Qualcomm Snapdragon 695
9
HiSilicon Kirin 9000E 5G vs Google Tensor G3
10
Qualcomm Snapdragon 7 Plus Gen 2 vs Qualcomm Snapdragon 665