HiSilicon Kirin 970 vs Unisoc Tiger T618
The HiSilicon Kirin 970 and the Unisoc Tiger T618 are two processors that have their own unique set of specifications. Let's compare these processors based on their specifications.
Starting with the HiSilicon Kirin 970, it features an architecture that consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This provides a total of 8 cores, offering a balance between high-performance computing and power efficiency. It utilizes the ARMv8-A instruction set and has a lithography of 10 nm, which contributes to its power-saving capabilities.
With 5500 million transistors, the HiSilicon Kirin 970 is capable of handling complex tasks efficiently. It has a TDP (Thermal Design Power) rating of 9 Watts, which determines the maximum amount of power the processor can consume under normal operating conditions. Additionally, it incorporates HiSilicon's Neural Processing Unit (NPU) for advanced artificial intelligence computation, enhancing the overall performance and efficiency of the processor.
Moving on to the Unisoc Tiger T618, it features an architecture with 2x 2.0 GHz Cortex-A75 cores and 6x 2.0 GHz Cortex-A55 cores. Similar to the Kirin 970, it also has a total of 8 cores, providing a balance between power and performance. It utilizes the ARMv8.2-A instruction set and has a lithography of 12 nm.
With a TDP rating of 10 Watts, the Tiger T618 offers slightly higher power consumption compared to the Kirin 970. However, it comes with its own Neural Processing Unit (NPU) to facilitate artificial intelligence computation efficiently.
In summary, both processors have their own strengths. The HiSilicon Kirin 970 offers a slightly lower TDP and a more advanced 10 nm lithography. On the other hand, the Unisoc Tiger T618 features a higher TDP rating but compensates with its own NPU. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the user or device in which they are utilized.
Starting with the HiSilicon Kirin 970, it features an architecture that consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This provides a total of 8 cores, offering a balance between high-performance computing and power efficiency. It utilizes the ARMv8-A instruction set and has a lithography of 10 nm, which contributes to its power-saving capabilities.
With 5500 million transistors, the HiSilicon Kirin 970 is capable of handling complex tasks efficiently. It has a TDP (Thermal Design Power) rating of 9 Watts, which determines the maximum amount of power the processor can consume under normal operating conditions. Additionally, it incorporates HiSilicon's Neural Processing Unit (NPU) for advanced artificial intelligence computation, enhancing the overall performance and efficiency of the processor.
Moving on to the Unisoc Tiger T618, it features an architecture with 2x 2.0 GHz Cortex-A75 cores and 6x 2.0 GHz Cortex-A55 cores. Similar to the Kirin 970, it also has a total of 8 cores, providing a balance between power and performance. It utilizes the ARMv8.2-A instruction set and has a lithography of 12 nm.
With a TDP rating of 10 Watts, the Tiger T618 offers slightly higher power consumption compared to the Kirin 970. However, it comes with its own Neural Processing Unit (NPU) to facilitate artificial intelligence computation efficiently.
In summary, both processors have their own strengths. The HiSilicon Kirin 970 offers a slightly lower TDP and a more advanced 10 nm lithography. On the other hand, the Unisoc Tiger T618 features a higher TDP rating but compensates with its own NPU. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the user or device in which they are utilized.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.0 GHz – Cortex-A75 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 10 Watt |
Neural Processing | HiSilicon NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 6 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 750 MHz | 850 MHz |
Execution units | 12 | 2 |
Shaders | 192 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2400x1080 |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64M |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2017 September | 2019 August |
Partnumber | Hi3670 | T618 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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