MediaTek Dimensity 810 vs Unisoc Tanggula T760 5G
The Unisoc Tanggula T760 5G and MediaTek Dimensity 810 are two processors that offer powerful performance and advanced features. Let's compare their specifications to see how they stack up against each other.
In terms of CPU cores and architecture, both processors feature eight cores and use the ARMv8.2-A instruction set. However, there are some differences in the configuration. The Unisoc Tanggula T760 5G has four Cortex-A76 cores clocked at 2.2 GHz and four Cortex-A55 cores clocked at 1.8 GHz. On the other hand, the MediaTek Dimensity 810 has two Cortex-A76 cores clocked at 2.4 GHz and six Cortex-A55 cores clocked at 2.0 GHz. This suggests that the MediaTek Dimensity 810 may have a slight advantage in terms of raw processing power and speed.
Both processors are built on a 6 nm lithography, which indicates that they are relatively advanced in terms of manufacturing technology. This allows for improved power efficiency and performance compared to older processors. The Unisoc Tanggula T760 5G has a TDP (thermal design power) of 5 Watts, while the MediaTek Dimensity 810 has a TDP of 8 Watts. This means that the Unisoc Tanggula T760 5G may consume less power, leading to longer battery life in devices that use this processor.
In terms of neural processing capabilities, both processors feature an NPU (neural processing unit). This is a specialized component that enhances AI and machine learning performance. The specifications of the NPUs are not provided, so it's difficult to make a direct comparison. However, it is worth noting that both processors have this feature, which indicates their focus on advanced AI capabilities.
One additional specification provided for the MediaTek Dimensity 810 is the number of transistors, which is 12000 million. This indicates a high level of transistor density and can contribute to improved performance and efficiency.
In conclusion, both the Unisoc Tanggula T760 5G and MediaTek Dimensity 810 processors offer powerful performance and advanced features. While the specific strengths and weaknesses of each processor may require further evaluation, the MediaTek Dimensity 810 appears to have a slight advantage in terms of raw processing power, while the Unisoc Tanggula T760 5G may offer better power efficiency. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the device being developed.
In terms of CPU cores and architecture, both processors feature eight cores and use the ARMv8.2-A instruction set. However, there are some differences in the configuration. The Unisoc Tanggula T760 5G has four Cortex-A76 cores clocked at 2.2 GHz and four Cortex-A55 cores clocked at 1.8 GHz. On the other hand, the MediaTek Dimensity 810 has two Cortex-A76 cores clocked at 2.4 GHz and six Cortex-A55 cores clocked at 2.0 GHz. This suggests that the MediaTek Dimensity 810 may have a slight advantage in terms of raw processing power and speed.
Both processors are built on a 6 nm lithography, which indicates that they are relatively advanced in terms of manufacturing technology. This allows for improved power efficiency and performance compared to older processors. The Unisoc Tanggula T760 5G has a TDP (thermal design power) of 5 Watts, while the MediaTek Dimensity 810 has a TDP of 8 Watts. This means that the Unisoc Tanggula T760 5G may consume less power, leading to longer battery life in devices that use this processor.
In terms of neural processing capabilities, both processors feature an NPU (neural processing unit). This is a specialized component that enhances AI and machine learning performance. The specifications of the NPUs are not provided, so it's difficult to make a direct comparison. However, it is worth noting that both processors have this feature, which indicates their focus on advanced AI capabilities.
One additional specification provided for the MediaTek Dimensity 810 is the number of transistors, which is 12000 million. This indicates a high level of transistor density and can contribute to improved performance and efficiency.
In conclusion, both the Unisoc Tanggula T760 5G and MediaTek Dimensity 810 processors offer powerful performance and advanced features. While the specific strengths and weaknesses of each processor may require further evaluation, the MediaTek Dimensity 810 appears to have a slight advantage in terms of raw processing power, while the Unisoc Tanggula T760 5G may offer better power efficiency. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the device being developed.
CPU cores and architecture
Architecture | 2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 6 nm | 6 nm |
Number of transistors | 12000 million | |
TDP | 8 Watt | 5 Watt |
Neural Processing | NPU | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP2 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 950 MHz | 850 MHz |
Execution units | 2 | 6 |
Shaders | 32 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | 2160x1080 |
Max camera resolution | 1x 64MP, 2x 16MP | 1x 64MP, 2x 24MP |
Max Video Capture | 2K@30FPS | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.7 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 Quarter 3 | 2021 February |
Partnumber | MT6833V/PNZA, MT6833P | T760 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 680 vs HiSilicon Kirin 990 4G
2
Samsung Exynos 8895 vs MediaTek Dimensity 1000L
3
Apple A17 Pro vs MediaTek Helio G88
4
Qualcomm Snapdragon 730 vs MediaTek Dimensity 800U
5
Qualcomm Snapdragon 6 Gen 1 vs MediaTek Dimensity 930
6
HiSilicon Kirin 990 5G vs Unisoc Tanggula T760 5G
7
MediaTek Helio P60 vs Unisoc Tiger T606
8
Apple A14 Bionic vs MediaTek Dimensity 8000
9
Qualcomm Snapdragon 821 vs MediaTek Dimensity 7200
10
MediaTek Helio G25 vs Samsung Exynos 7880