MediaTek Dimensity 700 vs Unisoc Tanggula T770 5G
The Unisoc Tanggula T770 5G processor boasts a powerful architecture, consisting of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. It is equipped with eight cores in total, offering a diverse combination of processing power for various tasks. This processor follows the ARMv8.2-A instruction set and operates on a 6 nm lithography, ensuring efficient performance and power consumption. With a TDP of just 5 Watts, the Tanggula T770 5G processor effectively balances power usage while maintaining optimal functionality. Additionally, it features a Neural Processing Unit (NPU) for enhanced artificial intelligence capabilities, enabling faster and more accurate machine learning tasks.
On the other hand, the MediaTek Dimensity 700 processor also offers eight cores, comprising of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Similar to the Tanggula T770 5G, it utilizes the ARMv8.2-A instruction set, but operates on a 7 nm lithography. With a slightly higher TDP of 10 Watts, the Dimensity 700 processor provides a balance between performance and power consumption.
Comparing the specifications of the two processors, it is evident that they share several similarities. Both processors consist of eight cores and support the same instruction set. However, there are notable differences in their CPU architecture, lithography, TDP, and the presence of an NPU.
The Tanggula T770 5G processor offers a higher clock speed for its Cortex-A76 cores, potentially leading to better performance in tasks that require a higher single-core performance. Furthermore, its 6 nm lithography and lower TDP suggest that it may provide better power efficiency compared to the Dimensity 700.
On the other hand, the Dimensity 700 processor provides a higher clock speed for its Cortex-A55 cores, potentially enhancing its multitasking capabilities. Although it operates on a slightly larger lithography and has a higher TDP, it still manages to maintain a balance between performance and power consumption.
In conclusion, while both processors offer impressive specifications, each has its own strengths and weaknesses. The Tanggula T770 5G excels in single-core performance and power efficiency with its 6 nm lithography and lower TDP. On the other hand, the Dimensity 700 prioritizes multitasking capabilities and still maintains a good balance between performance and power consumption. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the user.
On the other hand, the MediaTek Dimensity 700 processor also offers eight cores, comprising of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Similar to the Tanggula T770 5G, it utilizes the ARMv8.2-A instruction set, but operates on a 7 nm lithography. With a slightly higher TDP of 10 Watts, the Dimensity 700 processor provides a balance between performance and power consumption.
Comparing the specifications of the two processors, it is evident that they share several similarities. Both processors consist of eight cores and support the same instruction set. However, there are notable differences in their CPU architecture, lithography, TDP, and the presence of an NPU.
The Tanggula T770 5G processor offers a higher clock speed for its Cortex-A76 cores, potentially leading to better performance in tasks that require a higher single-core performance. Furthermore, its 6 nm lithography and lower TDP suggest that it may provide better power efficiency compared to the Dimensity 700.
On the other hand, the Dimensity 700 processor provides a higher clock speed for its Cortex-A55 cores, potentially enhancing its multitasking capabilities. Although it operates on a slightly larger lithography and has a higher TDP, it still manages to maintain a balance between performance and power consumption.
In conclusion, while both processors offer impressive specifications, each has its own strengths and weaknesses. The Tanggula T770 5G excels in single-core performance and power efficiency with its 6 nm lithography and lower TDP. On the other hand, the Dimensity 700 prioritizes multitasking capabilities and still maintains a good balance between performance and power consumption. Ultimately, the choice between the two processors depends on the specific requirements and priorities of the user.
CPU cores and architecture
Architecture | 2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 10 Watt | 5 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 32 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 2x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.2 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP2 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 950 MHz | 850 MHz |
Execution units | 2 | 6 |
Shaders | 32 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | 2160x1080@120Hz |
Max camera resolution | 1x 64MP, 2x 16MP | 1x 108MP, 2x 24MP |
Max Video Capture | 2K@30FPS | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 2.77 Gbps | 2.7 Gbps |
Peak Upload Speed | 1.2 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC QZSS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2021 Quarter 1 | 2021 February |
Partnumber | MT6833V/ZA, MT6833V/NZA | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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