HiSilicon Kirin 985 5G vs Unisoc Tiger T606

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When comparing the specifications of the HiSilicon Kirin 985 5G and the Unisoc Tiger T606 processors, several key differences can be observed.

In terms of CPU architecture, the HiSilicon Kirin 985 5G utilizes a combination of cores including 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55. On the other hand, the Unisoc Tiger T606 features 2x 1.6 GHz Cortex-A75 and 6x 1.6 GHz Cortex-A55 cores. Both processors have a total of 8 cores, but the arrangement and speeds differ.

The instruction set for both processors is ARMv8.2-A, ensuring compatibility with modern software and applications. However, it is important to note that the HiSilicon Kirin 985 5G boasts a slightly more advanced lithography process at 7 nm, compared to the Unisoc Tiger T606's 12 nm lithography. This suggests that the HiSilicon Kirin 985 5G may offer better power efficiency and potentially improved performance.

Another aspect to consider is the thermal design power (TDP), which measures the maximum amount of heat generated and dissipated by a processor. The HiSilicon Kirin 985 5G has a TDP of 6 watts, indicating a low power consumption. In contrast, the Unisoc Tiger T606 has a TDP of 10 watts, suggesting a higher power consumption.

Furthermore, the HiSilicon Kirin 985 5G incorporates Huawei's Ascend D110 Lite and Ascend D100 Tiny neural processing units, utilizing the HUAWEI Da Vinci Architecture. These neural processing units enhance the performance of artificial intelligence tasks and contribute to improved overall processing capabilities.

Although both processors are suitable for various applications, the HiSilicon Kirin 985 5G's advanced lithography process, lower TDP, and neural processing units make it an attractive choice for those seeking high-performance and energy-efficient processing power. Conversely, the Unisoc Tiger T606 may be suitable for less power-demanding tasks where efficient power management is not a primary concern.

Ultimately, choosing between these processors will depend on the specific requirements and priorities of the user or application.

CPU cores and architecture

Architecture	1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55	2x 1.6 GHz – Cortex-A75 6x 1.6 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8.2-A	ARMv8.2-A
Lithography	7 nm	12 nm
TDP	6 Watt	10 Watt
Neural Processing	Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount	up to 12 GB	up to 8 GB
Memory type	LPDDR4X	LPDDR4X
Memory frequency	2133 MHz	1600 MHz
Memory-bus	4x16 bit	2x16 bit

Storage

Storage specification

UFS 3.0

UFS 2.1

Graphics

GPU name	Mali-G77 MP8	Mali-G57 MP1
GPU Architecture	Valhall	Valhall
GPU frequency	700 MHz	650 MHz
Execution units	8	1
Shaders	128	16
DirectX	12	12
OpenCL API	2.1	2.1
OpenGL API	ES 3.2	ES 3.2
Vulkan API	1.2	1.2

Camera, Video, Display

Max screen resolution	3120x1440	1600x900@90Hz
Max camera resolution	1x 48MP, 2x 20MP	1x 24MP, 16MP + 8MP
Max Video Capture	4K@30fp	FullHD@30fps
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC) VP8 VP9

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	1.4 Gbps	0.3 Gbps
Peak Upload Speed	0.2 Gbps	0.1 Gbps
Wi-Fi	5 (802.11ac)	5 (802.11ac)
Bluetooth	5.0	5.0
Satellite navigation	BeiDou GPS Galileo GLONASS	BeiDou GPS Galileo GLONASS