HiSilicon Kirin 985 5G vs Unisoc Tanggula T770 5G

The HiSilicon Kirin 985 5G and Unisoc Tanggula T770 5G are two processors that offer 5G capabilities. While both processors share some similarities, they also have distinct differences in their specifications.

Starting with the HiSilicon Kirin 985 5G, it features a total of 8 CPU cores with a unique architecture. It comprises of 1x 2.58 GHz Cortex-A76, 3x 2.4 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This combination provides a balance between performance and power efficiency. The Kirin 985 5G also operates at a lithography of 7 nm and has a thermal design power of 6 Watts. In terms of neural processing, it utilizes the Ascend D110 Lite and Ascend D100 Tiny, which are based on the HUAWEI Da Vinci Architecture.

On the other hand, the Unisoc Tanggula T770 5G also features 8 CPU cores but with a different architecture. It consists of 1x 2.5 GHz Cortex-A76, 3x 2.2 GHz Cortex-A76, and 4x 2.0 GHz Cortex-A55 cores. This configuration offers a slightly higher clock speed across all cores, potentially resulting in improved performance. The Tanggula T770 5G operates at a lithography of 6 nm, indicating a slightly more advanced manufacturing process. It has a thermal design power of 5 Watts and utilizes an NPU for neural processing.

In summary, the HiSilicon Kirin 985 5G and Unisoc Tanggula T770 5G are two processors designed for 5G connectivity. While they both have 8 CPU cores and support ARMv8.2-A instruction set, they differ in their clock speeds, lithography, thermal design power, and neural processing methods. The Kirin 985 5G offers a more varied core configuration and utilizes the Ascend D110 Lite and Ascend D100 Tiny for neural processing. On the other hand, the Tanggula T770 5G features higher clock speeds and utilizes an NPU. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the device or system they are being used in.