HiSilicon Kirin 985 5G vs Unisoc Tanggula T740 5G

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The HiSilicon Kirin 985 5G and the Unisoc Tanggula T740 5G are both processors designed for mobile devices. Let's compare their specifications to see how they measure up against each other.

Starting with the HiSilicon Kirin 985 5G, it has a powerful CPU configuration. It boasts an architecture consisting of 1x 2.58 GHz Cortex-A76 core, 3x 2.4 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor can handle demanding tasks efficiently. It also supports the ARMv8.2-A instruction set. The Kirin 985 5G is built using a 7 nm lithography process, which enhances power efficiency and performance. It has a TDP (Thermal Design Power) of 6 watts, making it an energy-efficient processor. Additionally, it features neural processing capabilities with the Ascend D110 Lite + Ascend D100 Tiny and HUAWEI Da Vinci Architecture.

On the other hand, the Unisoc Tanggula T740 5G offers a balanced CPU configuration. It consists of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Similar to the Kirin 985 5G, it supports the ARMv8.2-A instruction set. However, it has a higher lithography process of 12 nm, which may result in relatively higher power consumption compared to the Kirin 985 5G. It features dual NPUs (Neural Processing Units), which enhance its capability to handle AI-related tasks.

In summary, both the HiSilicon Kirin 985 5G and the Unisoc Tanggula T740 5G offer octa-core processors with ARMv8.2-A instruction set support. The Kirin 985 5G has a more powerful and diverse CPU architecture with a combination of Cortex-A76 and Cortex-A55 cores. It also utilizes a more advanced 7 nm lithography process and features Ascend and HUAWEI neural processing technologies. On the other hand, the Tanggula T740 5G has a balanced CPU configuration with Cortex-A75 and Cortex-A55 cores, along with dual NPUs for AI tasks. However, it has a higher lithography process of 12 nm, which may impact its power efficiency. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the mobile device application.

CPU cores and architecture

Architecture 1x 2.58 GHz – Cortex-A76
3x 2.4 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
4x 1.8 GHz – Cortex-A75
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 12 nm
TDP 6 Watt
Neural Processing Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture Dual NPU

Memory (RAM)

Max amount up to 12 GB up to 8 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 1866 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 3.0 UFS 2.1

Graphics

GPU name Mali-G77 MP8 Imagination PowerVR GM9446
GPU Architecture Valhall Rogue
GPU frequency 700 MHz 800 MHz
Execution units 8
Shaders 128
DirectX 12
OpenCL API 2.1 4.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.1

Camera, Video, Display

Max screen resolution 3120x1440 2960x1440@60Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP
Max Video Capture 4K@30fp 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.4 Gbps 1.5 Gbps
Peak Upload Speed 0.2 Gbps 0.75 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 5.0 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 Quarter 2 2020 Quarter 1
Partnumber Hi6290 T740, Tiger T7510
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 985 5G
467882
Tanggula T740 5G
220285

GeekBench 6 Single-Core

Score
Kirin 985 5G
699
Tanggula T740 5G
369

GeekBench 6 Multi-Core

Score
Kirin 985 5G
2593
Tanggula T740 5G
1391