HiSilicon Kirin 985 5G vs Unisoc Tanggula T740 5G
The HiSilicon Kirin 985 5G and the Unisoc Tanggula T740 5G are both processors designed for mobile devices. Let's compare their specifications to see how they measure up against each other.
Starting with the HiSilicon Kirin 985 5G, it has a powerful CPU configuration. It boasts an architecture consisting of 1x 2.58 GHz Cortex-A76 core, 3x 2.4 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor can handle demanding tasks efficiently. It also supports the ARMv8.2-A instruction set. The Kirin 985 5G is built using a 7 nm lithography process, which enhances power efficiency and performance. It has a TDP (Thermal Design Power) of 6 watts, making it an energy-efficient processor. Additionally, it features neural processing capabilities with the Ascend D110 Lite + Ascend D100 Tiny and HUAWEI Da Vinci Architecture.
On the other hand, the Unisoc Tanggula T740 5G offers a balanced CPU configuration. It consists of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Similar to the Kirin 985 5G, it supports the ARMv8.2-A instruction set. However, it has a higher lithography process of 12 nm, which may result in relatively higher power consumption compared to the Kirin 985 5G. It features dual NPUs (Neural Processing Units), which enhance its capability to handle AI-related tasks.
In summary, both the HiSilicon Kirin 985 5G and the Unisoc Tanggula T740 5G offer octa-core processors with ARMv8.2-A instruction set support. The Kirin 985 5G has a more powerful and diverse CPU architecture with a combination of Cortex-A76 and Cortex-A55 cores. It also utilizes a more advanced 7 nm lithography process and features Ascend and HUAWEI neural processing technologies. On the other hand, the Tanggula T740 5G has a balanced CPU configuration with Cortex-A75 and Cortex-A55 cores, along with dual NPUs for AI tasks. However, it has a higher lithography process of 12 nm, which may impact its power efficiency. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the mobile device application.
Starting with the HiSilicon Kirin 985 5G, it has a powerful CPU configuration. It boasts an architecture consisting of 1x 2.58 GHz Cortex-A76 core, 3x 2.4 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor can handle demanding tasks efficiently. It also supports the ARMv8.2-A instruction set. The Kirin 985 5G is built using a 7 nm lithography process, which enhances power efficiency and performance. It has a TDP (Thermal Design Power) of 6 watts, making it an energy-efficient processor. Additionally, it features neural processing capabilities with the Ascend D110 Lite + Ascend D100 Tiny and HUAWEI Da Vinci Architecture.
On the other hand, the Unisoc Tanggula T740 5G offers a balanced CPU configuration. It consists of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Similar to the Kirin 985 5G, it supports the ARMv8.2-A instruction set. However, it has a higher lithography process of 12 nm, which may result in relatively higher power consumption compared to the Kirin 985 5G. It features dual NPUs (Neural Processing Units), which enhance its capability to handle AI-related tasks.
In summary, both the HiSilicon Kirin 985 5G and the Unisoc Tanggula T740 5G offer octa-core processors with ARMv8.2-A instruction set support. The Kirin 985 5G has a more powerful and diverse CPU architecture with a combination of Cortex-A76 and Cortex-A55 cores. It also utilizes a more advanced 7 nm lithography process and features Ascend and HUAWEI neural processing technologies. On the other hand, the Tanggula T740 5G has a balanced CPU configuration with Cortex-A75 and Cortex-A55 cores, along with dual NPUs for AI tasks. However, it has a higher lithography process of 12 nm, which may impact its power efficiency. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the mobile device application.
CPU cores and architecture
Architecture | 1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 6 Watt | |
Neural Processing | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture | Dual NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.0 | UFS 2.1 |
Graphics
GPU name | Mali-G77 MP8 | Imagination PowerVR GM9446 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 700 MHz | 800 MHz |
Execution units | 8 | |
Shaders | 128 | |
DirectX | 12 | |
OpenCL API | 2.1 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.1 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 2960x1440@60Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP |
Max Video Capture | 4K@30fp | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 1.5 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.75 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 2 | 2020 Quarter 1 |
Partnumber | Hi6290 | T740, Tiger T7510 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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