HiSilicon Kirin 980 vs Unisoc Tanggula T760 5G

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The HiSilicon Kirin 980 and Unisoc Tanggula T760 5G are two processors that offer different specifications and features.

Starting with the HiSilicon Kirin 980, it features a CPU architecture that includes 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This architecture provides a balance between power and efficiency, making it suitable for a wide range of tasks. With a 7 nm lithography and 6900 million transistors, the Kirin 980 is designed to deliver high performance while keeping power consumption low. Its TDP (thermal design power) is 6 Watt, indicating efficient heat management. Additionally, the HiSilicon Kirin 980 is equipped with a HiSilicon Dual NPU (neural processing unit), providing enhanced AI capabilities for tasks such as image recognition and voice processing.

On the other hand, the Unisoc Tanggula T760 5G features a different CPU architecture. It consists of 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. This architecture offers a higher clock speed for the Cortex-A76 cores, potentially providing better single-threaded performance. The Tanggula T760 5G has a 6 nm lithography, which is slightly smaller than the Kirin 980, potentially resulting in improved power efficiency. Its TDP is 5 Watt, indicating a similar power consumption to the Kirin 980. The Tanggula T760 5G includes an NPU (neural processing unit) for AI tasks, although specific details about its capabilities are not provided.

In conclusion, the HiSilicon Kirin 980 and Unisoc Tanggula T760 5G processors differ in their CPU architectures, lithography, and NPUs. While the Kirin 980 offers a more diverse CPU configuration and a HiSilicon Dual NPU, the Tanggula T760 5G provides a higher clock speed for its Cortex-A76 cores and a smaller lithography. The choice between these processors would depend on specific usage requirements and priorities, such as AI performance, power consumption, and single-threaded performance.

CPU cores and architecture

Architecture 2x 2.6 GHz – Cortex-A76
2x 1.92 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
4x 2.2 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 6900 million
TDP 6 Watt 5 Watt
Neural Processing HiSilicon Dual NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G76 MP10 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 720 MHz 850 MHz
Execution units 10 6
Shaders 160 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3120x1440 2160x1080
Max camera resolution 1x 48MP, 2x 32MP 1x 64MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.4 Gbps 2.7 Gbps
Peak Upload Speed 0.2 Gbps 1.5 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.0 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2018 Quarter 4 2021 February
Partnumber T760
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 980
484026
Tanggula T760 5G
243570

GeekBench 6 Single-Core

Score
Kirin 980
698
Tanggula T760 5G
559

GeekBench 6 Multi-Core

Score
Kirin 980
2482
Tanggula T760 5G
2249