HiSilicon Kirin 980 vs Unisoc Tanggula T760 5G
The HiSilicon Kirin 980 and Unisoc Tanggula T760 5G are two processors that offer different specifications and features.
Starting with the HiSilicon Kirin 980, it features a CPU architecture that includes 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This architecture provides a balance between power and efficiency, making it suitable for a wide range of tasks. With a 7 nm lithography and 6900 million transistors, the Kirin 980 is designed to deliver high performance while keeping power consumption low. Its TDP (thermal design power) is 6 Watt, indicating efficient heat management. Additionally, the HiSilicon Kirin 980 is equipped with a HiSilicon Dual NPU (neural processing unit), providing enhanced AI capabilities for tasks such as image recognition and voice processing.
On the other hand, the Unisoc Tanggula T760 5G features a different CPU architecture. It consists of 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. This architecture offers a higher clock speed for the Cortex-A76 cores, potentially providing better single-threaded performance. The Tanggula T760 5G has a 6 nm lithography, which is slightly smaller than the Kirin 980, potentially resulting in improved power efficiency. Its TDP is 5 Watt, indicating a similar power consumption to the Kirin 980. The Tanggula T760 5G includes an NPU (neural processing unit) for AI tasks, although specific details about its capabilities are not provided.
In conclusion, the HiSilicon Kirin 980 and Unisoc Tanggula T760 5G processors differ in their CPU architectures, lithography, and NPUs. While the Kirin 980 offers a more diverse CPU configuration and a HiSilicon Dual NPU, the Tanggula T760 5G provides a higher clock speed for its Cortex-A76 cores and a smaller lithography. The choice between these processors would depend on specific usage requirements and priorities, such as AI performance, power consumption, and single-threaded performance.
Starting with the HiSilicon Kirin 980, it features a CPU architecture that includes 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This architecture provides a balance between power and efficiency, making it suitable for a wide range of tasks. With a 7 nm lithography and 6900 million transistors, the Kirin 980 is designed to deliver high performance while keeping power consumption low. Its TDP (thermal design power) is 6 Watt, indicating efficient heat management. Additionally, the HiSilicon Kirin 980 is equipped with a HiSilicon Dual NPU (neural processing unit), providing enhanced AI capabilities for tasks such as image recognition and voice processing.
On the other hand, the Unisoc Tanggula T760 5G features a different CPU architecture. It consists of 4x 2.2 GHz Cortex-A76 cores and 4x 1.8 GHz Cortex-A55 cores. This architecture offers a higher clock speed for the Cortex-A76 cores, potentially providing better single-threaded performance. The Tanggula T760 5G has a 6 nm lithography, which is slightly smaller than the Kirin 980, potentially resulting in improved power efficiency. Its TDP is 5 Watt, indicating a similar power consumption to the Kirin 980. The Tanggula T760 5G includes an NPU (neural processing unit) for AI tasks, although specific details about its capabilities are not provided.
In conclusion, the HiSilicon Kirin 980 and Unisoc Tanggula T760 5G processors differ in their CPU architectures, lithography, and NPUs. While the Kirin 980 offers a more diverse CPU configuration and a HiSilicon Dual NPU, the Tanggula T760 5G provides a higher clock speed for its Cortex-A76 cores and a smaller lithography. The choice between these processors would depend on specific usage requirements and priorities, such as AI performance, power consumption, and single-threaded performance.
CPU cores and architecture
Architecture | 2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
4x 2.2 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 6900 million | |
TDP | 6 Watt | 5 Watt |
Neural Processing | HiSilicon Dual NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G76 MP10 | Mali-G57 MP6 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 720 MHz | 850 MHz |
Execution units | 10 | 6 |
Shaders | 160 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 2160x1080 |
Max camera resolution | 1x 48MP, 2x 32MP | 1x 64MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.5 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 4 | 2021 February |
Partnumber | T760 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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