HiSilicon Kirin 980 vs Unisoc Tanggula T740 5G

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The HiSilicon Kirin 980 and Unisoc Tanggula T740 5G are two processors with distinct specifications, which can greatly impact the performance and capabilities of devices they power.

Starting with the HiSilicon Kirin 980, it features a sophisticated architecture with a combination of powerful CPU cores. It includes 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This diverse combination allows for optimized performance across various tasks, from demanding applications to efficient power management. The Kirin 980 also boasts an ARMv8-A instruction set, which ensures compatibility with modern software and technology. Furthermore, the processor is built using a 7 nm lithography process, resulting in more efficient power consumption and heat management. With a high number of transistors, reaching 6900 million, the Kirin 980 can handle complex processes while maintaining a TDP of 6 Watts. Additionally, it is equipped with the HiSilicon Dual NPU, enhancing artificial intelligence capabilities and enabling advanced neural processing.

On the other hand, the Unisoc Tanggula T740 5G offers its own unique specifications. Its architecture consists of 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. While the T740 lacks the same diversity in CPU cores as the Kirin 980, it still provides a solid foundation for performance and power efficiency. The processor supports ARMv8.2-A instruction set, ensuring compatibility with modern applications. However, the Tanggula T740 is built using a 12 nm lithography process, which may not offer the same level of power efficiency as the Kirin 980's 7 nm process. Similar to the Kirin 980, the T740 features a dual NPU design, which enables neural processing and AI capabilities.

In summary, both the HiSilicon Kirin 980 and Unisoc Tanggula T740 5G processors have their own sets of advantages and limitations. The Kirin 980 stands out with its powerful and diverse CPU cores, advanced instruction set, and more efficient 7 nm lithography. On the other hand, the Tanggula T740 offers solid performance with its CPU architecture and also incorporates dual NPU technology for AI capabilities. The choice between these processors ultimately depends on specific device requirements and the desired balance between power, performance, and energy efficiency.

CPU cores and architecture

Architecture 2x 2.6 GHz – Cortex-A76
2x 1.92 GHz – Cortex-A76
4x 1.8 GHz – Cortex-A55
4x 1.8 GHz – Cortex-A75
4x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 7 nm 12 nm
Number of transistors 6900 million
TDP 6 Watt
Neural Processing HiSilicon Dual NPU Dual NPU

Memory (RAM)

Max amount up to 8 GB up to 8 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 1866 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G76 MP10 Imagination PowerVR GM9446
GPU Architecture Bifrost Rogue
GPU frequency 720 MHz 800 MHz
Execution units 10
Shaders 160
DirectX 12
OpenCL API 2.1 4.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.1

Camera, Video, Display

Max screen resolution 3120x1440 2960x1440@60Hz
Max camera resolution 1x 48MP, 2x 32MP 1x 64MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.4 Gbps 1.5 Gbps
Peak Upload Speed 0.2 Gbps 0.75 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.0 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2018 Quarter 4 2020 Quarter 1
Partnumber T740, Tiger T7510
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 980
484026
Tanggula T740 5G
220285

GeekBench 6 Single-Core

Score
Kirin 980
698
Tanggula T740 5G
369

GeekBench 6 Multi-Core

Score
Kirin 980
2482
Tanggula T740 5G
1391