HiSilicon Kirin 980 vs HiSilicon Kirin 985 5G
The HiSilicon Kirin 980 and the HiSilicon Kirin 985 5G are two processors designed by HiSilicon Technologies Co., Ltd. While both processors share some similarities, they also have notable differences in their specifications.
Starting with the HiSilicon Kirin 980, it features an architecture comprised of two Cortex-A76 cores clocked at 2.6 GHz, two Cortex-A76 cores clocked at 1.92 GHz, and four Cortex-A55 cores clocked at 1.8 GHz. With a total of eight cores, this processor offers a variety of computing power for different tasks. The instruction set supported is ARMv8-A, and it boasts a 7 nm lithography, making it power-efficient. Additionally, the HiSilicon Kirin 980 incorporates the HiSilicon Dual Neural Processing Unit (NPU) for enhanced artificial intelligence capabilities.
On the other hand, the HiSilicon Kirin 985 5G features a slightly different architecture. It consists of one Cortex-A76 core clocked at 2.58 GHz, three Cortex-A76 cores clocked at 2.4 GHz, and four Cortex-A55 cores clocked at 1.84 GHz. Similar to the Kirin 980, it has eight cores in total, allowing for multitasking and efficient performance. The instruction set has been upgraded to ARMv8.2-A, which may provide some performance improvements. Like the Kirin 980, the Kirin 985 5G also employs a 7 nm lithography process for power efficiency. In terms of neural processing, it incorporates the Ascend D110 Lite and Ascend D100 Tiny, utilizing the HUAWEI Da Vinci Architecture.
Both processors have a thermal design power (TDP) of 6 Watts, indicating their power efficiency. This is crucial as it allows for longer battery life and reduced heat generation in devices. Furthermore, the 7 nm lithography allows for better energy efficiency as it minimizes power leakage.
In summary, the HiSilicon Kirin 980 and the HiSilicon Kirin 985 5G are both powerful processors with similar TDP and lithography specifications. However, the Kirin 980 employs the HiSilicon Dual NPU, while the Kirin 985 5G incorporates the Ascend D110 Lite and Ascend D100 Tiny with the HUAWEI Da Vinci Architecture for enhanced neural processing capabilities. These processors cater to devices with various computing needs and can offer efficient performance paired with power-saving benefits.
Starting with the HiSilicon Kirin 980, it features an architecture comprised of two Cortex-A76 cores clocked at 2.6 GHz, two Cortex-A76 cores clocked at 1.92 GHz, and four Cortex-A55 cores clocked at 1.8 GHz. With a total of eight cores, this processor offers a variety of computing power for different tasks. The instruction set supported is ARMv8-A, and it boasts a 7 nm lithography, making it power-efficient. Additionally, the HiSilicon Kirin 980 incorporates the HiSilicon Dual Neural Processing Unit (NPU) for enhanced artificial intelligence capabilities.
On the other hand, the HiSilicon Kirin 985 5G features a slightly different architecture. It consists of one Cortex-A76 core clocked at 2.58 GHz, three Cortex-A76 cores clocked at 2.4 GHz, and four Cortex-A55 cores clocked at 1.84 GHz. Similar to the Kirin 980, it has eight cores in total, allowing for multitasking and efficient performance. The instruction set has been upgraded to ARMv8.2-A, which may provide some performance improvements. Like the Kirin 980, the Kirin 985 5G also employs a 7 nm lithography process for power efficiency. In terms of neural processing, it incorporates the Ascend D110 Lite and Ascend D100 Tiny, utilizing the HUAWEI Da Vinci Architecture.
Both processors have a thermal design power (TDP) of 6 Watts, indicating their power efficiency. This is crucial as it allows for longer battery life and reduced heat generation in devices. Furthermore, the 7 nm lithography allows for better energy efficiency as it minimizes power leakage.
In summary, the HiSilicon Kirin 980 and the HiSilicon Kirin 985 5G are both powerful processors with similar TDP and lithography specifications. However, the Kirin 980 employs the HiSilicon Dual NPU, while the Kirin 985 5G incorporates the Ascend D110 Lite and Ascend D100 Tiny with the HUAWEI Da Vinci Architecture for enhanced neural processing capabilities. These processors cater to devices with various computing needs and can offer efficient performance paired with power-saving benefits.
CPU cores and architecture
Architecture | 2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
1x 2.58 GHz – Cortex-A76 3x 2.4 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 6 Watt | 6 Watt |
Neural Processing | HiSilicon Dual NPU | Ascend D110 Lite + Ascend D100 Tiny, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.0 |
Graphics
GPU name | Mali-G76 MP10 | Mali-G77 MP8 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 720 MHz | 700 MHz |
Execution units | 10 | 8 |
Shaders | 160 | 128 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | 3120x1440 |
Max camera resolution | 1x 48MP, 2x 32MP | 1x 48MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fp |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.4 Gbps | 1.4 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.0 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2018 Quarter 4 | 2020 Quarter 2 |
Partnumber | Hi6290 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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