HiSilicon Kirin 970 vs Unisoc Tiger T612
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The HiSilicon Kirin 970 and the Unisoc Tiger T612 are two processors that have unique features and capabilities.
Starting with the HiSilicon Kirin 970, it boasts a powerful architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This combination of high-performance and energy-efficient cores allows for efficient multitasking and smooth performance. The processor operates on the ARMv8-A instruction set and is manufactured using a 10 nm lithography. With 5500 million transistors, the Kirin 970 offers a complex and efficient design. Additionally, this processor includes the HiSilicon NPU that enables advanced neural processing capabilities. With a TDP (Thermal Design Power) of 9 watts, it provides efficient power consumption.
On the other hand, the Unisoc Tiger T612 showcases a different architecture, with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. While it offers a balanced combination of high-performance and power efficiency, its overall performance may be slightly lower compared to the Kirin 970. The Tiger T612 utilizes the ARMv8.2-A instruction set and is fabricated using a 12 nm lithography. With a TDP of 10 watts, it requires slightly more power compared to the Kirin 970.
In terms of specifications, both processors have 8 cores, providing ample processing power for various tasks. However, the Kirin 970 uses the ARMv8-A instruction set, while the Tiger T612 operates on the ARMv8.2-A instruction set. Additionally, the Kirin 970 holds an advantage in transistor count with 5500 million transistors compared to the Tiger T612.
Overall, the HiSilicon Kirin 970 and the Unisoc Tiger T612 offer different strengths and capabilities. The Kirin 970 impresses with its powerful architecture, advanced neural processing capabilities, and higher transistor count. On the other hand, the Tiger T612 offers a balanced combination of performance and power efficiency. Both processors cater to different needs and can deliver satisfactory performance in their respective devices.
Starting with the HiSilicon Kirin 970, it boasts a powerful architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This combination of high-performance and energy-efficient cores allows for efficient multitasking and smooth performance. The processor operates on the ARMv8-A instruction set and is manufactured using a 10 nm lithography. With 5500 million transistors, the Kirin 970 offers a complex and efficient design. Additionally, this processor includes the HiSilicon NPU that enables advanced neural processing capabilities. With a TDP (Thermal Design Power) of 9 watts, it provides efficient power consumption.
On the other hand, the Unisoc Tiger T612 showcases a different architecture, with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. While it offers a balanced combination of high-performance and power efficiency, its overall performance may be slightly lower compared to the Kirin 970. The Tiger T612 utilizes the ARMv8.2-A instruction set and is fabricated using a 12 nm lithography. With a TDP of 10 watts, it requires slightly more power compared to the Kirin 970.
In terms of specifications, both processors have 8 cores, providing ample processing power for various tasks. However, the Kirin 970 uses the ARMv8-A instruction set, while the Tiger T612 operates on the ARMv8.2-A instruction set. Additionally, the Kirin 970 holds an advantage in transistor count with 5500 million transistors compared to the Tiger T612.
Overall, the HiSilicon Kirin 970 and the Unisoc Tiger T612 offer different strengths and capabilities. The Kirin 970 impresses with its powerful architecture, advanced neural processing capabilities, and higher transistor count. On the other hand, the Tiger T612 offers a balanced combination of performance and power efficiency. Both processors cater to different needs and can deliver satisfactory performance in their respective devices.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 10 nm | 12 nm |
| Number of transistors | 5500 million | |
| TDP | 9 Watt | 10 Watt |
| Neural Processing | HiSilicon NPU |
Memory (RAM)
| Max amount | up to 8 GB | up to 8 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 1600 MHz |
| Memory-bus | 4x16 bit | 2x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
| GPU name | Mali-G72 MP12 | Mali-G57 MP1 |
| GPU Architecture | Bifrost | Valhall |
| GPU frequency | 750 MHz | 650 MHz |
| Execution units | 12 | 1 |
| Shaders | 192 | 16 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2400x1080 |
| Max camera resolution | 1x 48MP, 2x 20MP | 1x 50MP |
| Max Video Capture | 4K@30fps | FullHD@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 1.2 Gbps | 0.3 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
| Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
| Bluetooth | 4.2 | 5.0 |
| Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2017 September | 2022 January |
| Partnumber | Hi3670 | T612 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Flagship | Mid-end |
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