HiSilicon Kirin 970 vs Unisoc Tiger T612

VS

The HiSilicon Kirin 970 and the Unisoc Tiger T612 are two processors that have unique features and capabilities.

Starting with the HiSilicon Kirin 970, it boasts a powerful architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This combination of high-performance and energy-efficient cores allows for efficient multitasking and smooth performance. The processor operates on the ARMv8-A instruction set and is manufactured using a 10 nm lithography. With 5500 million transistors, the Kirin 970 offers a complex and efficient design. Additionally, this processor includes the HiSilicon NPU that enables advanced neural processing capabilities. With a TDP (Thermal Design Power) of 9 watts, it provides efficient power consumption.

On the other hand, the Unisoc Tiger T612 showcases a different architecture, with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. While it offers a balanced combination of high-performance and power efficiency, its overall performance may be slightly lower compared to the Kirin 970. The Tiger T612 utilizes the ARMv8.2-A instruction set and is fabricated using a 12 nm lithography. With a TDP of 10 watts, it requires slightly more power compared to the Kirin 970.

In terms of specifications, both processors have 8 cores, providing ample processing power for various tasks. However, the Kirin 970 uses the ARMv8-A instruction set, while the Tiger T612 operates on the ARMv8.2-A instruction set. Additionally, the Kirin 970 holds an advantage in transistor count with 5500 million transistors compared to the Tiger T612.

Overall, the HiSilicon Kirin 970 and the Unisoc Tiger T612 offer different strengths and capabilities. The Kirin 970 impresses with its powerful architecture, advanced neural processing capabilities, and higher transistor count. On the other hand, the Tiger T612 offers a balanced combination of performance and power efficiency. Both processors cater to different needs and can deliver satisfactory performance in their respective devices.

CPU cores and architecture

Architecture	4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53	2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8-A	ARMv8.2-A
Lithography	10 nm	12 nm
Number of transistors	5500 million
TDP	9 Watt	10 Watt
Neural Processing	HiSilicon NPU

Memory (RAM)

Max amount	up to 8 GB	up to 8 GB
Memory type	LPDDR4	LPDDR4X
Memory frequency	1866 MHz	1600 MHz
Memory-bus	4x16 bit	2x16 bit

Storage

Storage specification

UFS 2.1

UFS 2.2

Graphics

GPU name	Mali-G72 MP12	Mali-G57 MP1
GPU Architecture	Bifrost	Valhall
GPU frequency	750 MHz	650 MHz
Execution units	12	1
Shaders	192	16
DirectX	12	12
OpenCL API	2.0	2.1
OpenGL API		ES 3.2
Vulkan API	1.0	1.2

Camera, Video, Display

Max screen resolution	2340x1080	2400x1080
Max camera resolution	1x 48MP, 2x 20MP	1x 50MP
Max Video Capture	4K@30fps	FullHD@30fps
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC) VP8 VP9

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	1.2 Gbps	0.3 Gbps
Peak Upload Speed	0.15 Gbps	0.1 Gbps
Wi-Fi	5 (802.11ac)	5 (802.11ac)
Bluetooth	4.2	5.0
Satellite navigation	BeiDou GPS Galileo GLONASS	BeiDou GPS Galileo GLONASS