HiSilicon Kirin 970 vs Unisoc Tiger T610
When comparing the HiSilicon Kirin 970 and the Unisoc Tiger T610 processors, several key specifications stand out.
In terms of CPU cores and architecture, the HiSilicon Kirin 970 features a total of 8 cores, with a combination of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the Unisoc Tiger T610 also has 8 cores, but with a different architecture consisting of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores.
The instruction set follows a similar pattern, with the HiSilicon Kirin 970 utilizing the ARMv8-A instruction set, while the Unisoc Tiger T610 employs the ARMv8.2-A instruction set.
In terms of lithography, the HiSilicon Kirin 970 boasts a smaller 10 nm lithography, indicating a more advanced and efficient manufacturing process compared to the Unisoc Tiger T610, which has a 12 nm lithography.
Another significant difference lies in the number of transistors. The HiSilicon Kirin 970 features 5500 million transistors, though the Unisoc Tiger T610's transistor count is not specified.
Moving on to the TDP (Thermal Design Power), the HiSilicon Kirin 970 has a lower TDP of 9 Watts, suggesting better power efficiency compared to the Unisoc Tiger T610, which has a TDP of 10 Watts.
Lastly, while the HiSilicon Kirin 970 incorporates a dedicated neural processing unit (NPU) for AI-related tasks, the Unisoc Tiger T610 does not mention any such specialized processing unit.
In summary, the HiSilicon Kirin 970 exhibits a more advanced lithography, lower TDP, and includes a dedicated NPU for AI processing. On the other hand, the Unisoc Tiger T610 offers a different CPU core and architecture configuration. Both processors have their own strengths and weaknesses, catering to different market needs and priorities.
In terms of CPU cores and architecture, the HiSilicon Kirin 970 features a total of 8 cores, with a combination of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the Unisoc Tiger T610 also has 8 cores, but with a different architecture consisting of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores.
The instruction set follows a similar pattern, with the HiSilicon Kirin 970 utilizing the ARMv8-A instruction set, while the Unisoc Tiger T610 employs the ARMv8.2-A instruction set.
In terms of lithography, the HiSilicon Kirin 970 boasts a smaller 10 nm lithography, indicating a more advanced and efficient manufacturing process compared to the Unisoc Tiger T610, which has a 12 nm lithography.
Another significant difference lies in the number of transistors. The HiSilicon Kirin 970 features 5500 million transistors, though the Unisoc Tiger T610's transistor count is not specified.
Moving on to the TDP (Thermal Design Power), the HiSilicon Kirin 970 has a lower TDP of 9 Watts, suggesting better power efficiency compared to the Unisoc Tiger T610, which has a TDP of 10 Watts.
Lastly, while the HiSilicon Kirin 970 incorporates a dedicated neural processing unit (NPU) for AI-related tasks, the Unisoc Tiger T610 does not mention any such specialized processing unit.
In summary, the HiSilicon Kirin 970 exhibits a more advanced lithography, lower TDP, and includes a dedicated NPU for AI processing. On the other hand, the Unisoc Tiger T610 offers a different CPU core and architecture configuration. Both processors have their own strengths and weaknesses, catering to different market needs and priorities.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 10 Watt |
Neural Processing | HiSilicon NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 6 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G52 MP2 |
GPU Architecture | Mali Bifrost | Mali Bifrost |
GPU frequency | 750 MHz | 614.4 MHz |
Execution units | 12 | 2 |
Shaders | 192 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2400x1080 |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 32MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2017 September | 2019 June |
Partnumber | Hi3670 | T610 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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