HiSilicon Kirin 970 vs Unisoc Tiger T310
Based on the specifications, there are several key differences between the HiSilicon Kirin 970 and the Unisoc Tiger T310 processors.
First, let's talk about CPU cores and architecture. The Kirin 970 features an architecture of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores, totaling 8 cores. On the other hand, the Tiger T310 has an architecture of 1x 2 GHz Cortex-A75 core and 3x 1.8 GHz Cortex-A55 cores, totaling 4 cores. This difference in CPU cores and architecture indicates that the Kirin 970 may have better multitasking capabilities and overall performance compared to the Tiger T310.
In terms of instruction sets, the Kirin 970 supports ARMv8-A, while the Tiger T310 supports ARMv8.2-A. This suggests that the Tiger T310 might have better compatibility with newer software and applications that require ARMv8.2-A instruction set.
Moving on to lithography, the Kirin 970 has a lithography of 10 nm, while the Tiger T310 has a lithography of 12 nm. A lower lithography generally indicates a more power-efficient and potentially faster processor. Therefore, the Kirin 970 might have better power efficiency and potentially faster processing speeds compared to the Tiger T310.
Lastly, the Kirin 970 boasts a Neural Processing Unit (NPU) provided by HiSilicon, which enhances artificial intelligence (AI) capabilities. The Tiger T310, on the other hand, does not mention any specific AI features. This means that the Kirin 970 might excel in tasks that require AI, such as facial recognition or language processing.
In conclusion, the HiSilicon Kirin 970 and Unisoc Tiger T310 processors have several differences in their specifications. The Kirin 970 offers more CPU cores and a powerful architecture, better instruction set support, a lower lithography, and the inclusion of a dedicated NPU. These factors suggest that the Kirin 970 may outperform the Tiger T310 in terms of multitasking capabilities, compatibility with newer software, power efficiency, processing speed, and AI-related tasks.
First, let's talk about CPU cores and architecture. The Kirin 970 features an architecture of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores, totaling 8 cores. On the other hand, the Tiger T310 has an architecture of 1x 2 GHz Cortex-A75 core and 3x 1.8 GHz Cortex-A55 cores, totaling 4 cores. This difference in CPU cores and architecture indicates that the Kirin 970 may have better multitasking capabilities and overall performance compared to the Tiger T310.
In terms of instruction sets, the Kirin 970 supports ARMv8-A, while the Tiger T310 supports ARMv8.2-A. This suggests that the Tiger T310 might have better compatibility with newer software and applications that require ARMv8.2-A instruction set.
Moving on to lithography, the Kirin 970 has a lithography of 10 nm, while the Tiger T310 has a lithography of 12 nm. A lower lithography generally indicates a more power-efficient and potentially faster processor. Therefore, the Kirin 970 might have better power efficiency and potentially faster processing speeds compared to the Tiger T310.
Lastly, the Kirin 970 boasts a Neural Processing Unit (NPU) provided by HiSilicon, which enhances artificial intelligence (AI) capabilities. The Tiger T310, on the other hand, does not mention any specific AI features. This means that the Kirin 970 might excel in tasks that require AI, such as facial recognition or language processing.
In conclusion, the HiSilicon Kirin 970 and Unisoc Tiger T310 processors have several differences in their specifications. The Kirin 970 offers more CPU cores and a powerful architecture, better instruction set support, a lower lithography, and the inclusion of a dedicated NPU. These factors suggest that the Kirin 970 may outperform the Tiger T310 in terms of multitasking capabilities, compatibility with newer software, power efficiency, processing speed, and AI-related tasks.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
1x 2 GHz – Cortex-A75 3x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | |
Neural Processing | HiSilicon NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1333 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G72 MP12 | Imagination PowerVR GE8300 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 750 MHz | 660 MHz |
Execution units | 12 | 2 |
Shaders | 192 | 32 |
DirectX | 12 | 10 |
OpenCL API | 2.0 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 1600x720 |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 16MP + 1x 8MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2017 September | 2019 April |
Partnumber | Hi3670 | T310 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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