HiSilicon Kirin 970 vs Unisoc Tanggula T770 5G
When comparing the HiSilicon Kirin 970 and the Unisoc Tanggula T770 5G processors, several key specifications must be considered.
Starting with the HiSilicon Kirin 970, it features a total of 8 CPU cores. These cores are divided into two clusters, with four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. The processor is built on a 10 nm lithography process and is equipped with an instruction set of ARMv8-A. Additionally, it boasts a significant number of transistors, totaling at 5500 million. The thermal design power (TDP) of the HiSilicon Kirin 970 is 9 watts, which indicates its power efficiency. It also comes equipped with HiSilicon's NPU for neural processing tasks.
Moving on to the Unisoc Tanggula T770 5G, this processor also boasts 8 CPU cores. It utilizes a more diverse architecture, consisting of one Cortex-A76 core clocked at 2.5 GHz, three Cortex-A76 cores clocked at 2.2 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. With a smaller 6 nm lithography process, the Unisoc Tanggula T770 5G offers potentially improved power efficiency compared to the HiSilicon Kirin 970. It features an instruction set of ARMv8.2-A and a TDP of 5 watts. Similar to the Kirin 970, it also comes equipped with an NPU for neural processing tasks.
In summary, the HiSilicon Kirin 970 and the Unisoc Tanggula T770 5G processors both offer 8 CPU cores and support ARM architecture. While the Kirin 970 utilizes a combination of Cortex-A73 and Cortex-A53 cores, the Tanggula T770 5G employs a combination of Cortex-A76 and Cortex-A55 cores. The HiSilicon Kirin 970 has a larger lithography process at 10 nm and a higher number of transistors, while the Unisoc Tanggula T770 5G boasts a smaller 6 nm lithography process. The T770 5G also has a lower TDP of 5 watts, potentially indicating better power efficiency. Both processors feature NPUs for neural processing tasks, providing additional capabilities in artificial intelligence and machine learning applications.
Starting with the HiSilicon Kirin 970, it features a total of 8 CPU cores. These cores are divided into two clusters, with four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. The processor is built on a 10 nm lithography process and is equipped with an instruction set of ARMv8-A. Additionally, it boasts a significant number of transistors, totaling at 5500 million. The thermal design power (TDP) of the HiSilicon Kirin 970 is 9 watts, which indicates its power efficiency. It also comes equipped with HiSilicon's NPU for neural processing tasks.
Moving on to the Unisoc Tanggula T770 5G, this processor also boasts 8 CPU cores. It utilizes a more diverse architecture, consisting of one Cortex-A76 core clocked at 2.5 GHz, three Cortex-A76 cores clocked at 2.2 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. With a smaller 6 nm lithography process, the Unisoc Tanggula T770 5G offers potentially improved power efficiency compared to the HiSilicon Kirin 970. It features an instruction set of ARMv8.2-A and a TDP of 5 watts. Similar to the Kirin 970, it also comes equipped with an NPU for neural processing tasks.
In summary, the HiSilicon Kirin 970 and the Unisoc Tanggula T770 5G processors both offer 8 CPU cores and support ARM architecture. While the Kirin 970 utilizes a combination of Cortex-A73 and Cortex-A53 cores, the Tanggula T770 5G employs a combination of Cortex-A76 and Cortex-A55 cores. The HiSilicon Kirin 970 has a larger lithography process at 10 nm and a higher number of transistors, while the Unisoc Tanggula T770 5G boasts a smaller 6 nm lithography process. The T770 5G also has a lower TDP of 5 watts, potentially indicating better power efficiency. Both processors feature NPUs for neural processing tasks, providing additional capabilities in artificial intelligence and machine learning applications.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 6 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 5 Watt |
Neural Processing | HiSilicon NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 32 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G57 MP6 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 750 MHz | 850 MHz |
Execution units | 12 | 6 |
Shaders | 192 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2160x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.5 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2017 September | 2021 February |
Partnumber | Hi3670 | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 710 vs MediaTek Dimensity 1000
2
MediaTek Dimensity 820 vs MediaTek Dimensity 1000 Plus
3
Qualcomm Snapdragon 670 vs Unisoc Tiger T310
4
Google Tensor G2 vs MediaTek Dimensity 1080
5
Samsung Exynos 1330 vs Qualcomm Snapdragon 8 Plus Gen 1
6
MediaTek Dimensity 1000L vs Qualcomm Snapdragon 870
7
MediaTek Dimensity 800U vs Samsung Exynos 9610
8
Samsung Exynos 7870 vs MediaTek Dimensity 720
9
MediaTek Helio G80 vs MediaTek Dimensity 6100 Plus
10
Samsung Exynos 9609 vs Apple A10X Fusion