HiSilicon Kirin 970 vs Unisoc Tanggula T770 5G

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When comparing the HiSilicon Kirin 970 and the Unisoc Tanggula T770 5G processors, several key specifications must be considered.

Starting with the HiSilicon Kirin 970, it features a total of 8 CPU cores. These cores are divided into two clusters, with four Cortex-A73 cores clocked at 2.4 GHz and four Cortex-A53 cores clocked at 1.8 GHz. The processor is built on a 10 nm lithography process and is equipped with an instruction set of ARMv8-A. Additionally, it boasts a significant number of transistors, totaling at 5500 million. The thermal design power (TDP) of the HiSilicon Kirin 970 is 9 watts, which indicates its power efficiency. It also comes equipped with HiSilicon's NPU for neural processing tasks.

Moving on to the Unisoc Tanggula T770 5G, this processor also boasts 8 CPU cores. It utilizes a more diverse architecture, consisting of one Cortex-A76 core clocked at 2.5 GHz, three Cortex-A76 cores clocked at 2.2 GHz, and four Cortex-A55 cores clocked at 2.0 GHz. With a smaller 6 nm lithography process, the Unisoc Tanggula T770 5G offers potentially improved power efficiency compared to the HiSilicon Kirin 970. It features an instruction set of ARMv8.2-A and a TDP of 5 watts. Similar to the Kirin 970, it also comes equipped with an NPU for neural processing tasks.

In summary, the HiSilicon Kirin 970 and the Unisoc Tanggula T770 5G processors both offer 8 CPU cores and support ARM architecture. While the Kirin 970 utilizes a combination of Cortex-A73 and Cortex-A53 cores, the Tanggula T770 5G employs a combination of Cortex-A76 and Cortex-A55 cores. The HiSilicon Kirin 970 has a larger lithography process at 10 nm and a higher number of transistors, while the Unisoc Tanggula T770 5G boasts a smaller 6 nm lithography process. The T770 5G also has a lower TDP of 5 watts, potentially indicating better power efficiency. Both processors feature NPUs for neural processing tasks, providing additional capabilities in artificial intelligence and machine learning applications.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
1x 2.5 GHz – Cortex-A76
3x 2.2 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 6 nm
Number of transistors 5500 million
TDP 9 Watt 5 Watt
Neural Processing HiSilicon NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 32 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G72 MP12 Mali-G57 MP6
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 850 MHz
Execution units 12 6
Shaders 192 96
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2160x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.7 Gbps
Peak Upload Speed 0.15 Gbps 1.5 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.0
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2017 September 2021 February
Partnumber Hi3670 T770, Tiger T7520
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
318577
Tanggula T770 5G
342190

GeekBench 6 Single-Core

Score
Kirin 970
389
Tanggula T770 5G
659

GeekBench 6 Multi-Core

Score
Kirin 970
1502
Tanggula T770 5G
2635