HiSilicon Kirin 970 vs MediaTek Dimensity 920

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The HiSilicon Kirin 970 and MediaTek Dimensity 920 are both powerful processors, but they have some key differences in their specifications.

In terms of CPU cores and architecture, the HiSilicon Kirin 970 features a combination of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 920 has 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores, but they differ in their architecture and clock speed.

The instruction set for the HiSilicon Kirin 970 is ARMv8-A, while the MediaTek Dimensity 920 uses ARMv8.2-A. This indicates that the Dimensity 920 supports a slightly more advanced instruction set.

In terms of lithography, the HiSilicon Kirin 970 is built on a 10 nm process, while the MediaTek Dimensity 920 utilizes a more advanced 6 nm process. A smaller lithography typically results in better power efficiency and improved performance.

The number of transistors in the HiSilicon Kirin 970 is 5500 million, whereas this information is not specified for the MediaTek Dimensity 920.

The thermal design power (TDP) for the HiSilicon Kirin 970 is 9 Watts, while the MediaTek Dimensity 920 has a slightly higher TDP of 10 Watts. This indicates that the Dimensity 920 may consume slightly more power than the Kirin 970.

Both processors have a neural processing unit (NPU) for artificial intelligence tasks. The HiSilicon Kirin 970 specifies the use of the HiSilicon NPU, while the MediaTek Dimensity 920 simply mentions an NPU without specifying the manufacturer.

In conclusion, while the HiSilicon Kirin 970 and MediaTek Dimensity 920 both offer powerful performance, the Dimensity 920 has certain advantages such as a more advanced lithography process and a slightly higher clock speed. However, it is important to consider other factors such as real-world performance, software optimization, and user experience in addition to the specifications when making a decision between these two processors.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
2x 2.5 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 6 nm
Number of transistors 5500 million
TDP 9 Watt 10 Watt
Neural Processing HiSilicon NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G72 MP12 Mali-G68 MP4
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 950 MHz
Execution units 12 4
Shaders 192 96
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2017 September 2021 Quarter 3
Partnumber Hi3670 MT6877T
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
318577
Dimensity 920
453634

GeekBench 6 Single-Core

Score
Kirin 970
389
Dimensity 920
780

GeekBench 6 Multi-Core

Score
Kirin 970
1502
Dimensity 920
2594