HiSilicon Kirin 970 vs MediaTek Dimensity 920
The HiSilicon Kirin 970 and MediaTek Dimensity 920 are both powerful processors, but they have some key differences in their specifications.
In terms of CPU cores and architecture, the HiSilicon Kirin 970 features a combination of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 920 has 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores, but they differ in their architecture and clock speed.
The instruction set for the HiSilicon Kirin 970 is ARMv8-A, while the MediaTek Dimensity 920 uses ARMv8.2-A. This indicates that the Dimensity 920 supports a slightly more advanced instruction set.
In terms of lithography, the HiSilicon Kirin 970 is built on a 10 nm process, while the MediaTek Dimensity 920 utilizes a more advanced 6 nm process. A smaller lithography typically results in better power efficiency and improved performance.
The number of transistors in the HiSilicon Kirin 970 is 5500 million, whereas this information is not specified for the MediaTek Dimensity 920.
The thermal design power (TDP) for the HiSilicon Kirin 970 is 9 Watts, while the MediaTek Dimensity 920 has a slightly higher TDP of 10 Watts. This indicates that the Dimensity 920 may consume slightly more power than the Kirin 970.
Both processors have a neural processing unit (NPU) for artificial intelligence tasks. The HiSilicon Kirin 970 specifies the use of the HiSilicon NPU, while the MediaTek Dimensity 920 simply mentions an NPU without specifying the manufacturer.
In conclusion, while the HiSilicon Kirin 970 and MediaTek Dimensity 920 both offer powerful performance, the Dimensity 920 has certain advantages such as a more advanced lithography process and a slightly higher clock speed. However, it is important to consider other factors such as real-world performance, software optimization, and user experience in addition to the specifications when making a decision between these two processors.
In terms of CPU cores and architecture, the HiSilicon Kirin 970 features a combination of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 920 has 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores, but they differ in their architecture and clock speed.
The instruction set for the HiSilicon Kirin 970 is ARMv8-A, while the MediaTek Dimensity 920 uses ARMv8.2-A. This indicates that the Dimensity 920 supports a slightly more advanced instruction set.
In terms of lithography, the HiSilicon Kirin 970 is built on a 10 nm process, while the MediaTek Dimensity 920 utilizes a more advanced 6 nm process. A smaller lithography typically results in better power efficiency and improved performance.
The number of transistors in the HiSilicon Kirin 970 is 5500 million, whereas this information is not specified for the MediaTek Dimensity 920.
The thermal design power (TDP) for the HiSilicon Kirin 970 is 9 Watts, while the MediaTek Dimensity 920 has a slightly higher TDP of 10 Watts. This indicates that the Dimensity 920 may consume slightly more power than the Kirin 970.
Both processors have a neural processing unit (NPU) for artificial intelligence tasks. The HiSilicon Kirin 970 specifies the use of the HiSilicon NPU, while the MediaTek Dimensity 920 simply mentions an NPU without specifying the manufacturer.
In conclusion, while the HiSilicon Kirin 970 and MediaTek Dimensity 920 both offer powerful performance, the Dimensity 920 has certain advantages such as a more advanced lithography process and a slightly higher clock speed. However, it is important to consider other factors such as real-world performance, software optimization, and user experience in addition to the specifications when making a decision between these two processors.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 6 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 10 Watt |
Neural Processing | HiSilicon NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G68 MP4 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 750 MHz | 950 MHz |
Execution units | 12 | 4 |
Shaders | 192 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2017 September | 2021 Quarter 3 |
Partnumber | Hi3670 | MT6877T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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