HiSilicon Kirin 970 vs MediaTek Dimensity 800U
The HiSilicon Kirin 970 and MediaTek Dimensity 800U are two processors with distinct specifications.
Starting with the HiSilicon Kirin 970, it features a 10 nm lithography and a total of 5500 million transistors. It boasts a CPU architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With 8 cores in total, this processor provides a balanced performance for a variety of tasks. The HiSilicon Kirin 970 also utilizes the ARMv8-A instruction set and offers a TDP of 9 Watt. Its standout feature lies in its neural processing capabilities, thanks to the HiSilicon NPU.
On the other hand, the MediaTek Dimensity 800U features a 7 nm lithography, offering a more advanced manufacturing process compared to the Kirin 970. Despite having the same number of cores as the Kirin 970, the Dimensity 800U employs a different CPU architecture. It combines 2x 2.4 GHz Cortex-A76 cores with 6x 2.0 GHz Cortex-A55 cores. This arrangement allows for optimized performance, as the more powerful cores handle demanding tasks while the efficiency cores handle simpler ones. The Dimensity 800U also supports the ARMv8.2-A instruction set and comes with an NPU for neural processing.
When comparing the two processors, it is evident that the Kirin 970 has a higher TDP at 9 Watts compared to the Dimensity 800U. This may indicate that the HiSilicon processor consumes more power but also potentially delivers better performance. Additionally, the Dimensity 800U's utilization of a 7 nm lithography suggests improved power efficiency compared to the Kirin 970's 10 nm lithography. Both processors offer neural processing capabilities, with the Kirin 970 featuring the HiSilicon NPU and the Dimensity 800U utilizing an NPU.
To summarize, while the HiSilicon Kirin 970 and MediaTek Dimensity 800U share similarities in terms of core count and neural processing features, they differ in CPU architecture, lithography, TDP, and instruction set support. It is important to consider these specifications when deciding which processor best suits your needs, whether it be for power-intensive tasks or power efficiency.
Starting with the HiSilicon Kirin 970, it features a 10 nm lithography and a total of 5500 million transistors. It boasts a CPU architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With 8 cores in total, this processor provides a balanced performance for a variety of tasks. The HiSilicon Kirin 970 also utilizes the ARMv8-A instruction set and offers a TDP of 9 Watt. Its standout feature lies in its neural processing capabilities, thanks to the HiSilicon NPU.
On the other hand, the MediaTek Dimensity 800U features a 7 nm lithography, offering a more advanced manufacturing process compared to the Kirin 970. Despite having the same number of cores as the Kirin 970, the Dimensity 800U employs a different CPU architecture. It combines 2x 2.4 GHz Cortex-A76 cores with 6x 2.0 GHz Cortex-A55 cores. This arrangement allows for optimized performance, as the more powerful cores handle demanding tasks while the efficiency cores handle simpler ones. The Dimensity 800U also supports the ARMv8.2-A instruction set and comes with an NPU for neural processing.
When comparing the two processors, it is evident that the Kirin 970 has a higher TDP at 9 Watts compared to the Dimensity 800U. This may indicate that the HiSilicon processor consumes more power but also potentially delivers better performance. Additionally, the Dimensity 800U's utilization of a 7 nm lithography suggests improved power efficiency compared to the Kirin 970's 10 nm lithography. Both processors offer neural processing capabilities, with the Kirin 970 featuring the HiSilicon NPU and the Dimensity 800U utilizing an NPU.
To summarize, while the HiSilicon Kirin 970 and MediaTek Dimensity 800U share similarities in terms of core count and neural processing features, they differ in CPU architecture, lithography, TDP, and instruction set support. It is important to consider these specifications when deciding which processor best suits your needs, whether it be for power-intensive tasks or power efficiency.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | |
Neural Processing | HiSilicon NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G57 MP3 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 750 MHz | 850 MHz |
Execution units | 12 | 3 |
Shaders | 192 | 48 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2017 September | 2020 Quarter 3 |
Partnumber | Hi3670 | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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