HiSilicon Kirin 970 vs MediaTek Dimensity 800U

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The HiSilicon Kirin 970 and MediaTek Dimensity 800U are two processors with distinct specifications.

Starting with the HiSilicon Kirin 970, it features a 10 nm lithography and a total of 5500 million transistors. It boasts a CPU architecture consisting of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With 8 cores in total, this processor provides a balanced performance for a variety of tasks. The HiSilicon Kirin 970 also utilizes the ARMv8-A instruction set and offers a TDP of 9 Watt. Its standout feature lies in its neural processing capabilities, thanks to the HiSilicon NPU.

On the other hand, the MediaTek Dimensity 800U features a 7 nm lithography, offering a more advanced manufacturing process compared to the Kirin 970. Despite having the same number of cores as the Kirin 970, the Dimensity 800U employs a different CPU architecture. It combines 2x 2.4 GHz Cortex-A76 cores with 6x 2.0 GHz Cortex-A55 cores. This arrangement allows for optimized performance, as the more powerful cores handle demanding tasks while the efficiency cores handle simpler ones. The Dimensity 800U also supports the ARMv8.2-A instruction set and comes with an NPU for neural processing.

When comparing the two processors, it is evident that the Kirin 970 has a higher TDP at 9 Watts compared to the Dimensity 800U. This may indicate that the HiSilicon processor consumes more power but also potentially delivers better performance. Additionally, the Dimensity 800U's utilization of a 7 nm lithography suggests improved power efficiency compared to the Kirin 970's 10 nm lithography. Both processors offer neural processing capabilities, with the Kirin 970 featuring the HiSilicon NPU and the Dimensity 800U utilizing an NPU.

To summarize, while the HiSilicon Kirin 970 and MediaTek Dimensity 800U share similarities in terms of core count and neural processing features, they differ in CPU architecture, lithography, TDP, and instruction set support. It is important to consider these specifications when deciding which processor best suits your needs, whether it be for power-intensive tasks or power efficiency.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 7 nm
Number of transistors 5500 million
TDP 9 Watt
Neural Processing HiSilicon NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G72 MP12 Mali-G57 MP3
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 850 MHz
Execution units 12 3
Shaders 192 48
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2017 September 2020 Quarter 3
Partnumber Hi3670 MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
318577
Dimensity 800U
401197

GeekBench 6 Single-Core

Score
Kirin 970
389
Dimensity 800U
614

GeekBench 6 Multi-Core

Score
Kirin 970
1502
Dimensity 800U
1821